Patents by Inventor Sang-Yi LIN

Sang-Yi LIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9658250
    Abstract: A vertical probe device includes upper and lower dies having upper and lower installing holes, probe needles, a lower positioning film disposed between the dies and having lower positioning holes, and a dividing film disposed between the lower positioning film and the upper die and having through holes and dividing ribs. The needle tail is individually inserted through a lower installing hole. The needle head is individually inserted through an upper installing hole. Each lower positioning hole is located under at least one dividing rib and capable of accommodating a plurality of needle heads. Each needle head is inserted through a lower positioning hole and a through hole. Therefore, the films are easily installed, free of irregular hole but passable by narrow needle bodies, and facilitate easy and fast installation and less damage to the probe needles that are well positioned, and facilitate easy installation of the upper die.
    Type: Grant
    Filed: December 22, 2015
    Date of Patent: May 23, 2017
    Assignee: MPI CORPORATION
    Inventors: Hsiang-Sheng Hsieh, Sang-Yi Lin, Chih-Hao Hsu
  • Publication number: 20170059615
    Abstract: A probe head includes a first guiding board, a second guiding board, a spacer, a positioning assembly and probes. The second guiding board is stacked over the first guiding board, in which an accommodating space is formed between the first guiding board and the second guiding board. The spacer is disposed on the second guiding board and is located in the accommodating space. The positioning assembly is disposed aid supported on the second guiding board and is movably retained between the spacer and the first guiding board, and the positioning assembly includes a supporting frame and a film. The supporting frame includes at least one rib portion. The film is fixed to the supporting frame. The probes pass through the first guiding board, the second guiding board, and the film.
    Type: Application
    Filed: June 24, 2016
    Publication date: March 2, 2017
    Inventors: Hsiang-Sheng HSIEH, Sang-Yi LIN, Chih-Hao HSU
  • Publication number: 20160223590
    Abstract: A probe head for a vertical probe card includes an upper guider plate, a lower guider plate and a plurality of probes. The upper guider plate has a plurality of upper through holes. The lower guider plate is located by one side of the upper guider plate and has a plurality of lower through holes. Each of the probes is positioned through one of the upper through holes of the upper guider plate and one of the lower through holes of the lower guider plate. The upper guider plate has a light transmittance of at least 75%, and is made of a material having a Moh's hardness of at least 5.
    Type: Application
    Filed: February 1, 2016
    Publication date: August 4, 2016
    Inventors: Chih-Hao HSU, Sang-Yi LIN, Yung-Hsin CHEN
  • Publication number: 20160187384
    Abstract: A vertical probe device includes upper and lower dies having upper and lower installing holes, probe needles, a lower positioning film disposed between the dies and having lower positioning holes, and a dividing film disposed between the lower positioning film and the upper die and having through holes and dividing ribs. The needle tail is individually inserted through a lower installing hole. The needle head is individually inserted through an upper installing hole. Each lower positioning hole is located under at least one dividing rib and capable of accommodating a plurality of needle heads. Each needle head is inserted through a lower positioning hole and a through hole. Therefore, the films are easily installed, free of irregular hole but passable by narrow needle bodies, and facilitate easy and fast installation and less damage to the probe needles that are well positioned, and facilitate easy installation of the upper die.
    Type: Application
    Filed: December 22, 2015
    Publication date: June 30, 2016
    Inventors: Hsiang-Sheng HSIEH, Sang-Yi LIN, Chih-Hao HSU