Patents by Inventor Sang-Bo Kim

Sang-Bo Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230295806
    Abstract: A gas injection apparatus includes a supply block including central gas ports configured to supply a process gas provided from a gas supply source; a diffusion cover under the supply block and including a branch duct which is connected to the central gas ports; a plurality of spray nozzles on a lower surface of the diffusion cover and connected to the branch duct, the plurality of spray nozzles configured to spray the process gas; and a shower head under the plurality of spray nozzles and including a plurality of spray holes vertically passing through the shower head, the plurality of spray holes configured to evenly spray the process gas sprayed by the plurality of spray nozzles. The diffusion cover further includes a concave portion at an upper surface thereof, the concave portion facing the central gas ports and concaved downward.
    Type: Application
    Filed: March 14, 2023
    Publication date: September 21, 2023
    Applicant: HANWHA CORPORATION
    Inventors: Sang Bo KIM, Su Woong KIM, Seung Dae CHOI
  • Publication number: 20230212751
    Abstract: A thin film deposition apparatus includes: a chamber configured to process a plurality of substrates; a plurality of heater members disposed to correspond to the substrates to heat the substrates, respectively; a plurality of lift pins configured to support lower surfaces of the substrates while elevating through the heater members, respectively; a plurality of heat shield plates, having a heat shield function between the heater members, on which lower ends of the lift pins are configured to be seated; and a plurality of support columns coupled with and supporting the heater members.
    Type: Application
    Filed: December 30, 2022
    Publication date: July 6, 2023
    Applicant: HANWHA CORPORATION
    Inventors: Ram WOO, Sang Bo KIM, Jin Hwan LEE, Min Ho CHEON, Seung Jun LEE
  • Publication number: 20230212750
    Abstract: A thin film deposition apparatus includes: a chamber configured to process a plurality of substrates; a plurality of heater members disposed to correspond to the substrates to heat the substrates; a plurality of lift pins configured to be elevated through the heater members and support lower surfaces of the substrates; a plurality of support plates on which lower ends of the lift pins are configured to be seated; a plurality of support columns coupled with and supporting the heater members; and a plurality of spray ports configured to supply a process gas to the substrates, wherein the support plates are mounted on a plurality of seats formed on at least one side of the chamber, and configured to be elevated together with the heater members when the heater members are elevated.
    Type: Application
    Filed: December 30, 2022
    Publication date: July 6, 2023
    Applicant: HANWHA CORPORATION
    Inventors: Ram WOO, Seung Jun LEE, Sang Yeop Kim, Jin Hwan LEE, Sang Bo KIM
  • Publication number: 20220399192
    Abstract: A substrate processing device according to an embodiment of the present invention includes a disk part disposed in a chamber in which a heating means is provided, and a pocket part installed on one surface of the disk part and on which a substrate is seated. A heat hole through which heat generated by the heating means passes may be formed on an installation surface of the disk part on which the pocket part is installed, or a gear hole through which the heat of the heating means passes may be formed in a pocket gear facing the disk part.
    Type: Application
    Filed: November 22, 2019
    Publication date: December 15, 2022
    Inventors: Su Woong KIM, Dong Won SEO, Jae Wook CHOI, Sang Bo KIM, Sang Yoon MOON, Han Young KONG, Seung Dae CHOI, Baek Ju LEE, Jae Soon HWANG
  • Patent number: 10173587
    Abstract: A brake light sensor module includes: a retainer which is provided to move together with an operation element of a master cylinder in response to a depression of a brake pedal; an operation rod which is connected to the retainer so as to move together with the retainer; an elastic member which is installed in the master cylinder; a signal transmitting element which is installed in the master cylinder, one end of the signal transmitting element being elastically supported by the elastic member, and the other end of the signal transmitting element being supported by the operation rod; and a sensor which is installed in the master cylinder so as to be operated by the signal transmitting element.
    Type: Grant
    Filed: February 26, 2015
    Date of Patent: January 8, 2019
    Assignee: erae AMS Co., Ltd.
    Inventors: Chul-Kyun Roh, Sang-Bo Kim, Dong-Han Han
  • Publication number: 20170057406
    Abstract: A brake light sensor module includes: a retainer which is provided to move together with an operation element of a master cylinder in response to a depression of a brake pedal; an operation rod which is connected to the retainer so as to move together with the retainer; an elastic member which is installed in the master cylinder; a signal transmitting element which is installed in the master cylinder, one end of the signal transmitting element being elastically supported by the elastic member, and the other end of the signal transmitting element being supported by the operation rod; and a sensor which is installed in the master cylinder so as to be operated by the signal transmitting element.
    Type: Application
    Filed: February 26, 2015
    Publication date: March 2, 2017
    Inventors: Chul-Kyun ROH, Sang-Bo KIM, Dong-Han HAN
  • Patent number: 8646268
    Abstract: Disclosed herein is a master cylinder for a vehicle. The master cylinder includes a housing, a piston, inlet ports and a seal. The housing has therein a liquid pressure chamber to contain oil. The piston reciprocates in the liquid pressure chamber to control the pressure in the liquid pressure chamber. A front end of the piston has a stepped structure. The inlet ports are provided in the housing so that oil is supplied into the liquid pressure chamber through the inlet ports. The seal is seated into a seating depression which is formed in the inner surface of the housing. The seal opens or closes a flow path of the oil depending on whether the seal is brought into contact with the piston. The oil flows into the liquid pressure chamber along the stepped outer surface of the piston through a space defined between the piston and the seal.
    Type: Grant
    Filed: January 22, 2009
    Date of Patent: February 11, 2014
    Assignee: Korea Delphi Automotive Systems Corporation
    Inventors: Young Taek Kim, Sang Bo Kim, Jong Dae Weon, Tae Jun Ha
  • Publication number: 20100287931
    Abstract: Disclosed herein is a master cylinder for a vehicle. The master cylinder includes a housing, a piston, inlet ports and a seal. The housing has therein a liquid pressure chamber to contain oil. The piston reciprocates in the liquid pressure chamber to control the pressure in the liquid pressure chamber. A front end of the piston has a stepped structure. The inlet ports are provided in the housing so that oil is supplied into the liquid pressure chamber through the inlet ports. The seal is seated into a seating depression which is formed in the inner surface of the housing. The seal opens or closes a flow path of the oil depending on whether the seal is brought into contact with the piston. The oil flows into the liquid pressure chamber along the stepped outer surface of the piston through a space defined between the piston and the seal.
    Type: Application
    Filed: January 22, 2009
    Publication date: November 18, 2010
    Applicant: Korea Delphi Automotive Systems Corporation
    Inventors: Young Taek Kim, Sang Bo Kim, Jong Dae Weon, Tae Jun Ha
  • Patent number: 7447040
    Abstract: Provided is a flexible printed circuit board (FPCB) including a circuit connector connected to a circuit board connector of a printed circuit board (PCB) for electronic equipment. A first compression part and a second compression part are included in the circuit connector, and a folding part is provided at a first plating interface between the first compression part and the second compression part such that a second plating interface, instead of a first plating interface of the first compression part and the second compression part, is folded by a force generated when the circuit connector is connected to the circuit board connector.
    Type: Grant
    Filed: February 1, 2006
    Date of Patent: November 4, 2008
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Sang-Bo Kim
  • Publication number: 20060285302
    Abstract: Provided is a flexible printed circuit board (FPCB) including a circuit connector connected to a circuit board connector of a printed circuit board (PCB) for electronic equipment. A first compression unit and a second compression unit are included in the circuit connector, and a folding unit is provided at an interface between the first compression unit and the second compression unit such that the folding unit, instead of a plating interface of the first compression unit and the second compression unit, is folded by a force generated when the circuit connector is connected to the circuit board connector.
    Type: Application
    Filed: February 1, 2006
    Publication date: December 21, 2006
    Inventor: Sang-Bo Kim