Patents by Inventor Sang Yul Lee

Sang Yul Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10477673
    Abstract: A compartment EMI shield for use inside of a system module package is provided that comprises at least a first set of electrically-conductive wires that surrounds and extends over circuitry of the module package. Adjacent wires of the first set are spaced apart from one another by a predetermined distance selected to ensure that the compartment EMI shield attenuates a frequency or frequency range of interest. First and second ends of each of the wires are connected to an electrical ground structure. A length of each wire that is located in between the first and second ends of the respective wire extends above the circuitry and is spaced apart from the components of the circuitry so as not to be in contact with the components of the circuitry.
    Type: Grant
    Filed: March 20, 2019
    Date of Patent: November 12, 2019
    Assignee: Avago Technologies International Sales Pte. Limited
    Inventors: Deog-Soon Choi, Chang-Yul Cheon, Sang-Hwa Jung, Sung-Phyo Lim, Ah Ron Lee
  • Publication number: 20190257681
    Abstract: According to an exemplary embodiment, a microneedle probe device for measuring a sap flow rate of a plant includes: a substrate, of which at least a part is inserted into a plant, and a thickness and a width are microscales; a single metal wire provided on the substrate; a power source, which applies a current to the metal wire for a predetermined time and heats the metal wire; and a processor, which calculates a flow rate of sap through a movement of heat generated in the metal wire according to a flow of the sap within the plant.
    Type: Application
    Filed: June 14, 2017
    Publication date: August 22, 2019
    Inventors: Jung Hoon Lee, Sang Woong Baek, Eun Yong Jeon, Seung Yul Choi, Kyoung Sub Park, Joon Kook Kwon, Kyung Hwan Yeo, In Ho Yu, Jae Han Lee
  • Publication number: 20190246492
    Abstract: A compartment EMI shield for use inside of a system module package is provided that comprises at least a first set of electrically-conductive wires that surrounds and extends over circuitry of the module package. Adjacent wires of the first set are spaced apart from one another by a predetermined distance selected to ensure that the compartment EMI shield attenuates a frequency or frequency range of interest. First and second ends of each of the wires are connected to an electrical ground structure. A length of each wire that is located in between the first and second ends of the respective wire extends above the circuitry and is spaced apart from the components of the circuitry so as not to be in contact with the components of the circuitry.
    Type: Application
    Filed: March 20, 2019
    Publication date: August 8, 2019
    Inventors: Deog-Soon Choi, Chang-Yul Cheon, Sang-Hwa Jung, Sung-Phyo Lim, Ah Ron Lee
  • Patent number: 10356916
    Abstract: A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes an inner layer including at least one insulating layer and wiring parts, and outer layers disposed on opposing sides of the inner layer, the outer layers including reinforcing layers and wiring parts, the reinforcing layers having a greater degree of rigidity than the insulating layer.
    Type: Grant
    Filed: April 29, 2016
    Date of Patent: July 16, 2019
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Han Kim, Sang Yul Ha, Sung Han Kim, Kyung Ho Lee, Seok Hwan Ahn, Myung Sam Kang
  • Patent number: 10352580
    Abstract: An air conditioner includes a housing having a suction port and a discharge port, a main fan configured to draw air into the housing through the suction port and discharge air from the housing through the discharge port, an auxiliary fan configured to draw, into the housing, air discharged by the main fan and a controller configured to control a rotational speed of the auxiliary fan to change a direction in which air is discharged from the housing.
    Type: Grant
    Filed: May 3, 2016
    Date of Patent: July 16, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Young-Jin Kim, Ju-Hyun Kang, Young-Jae Kim, Byung Yul So, Yong-Gak Kim, In-Jung Baek, Na Yeong Byeon, Moo Gyo Seo, Hyeong Joon Seo, Seung Cheon Yu, Sang Woo Lee, Hyo Kyu Lee, Jin Ho Lim, Min-Gi Cho, Hyeong Kyu Cho, Jun Hwang, Do Yeon Kim, Hyun Ah Kim, Yong Ho Seo, Woo Seog Song, Hyun-Joo Song, Young Sun Shin, Joon-Ho Yoon, Bu Youn Lee, Jung Dae Lee, Chang Seon Lee, Min Gu Jeon, Hee Jae Jeong
  • Patent number: 10304990
    Abstract: A method of fabricating a semiconductor light emitting device includes forming a first conductivity type semiconductor layer, forming an active layer by alternately forming a plurality of quantum well layers and a plurality of quantum barrier layers on the first conductivity type semiconductor layer, and forming a second conductivity type semiconductor layer on the active layer. The plurality of quantum barrier layers include at least one first quantum barrier layer adjacent to the first conductivity type semiconductor layer and at least one second quantum barrier layer adjacent to the second conductivity type semiconductor layer. The forming of the active layer includes allowing the at least one first quantum barrier layer to be grown at a first temperature and allowing the at least one second quantum barrier layer to be grown at a second temperature lower than the first temperature.
    Type: Grant
    Filed: November 2, 2016
    Date of Patent: May 28, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sang Heon Han, Dong Yul Lee, Seung Hyun Kim, Jang Mi Kim, Suk Ho Yoon, Sang Jun Lee
  • Publication number: 20120153473
    Abstract: Disclosed herein is a lead pin for a package substrate including a connection pin, and a head part including a flange part formed at one end of the connection pin and having one surface bonded to the connection pin and a flat part formed at the other surface of the flange part and having at least one groove formed along an outer circumference thereof. According to the present invention, the grooves are formed along the outer circumference of the flat part of the head part of the lead pin to increase a bonding area, thereby making it possible to increase bonding strength of the lead pin.
    Type: Application
    Filed: March 11, 2011
    Publication date: June 21, 2012
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Sang Yul LEE
  • Publication number: 20090038562
    Abstract: Disclosed is a cooling system for a vehicle, in which coolant coolant, a blend of an antifreezing solution and water flowed into a radiator generates turbulent flow when a vehicle is in a state of a critical driving mode of a vehicle for example, a hill-climbing mode, thereby enhancing heat radiating performance and reducing pressure drop amount at the same time.
    Type: Application
    Filed: August 12, 2008
    Publication date: February 12, 2009
    Applicant: HALLA CLIMATE CONTROL CORP.
    Inventors: Ho Chang Sim, Sun An Jeong, Gil Woong Jun, Byoung Sun Cho, Sang Yul Lee, Kwang Yong Jung
  • Patent number: 6062303
    Abstract: A multiflow type condenser for an automobile air conditioner comprising: a pair of header pipes disposed in parallel with each other and arranged to have an inlet and an outlet; a pluratlity of flat tubes each connected to said header pipes at opposite ends thereof, each of said flat tubes having a plurality of inside fluid paths, a hydraulic diameter of said inside fluid paths being in the range of about 1 to 1.
    Type: Grant
    Filed: September 25, 1998
    Date of Patent: May 16, 2000
    Assignee: Halla Climate Control Corp.
    Inventors: Yong Gwi Ahn, Sang Yul Lee, Seung Hwan Kim, Sang Ok Lee, Kwang Heon Oh, Yong Ho Kim