Abstract: A method of fabricating a printed circuit film including the steps of preparing a base film, and a plurality of lead wires disposed on the base film, the plurality of lead wires spaced apart from each other in a first direction and extending in a second direction intersecting the first direction, and forming a bonding member including a conductive member disposed to overlap a central portion of each of the plurality of lead wires, a first non-conductive member disposed to overlap a first portion of the plurality of lead wires in the second direction, and a second non-conductive member disposed to overlap a second portion of the plurality of lead wires in the second direction.

Abstract: A printed circuit film includes: a base film including a first film portion extending in a first direction, a second film portion extending in the first direction, and a third film portion extending in the first direction; a plurality of lead wires extending in the second direction and disposed on the first, second, and third film portions, the plurality of lead wires being spaced apart from each other in the first direction; and a bonding member including: a conductive member disposed to overlap the plurality of lead wires on the first film portion; a first non-conductive member disposed to overlap the plurality of lead wires and the second film portion; and a second non-conductive member disposed to overlap the plurality of lead wires and the third film portion, wherein the conductive member is disposed between the first non-conductive member and the second non-conductive member in the second direction.

Abstract: A display device includes a display panel including display pads, display connection pads disposed on a side surface of the display panel and connected to the display pads, a touch member including touch pads disposed on a display surface perpendicular to the side surface of the display panel, and touch connection pads overlapping a top surface of the touch member and the side surface of the display panel and connected to the touch pads. The side surface of the display panel includes a first area overlapping the display connection pads, a second area overlapping the touch connection pads, and a third area which does not overlap the display connection pads and does not overlap the touch connection pads. The first area, the second area, and the third area are located on a same plane.

Abstract: A display device includes a pixel array disposed on a base substrate, a side terminal electrically connected to the pixel array, a connection pad including a first side surface contacting a side surface of the side terminal, and a driving device bonding to a second side surface of the connection pad, where the second side surface is opposite to the first side surface. The side terminal includes a resistance-reducing layer and an upper conductive layer, the resistance-reducing layer includes a first conductive material, the upper conductive layer is disposed on the resistance-reducing layer and includes a second conductive material having an oxidation resistance greater than the first conductive material. A portion of the upper conductive layer is disposed between the connection pad and the resistance-reducing layer such that the resistance-reducing layer is spaced apart from the connection pad.

Abstract: A display device includes a display panel including display pads, display connection pads disposed on a side surface of the display panel and connected to the display pads, a touch member including touch pads disposed on a display surface perpendicular to the side surface of the display panel, and touch connection pads overlapping a top surface of the touch member and the side surface of the display panel and connected to the touch pads. The side surface of the display panel includes a first area overlapping the display connection pads, a second area overlapping the touch connection pads, and a third area which does not overlap the display connection pads and does not overlap the touch connection pads. The first area, the second area, and the third area are located on a same plane.

Abstract: A display device includes a display panel including display pads, display connection pads disposed on a side surface of the display panel and connected to the display pads, a touch member including touch pads disposed on a display surface perpendicular to the side surface of the display panel, and touch connection pads overlapping a top surface of the touch member and the side surface of the display panel and connected to the touch pads. The side surface of the display panel includes a first area overlapping the display connection pads, a second area overlapping the touch connection pads, and a third area which does not overlap the display connection pads and does not overlap the touch connection pads. The first area, the second area, and the third area are located on a same plane.

Abstract: A display device includes a display panel including display pads, display connection pads disposed on a side surface of the display panel and connected to the display pads, a touch member including touch pads disposed on a display surface perpendicular to the side surface of the display panel, and touch connection pads overlapping a top surface of the touch member and the side surface of the display panel and connected to the touch pads. The side surface of the display panel includes a first area overlapping the display connection pads, a second area overlapping the touch connection pads, and a third area which does not overlap the display connection pads and does not overlap the touch connection pads. The first area, the second area, and the third area are located on a same plane.

Abstract: A printed circuit film includes: a base film including a first film portion extending in a first direction, a second film portion extending in the first direction, and a third film portion extending in the first direction; a plurality of lead wires extending in the second direction and disposed on the first, second, and third film portions, the plurality of lead wires being spaced apart from each other in the first direction; and a bonding member including: a conductive member disposed to overlap the plurality of lead wires on the first film portion; a first non-conductive member disposed to overlap the plurality of lead wires and the second film portion; and a second non-conductive member disposed to overlap the plurality of lead wires and the third film portion, wherein the conductive member is disposed between the first non-conductive member and the second non-conductive member in the second direction.

Abstract: A display device includes a pixel array disposed on a base substrate, a side terminal electrically connected to the pixel array, a connection pad including a first side surface contacting a side surface of the side terminal, and a driving device bonding to a second side surface of the connection pad, where the second side surface is opposite to the first side surface. The side terminal includes a resistance-reducing layer and an upper conductive layer, the resistance-reducing layer includes a first conductive material, the upper conductive layer is disposed on the resistance-reducing layer and includes a second conductive material having an oxidation resistance greater than the first conductive material. A portion of the upper conductive layer is disposed between the connection pad and the resistance-reducing layer such that the resistance-reducing layer is spaced apart from the connection pad.

Abstract: A display device includes: a first layer including a pixel array disposed on a base substrate, a side terminal disposed on the base substrate, and a transfer wiring electrically connected to the side terminal and the pixel array; a second layer coupled with the first layer; a seal disposed between the first layer and the second layer and surrounding the pixel array; a filler, spaced apart from the seal, overlapping at least a portion of the side terminal and filling a space between the first layer and the second layer; and a conductive connection pad disposed on a side surface of the first layer and contacting the side terminal.

Abstract: A backlight unit that may be used with a liquid crystal display is presented. The backlight unit includes: a bottom chassis; a light source disposed at an edge of the bottom chassis; a light-converting member disposed on the light source and including quantum dots for changing a wavelength of light emitted from the light source; and a light guide disposed on the bottom chassis adjacent to the light-converting member and positioned to receive light emitted from the light-converting member.

Abstract: A light-emitting diode (LED) package and a method of manufacturing the same are provided. The LED package includes a package mold, an LED chip located on a surface of the package mold, and a wavelength converter located on the surface of the package mold and separated from the LED chip. The wavelength converter includes a first barrier layer located on the surface of the package mold, a wavelength conversion layer located on the first barrier layer, and a second barrier layer located on the wavelength conversion layer.

Abstract: A backlight unit that may be used with a liquid crystal display is presented. The backlight unit includes: a bottom chassis; a light source disposed at an edge of the bottom chassis; a light-converting member disposed on the light source and including quantum dots for changing a wavelength of light emitted from the light source; and a light guide disposed on the bottom chassis adjacent to the light-converting member and positioned to receive light emitted from the light-converting member.

Abstract: A quantum dot container may include a body that has a cavity and a hole. The hole may extend from the cavity to an outer surface of the body. The quantum dot container may further include a phosphor disposed inside the cavity. The quantum dot container may further include a sealing material disposed inside the hole.

Abstract: A light-emitting diode (LED) package and a method of manufacturing the same are provided. The LED package includes a package mold, an LED chip located on a surface of the package mold, and a wavelength converter located on the surface of the package mold and separated from the LED chip. The wavelength converter includes a first barrier layer located on the surface of the package mold, a wavelength conversion layer located on the first barrier layer, and a second barrier layer located on the wavelength conversion layer.

Abstract: A backlight assembly includes a light source portion configured to emit light and a wavelength conversion member disposed on an upper portion of the light source portion. The wavelength conversion member is configured to convert a wavelength of the light emitted from the light source portion. A light guide plate is disposed on a side portion of the wavelength conversion member. The light guide plate is configured to receive wavelength-converted light from the wavelength conversion member.

Abstract: A light emitting lamp, a backlight assembly and a display device including the same are provided. The light emitting lamp includes a lamp tube longitudinally extended along an extension line, and a plurality of set electrodes disposed on a periphery of the lamp tube and along the extension line. The periphery of the lamp tube is divided into a first region and a second region by a plane including the extension line, and each of the set electrodes includes a first electrode disposed on the first region and a second electrode disposed on the second region.

Abstract: In a machine-implemented method of local dimming a light source of a light source block for driving the light source block to provide a plurality of image regions with light, duty ratios of a first light source and a second light source adjacent to the first light source are initially determined by using a first target luminance value of a first image region closest to the first light source and a second target luminance value of a second image region closest to the second light source. The initially determined duty ratios are compensated by using a target luminance value of a remaining image region excluding the first and second image regions among the image regions receiving the light generated from the first and second first light sources. The first and second first light sources are driven by using the compensated duty ratios.

Abstract: A lamp according to one or more embodiments includes a tube which forms a light-emitting space, an electrode main body which is disposed in the tube, and an emitter surface metal layer which includes an alkali metal oxide and/or an alkaline earth metal oxide, and covers the electrode main body. The emitter surface metal layer may include cesium (Cs) and may further include at least one selected from the group consisting of beryllium oxide (BeO), magnesium oxide (MgO), calcium oxide (CaO), strontium oxide (SrO), barium oxide (BaO), cesium oxide (CsO) and radium oxide (RaO). Therefore, discharge may be easily activated because of a high secondary electron emission coefficient. Thus, a light-emitting efficiency may be enhanced and dark start characteristics may be improved.

Abstract: A fluorescent lamp includes a lamp body, a fluorescent layer and a discharge electrode. The lamp body has a discharge space in which ultraviolet light is generated. The fluorescent layer is formed on an inner surface of the lamp body to change the ultraviolet light into visible light. The discharge electrode is on an end portion of the lamp body to apply a voltage to the discharge space. A ratio of intensities of the visible light at wavelengths of about 545 nm and about 516 nm is about 1.32:1 to about 1.71:1. Therefore, color reproducibility and luminance may be improved.