Patents by Inventor Sang Yeun Lee

Sang Yeun Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8139146
    Abstract: An a camera module includes: a lens barrel housing lenses; a housing formed integrally with the lens barrel; and a substrate unit having a top surface bonded to the housing with an adhesive and including pass portions through which an ascending and descending unit passes, the ascending and descending unit vertically moving the housing to perform focusing when the housing is bonded to the substrate unit.
    Type: Grant
    Filed: December 29, 2009
    Date of Patent: March 20, 2012
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventor: Sang Yeun Lee
  • Publication number: 20110096224
    Abstract: There is provided a camera module package including: a lens barrel having a lens deposited therein; a housing having the lens barrel installed therein; a board bonded to the housing and having an image sensor provided on one surface thereof to coincide with an optical axis of the lens; and a shield can covering the outside of the housing and having a ground portion. The ground portion is protruded outwards from an outer side surface of the shield can and contacts an inner side surface of a socket when the shield can is inserted into the socket.
    Type: Application
    Filed: July 2, 2010
    Publication date: April 28, 2011
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Sang Yeun Lee
  • Publication number: 20110063493
    Abstract: An a camera module includes: a lens barrel housing lenses; a housing formed integrally with the lens barrel; and a substrate unit having a top surface bonded to the housing with an adhesive and including pass portions through which an ascending and descending unit passes, the ascending and descending unit vertically moving the housing to perform focusing when the housing is bonded to the substrate unit.
    Type: Application
    Filed: December 29, 2009
    Publication date: March 17, 2011
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Sang Yeun Lee