Patents by Inventor Sang-Boo KANG

Sang-Boo KANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus for clamping a probe card and probe card including the same
    Patent number: 10295564
    Abstract: An apparatus for clamping a probe card may include a body portion, an inner clamping portion and a plurality of outer clamping portions. The body portion may be arranged between a printed circuit board (PCB) of the probe card and a test head. The inner clamping portion may be integrally formed with an upper surface of the body portion. The inner clamping portion may be configured to affix a central portion of the PCB to the test head. The outer clamping portions may be integrally formed with side surfaces of the body portion. The outer clamping portions may be configured to affix a portion surrounding the central portion of the PCB to the test head. Thus, a contact area between the clamping apparatus and the PCB may be increased.
    Type: Grant
    Filed: January 17, 2017
    Date of Patent: May 21, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sung-Yong Park, Sang-Boo Kang, Jae-Geun Kim, Sung-Hyup Kim, Jeong-Min Na, Jae-Hyoung Park, Sang-Kyu Yoo, Jae-Hoon Joo
  • APPARATUS FOR CLAMPING A PROBE CARD AND PROBE CARD INCLUDING THE SAME
    Publication number: 20180017595
    Abstract: An apparatus for clamping a probe card may include a body portion, an inner clamping portion and a plurality of outer clamping portions. The body portion may be arranged between a printed circuit board (PCB) of the probe card and a test head. The inner clamping portion may be integrally formed with an upper surface of the body portion. The inner clamping portion may be configured to affix a central portion of the PCB to the test head. The outer clamping portions may be integrally formed with side surfaces of the body portion. The outer clamping portions may be configured to affix a portion surrounding the central portion of the PCB to the test head. Thus, a contact area between the clamping apparatus and the PCB may be increased.
    Type: Application
    Filed: January 17, 2017
    Publication date: January 18, 2018
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Sung-Yong PARK, Sang-Boo KANG, Jae-Geun KIM, Sung-Hyup KIM, Jeong-Min NA, Jae-Hyoung PARK, Sang-Kyu YOO, Jae-Hoon JOO
  • Probing method, probe card for performing the method, and probing apparatus including the probe card
    Patent number: 9599663
    Abstract: A probe method includes setting an allowable temperature range, the allowable temperature range including a test temperature and ensuring contact between a pad of a circuit substrate and a needle of a probe card, providing the probe card with a temperature within the allowable temperature range, contacting the needle of the probe card to the pad of the circuit substrate, and supplying a test current to the pad through the needle to test the circuit substrate.
    Type: Grant
    Filed: November 21, 2013
    Date of Patent: March 21, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sang-Boo Kang, Ki-Sub Lim
  • Methods and systems for cleaning needles of a probe card
    Patent number: 9322849
    Abstract: A method of cleaning needles of a probe card in a test system includes mounting the probe card, which has a plurality of device under tests (DUTs) and needles, in a card mounting part. The DUTs and needles are scanned using a camera positioned in the test system to provide a scan result. A laser beam is focused on at least one of the needles based on the scan result and the laser beam is irradiated on the at least one of the needles to clean the at least one of the needles.
    Type: Grant
    Filed: January 24, 2013
    Date of Patent: April 26, 2016
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Do-Yun Kim, In-Seok Hwang, Sang-Boo Kang
  • PROBING METHOD, PROBE CARD FOR PERFORMING THE METHOD, AND PROBING APPARATUS INCLUDING THE PROBE CARD
    Publication number: 20140253154
    Abstract: A probe method includes setting an allowable temperature range, the allowable temperature range including a test temperature and ensuring contact between a pad of a circuit substrate and a needle of a probe card, providing the probe card with a temperature within the allowable temperature range, contacting the needle of the probe card to the pad of the circuit substrate, and supplying a test current to the pad through the needle to test the circuit substrate.
    Type: Application
    Filed: November 21, 2013
    Publication date: September 11, 2014
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sang-Boo KANG, Ki-Sub LIM