Abstract: The encapsulant film composition includes an ethylene/alpha-olefin copolymer and porous silica and has excellent compatibility with a crosslinking additive. The encapsulant film composition has a ratio of an Si—O band integral value to a C—H band integral value of from 3 to 70. When an encapsulant film is produced using the encapsulant film composition, the impregnation time of an ethylene/alpha-olefin copolymer is reduced so that the economic viability of a process of producing an encapsulant film can be improved. Moreover, by delaying the transfer of the crosslinking agent, it is possible to suppress a slip phenomenon of the encapsulant film. The present disclosure also relates to a solar cell module.

Abstract: A composition for an encapsulant film, comprising an ethylene/alpha-olefin copolymer, an encapsulant film and a solar cell module is disclosed.

Abstract: The polyamide resin composition of the present invention comprises: about 15 to about 49 wt % of an aromatic polyamide resin containing a repeating unit represented by chemical formula 1 and a repeating unit represented by chemical formula 2; about 1 to about 30 wt % of a polyamide resin having a glass transition temperature of about 40 to about 120° C.; about 1 to about 20 wt % of an olefin-based copolymer; about 5 to about 40 wt % of calcium carbonate; and about 5 to about 40 wt % of talc. The polyamide resin composition and the molded product formed therefrom are excellent in plating adhesion, impact resistance, stiffness, heat resistance, flowability, appearance characteristics, and the like.

Abstract: A composition for an encapsulant film, comprising an ethylene/alpha-olefin copolymer, a crosslinking agent, a crosslinking auxiliary agent comprising a compound represented by the following Formula 1, and a silane coupling agent, an encapsulant film and a solar cell module thereof is described herein, and by using such composition, the immersion time of an ethylene/alpha-olefin copolymer may be reduced to improve the economic feasibility of the production process of an encapsulant film, and excellent degree of crosslinking is provided: wherein R1 to R8 are described herein.

Abstract: An encapsulant composition for an optical device; comprises an ethylene/alpha-olefin copolymer having high volume resistance and light transmittance. An encapsulant film for an optical device using the same is also provided.

Abstract: The present invention relates to an adhesive composition and a protective film including an adhesive layer formed by using the same, wherein the adhesive composition includes an acrylic copolymer formed by polymerizing a monomer mixture, the monomer mixture including a monomer represented by [Formula 1], a (meth)acrylic monomer including a carboxy group, a (meth)acrylic monomer including a cross-linkable functional group, and an alkyl(meth)acrylate-based monomer, wherein the acrylic copolymer has a polymerization conversion rate of 99 wt % or higher.

Abstract: A thermoplastic resin composition of the present invention comprises: about 100 parts by weight of a thermoplastic resin including a polyester resin; about 50-150 parts by weight of glass fibers; and about 1-10 parts by weight of a polyether-ester copolymer, wherein the polyether-ester copolymer has a melt volume flow rate (MVR) of about 30-120 cm3/10 min as measured under conditions of 230° C. and 2.16 kg based on ISO 1133. The thermoplastic resin composition is excellent in impact resistance, appearance characteristics, metal joining properties, and the like.

Abstract: The present invention relates to a thermoplastic resin composition for laser direct structuring process, and a molded product comprising the same. In one specific embodiment, the thermoplastic resin composition comprises: approximately 100 parts by weight of a base resin; approximately 0.1-20 parts by weight of an additive for laser direct structuring; and approximately 1-20 parts by weight of an impact modifier, wherein the base resin comprises a polycarbonate resin, a polycarbonate-polysiloxane copolymer and a polyester resin.

Abstract: A thermoplastic resin composition according to the present invention comprises: about 100 parts by weight of a polycarbonate resin; about 5 to about 100 parts by weight of an inorganic filler; about 0.1 to about 2 parts by weight of a maleic anhydride-modified olefin-based copolymer; and about 0.1 to about 2 parts by weight of a phosphite compound represented by chemical formula 1. The thermoplastic resin composition is excellent in terms of chemical resistance, impact resistance, rigidity, physical property balance thereof, and the like.

Abstract: A thermoplastic resin composition of the present invention comprises: about 45 wt % to about 65 wt % of an aromatic polyamide resin comprising at least one of a repeat unit represented by Formula 1, a repeat unit represented by Formula 2, and a repeat unit represented by Formula 3; about 1 wt % to about 20 wt % of an olefin copolymer; about 15 wt % to about 35 wt % of calcium carbonate; and about 5 wt % to about 25 wt % of zinc oxide, wherein the weight ratio of the calcium carbonate and the zinc oxide (calcium carbonate:zinc oxide) is about 5:1 to about 1:1. The thermoplastic resin composition and a molded article formed therefrom have good properties in terms of plating adhesion, appearance, heat resistance, etc.

Abstract: A thermoplastic resin composition of the present invention comprises: about 5 wt % to about 35 wt % of a modified polyaryletherketone resin comprising a repeat unit represented by chemical formula 1; about 5 wt % to about 35 wt % of a polyether ether ketone resin; about 20 wt % to about 40 wt % of a polyphenylsulfone resin; and about 15 wt % to about 50 wt % of glass fibers. The thermoplastic resin composition has good properties in terms of adhesion to metals, impact resistance, and so on.

Abstract: The present invention relates to an ethylene/alpha-olefin copolymer having excellent volume resistance and light transmittance, and a method for preparing the same.

Abstract: A thermoplastic resin composition of the present invention comprises: about 100 parts by weight of a polyester resin; about 15 to about 100 parts by weight of glass fibers; and about 2 to about 20 parts by weight of a modified olefin copolymer, the modified olefin copolymer comprising an epoxy modified olefin copolymer and a maleic anhydride modified olefin copolymer, wherein the weight ratio of the epoxy modified olefin copolymer and the maleic anhydride modified olefin copolymer is about 1:0.3 to about 1:3. The thermoplastic resin composition has excellent impact resistance, chemical resistance, and the like.

Abstract: A polyamide resin composition and a molded article including the same are disclosed. The polyamide resin composition includes: (A) an aromatic polyamide resin; (B) an aliphatic polyamide resin; (C) a modified polyolefin resin; and (D) calcium carbonate. The polyamide resin composition can have good properties in terms of heat resistance, impact resistance, plating adhesion, and the like.

Abstract: A polyamide resin composition and a molded article manufactured using the same. The polyamide resin composition includes: about 40 wt % to about 60 wt % of a polyamide resin including a repeat unit represented by Formula 1 and a repeat unit represented by Formula 2 as defined in the specification; about 1 wt % to about 10 wt % of a maleic anhydride-modified olefin-based copolymer; about 5 wt % to about 20 wt % of calcium carbonate subjected to surface treatment with a silane compound; and about 20 wt % to about 40 wt % of glass fibers, wherein the silane compound includes a functional group comprising an amino group, an epoxy group, and/or a (meth)acryloxy group. The polyamide resin composition and the molded article produced using the same can have good properties in terms of plating adhesion, impact resistance, thermal resistance, and/or appearance, and the like.

Abstract: A polyamide resin composition and a molded article manufactured using the same. The polyamide resin composition includes: about 15 wt % to about 49 wt % of an aromatic polyamide resin including a repeat unit represented by Formula 1 and a repeat unit represented by Formula 2 as defined in the specification; about 1 wt % to about 30 wt % of a polyamide resin having a glass transition temperature of about 40° C. to about 120° C.; about 1 wt % to about 20 wt % of an olefin-based copolymer; and about 30 wt % to about 50 wt % of calcium carbonate. The polyamide resin composition and the molded article produced using the same can have good properties in terms of plating adhesion, impact resistance, thermal resistance, fluidity, and/or appearance, and the like.

Abstract: A polyamide resin composition and a molded article manufactured using the same. The polyamide resin composition includes: about 15 wt % to about 49 wt % of an aromatic polyamide resin including a repeat unit represented by Formula 1 and a repeat unit represented by Formula 2 as defined in the specification; about 1 wt % to about 30 wt % of a polyamide resin having a glass transition temperature of about 40° C. to about 120° C.; about 1 wt % to about 20 wt % of an olefin-based copolymer; and about 30 wt % to about 50 wt % of calcium carbonate. The polyamide resin composition and the molded article produced using the same can have good properties in terms of plating adhesion, impact resistance, thermal resistance, fluidity, and/or appearance, and the like.

Abstract: The present invention relates to a composition for an encapsulant film, including an ethylene/alpha-olefin copolymer having excellent volume resistance and light transmittance, and an encapsulant film using the same.

Abstract: A thermoplastic resin composition includes: a polyester resin; a white pigment; a core-shell structured impact modifier; and a modified polyolefin resin. Exemplary compositions include polycyclohexylenedimethylene terephthalate (PCT) resin; titanium oxide; a core-shell structured impact modifier obtained by grafting methyl (meth)acrylate to the polydimethylsiloxane rubber core; and an ethylene-methacrylate copolymer. The thermoplastic resin composition is usable for the production of molded article as a reflector or reflector cup for a LED (light-emitting diode) that maintains reflectance at elevated temperature.

Abstract: A thermoplastic resin composition and a molded article including the same. The thermoplastic resin composition includes: about 100 parts by weight of a thermoplastic resin; about 1 to about 30 parts by weight of an additive for laser direct structuring (LDS additive); about 0.01 to about 5 parts by weight of a hindered phenol-based compound; about 0.01 to about 10 parts by weight of a sodium phosphate salt; about 0.01 to about 5 parts by weight of a phosphite compound; about 0.01 to about 5 parts by weight of a sulfonate compound; and about 0.01 to about 10 parts by weight of a metal oxide, wherein a weight ratio of the hindered phenol-based compound, the sodium phosphate salt, the phosphite compound and the sulfonate compound to the metal oxide may range from about 2:1 to about 10:1.