Patents by Inventor Sang Youp HWANG

Sang Youp HWANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11883795
    Abstract: Provided are an ammonia decomposition catalyst and a method of decomposing ammonia. The ammonia decomposition catalyst includes an activated carbon carrier and a metal loaded on the carrier, wherein a Brunauer, Emmett and Teller (BET) specific surface area of the carrier is about 850 m2/g or more, and the metal includes cerium (Ce).
    Type: Grant
    Filed: April 5, 2022
    Date of Patent: January 30, 2024
    Assignees: SAMSUNG ENGINEERING CO., LTD., EST CO., LTD.
    Inventors: Jae Rim Yi, Sung Soo Lee, Sung Hun Hong, Jae Hun Hong, Sang Youp Hwang, Jae Kyeong Yoo, Sung Eun Jeoung, Jae Hoon Choi, Sang Bock Lee, Jung Jae Kim
  • Publication number: 20220323940
    Abstract: Provided are an ammonia decomposition catalyst and a method of decomposing ammonia. The ammonia decomposition catalyst includes an activated carbon carrier and a metal loaded on the carrier, wherein a Brunauer, Emmett and Teller (BET) specific surface area of the carrier is about 850 m2/g or more, and the metal includes cerium (Ce).
    Type: Application
    Filed: April 5, 2022
    Publication date: October 13, 2022
    Applicants: SAMSUNG ENGINEERING CO., LTD., EST CO., LTD.
    Inventors: Jae Rim YI, Sung Soo LEE, Sung Hun HONG, Jae Hun HONG, Sang Youp HWANG, Jae Kyeong YOO, Sung Eun JEOUNG, Jae Hoon CHOI, Sang Bock LEE, Jung Jae KIM
  • Publication number: 20120282446
    Abstract: Provided is a preparation method for carbon materials, carbon materials prepared from the same, and a product including the carbon materials, in which the preparation method including forming a polymer layer containing a polymer, stabilizing the polymer layer to form a cyclized aromatic structure of carbon atoms in the polymer, and carbonizing the stabilized polymer layer.
    Type: Application
    Filed: November 9, 2011
    Publication date: November 8, 2012
    Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Han Ik JO, Sung Ho LEE, Bon Cheol KU, Jun Kyung KIM, Tae Wook KIM, Sang Youp HWANG