Patents by Inventor Sang Hyun KWON
Sang Hyun KWON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250208316Abstract: A composition for a camera module lens includes a resin; an ultraviolet (UV) absorbing dye; and a near infrared ray (NIR) absorbing dye. The UV-absorbing dye and the NIR-absorbing dye are adsorbed or dispersed between polymer chains of the resin.Type: ApplicationFiled: October 24, 2024Publication date: June 26, 2025Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Seong Chan PARK, Min Ji KIM, Sang Hyun KWON, Sang Yun YANG
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Publication number: 20250164666Abstract: A composition for a camera module lens and a camera module lens including the composition are provided, the composition for a camera module lens includes a resin; and 0.01 to 0.1% by weight of a benzotriazole-based ultraviolet (UV) blocking additive with respect to a total weight of the composition, wherein when the composition for a camera module lens is applied to the lens, light with a visible light region may be transmitted without performing separate coating and light within a UV region may be cut-off.Type: ApplicationFiled: July 11, 2024Publication date: May 22, 2025Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Min Ji KIM, Sang Hyun KWON, Su Min KANG
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Patent number: 12242024Abstract: A lens includes a light-transmitting portion and a light-shielding portion adjacent to at least a portion of the light-transmitting portion and integrated with the light-transmitting portion. The light-shielding portion includes at least one of carbon nanotubes and carbon black.Type: GrantFiled: June 28, 2021Date of Patent: March 4, 2025Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Seong Chan Park, Ae Rim Kim, Sang Hyun Kwon, Sang Hyeon Hong, Hae Sung Oh, Choon Keun Lee
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Publication number: 20250011625Abstract: A solvent composition for welding an optical module includes a first solvent and a second solvent. The first solvent includes at least one solvent selected from a first group having a swelling ratio of 60% or more, and the second solvent includes at least one solvent selected from a second group having a swelling ratio of less than 60%.Type: ApplicationFiled: April 9, 2024Publication date: January 9, 2025Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Seong Chan PARK, Sang Hyeon HONG, Sang Hyun KWON
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Publication number: 20240408835Abstract: A plastic lens and a molding apparatus for manufacturing the plastic lens are provided. The plastic lens includes an optical portion that refracts light and a flange portion that extends from the optical portion, wherein a parting line is continuously formed along a circumference of the flange portion on a side surface of the flange portion. The molding apparatus includes a first mold including a first core portion and a first body portion which accommodates the first core portion, a second mold including a second core portion and a second body portion which accommodates the second core portion, and a third mold including a third body portion coupled to a first surface of the second body portion that faces the first body portion.Type: ApplicationFiled: February 12, 2024Publication date: December 12, 2024Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Hae Sung OH, Ae Rim KIM, Sang Hyeon HONG, Sang A KIM, Sang Hyun KWON, Seong Chan PARK
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Patent number: 12055734Abstract: A lens device includes a lens including an optical unit, and a rib portion extending outwardly of the optical unit in a radial direction, where the rib portion includes a light transmission region and a light blocking region, and where the light blocking region is disposed inside of the rib portion. The light blocking region may include a non-polar colorant. The lens may include a cyclic olefin compound. The lens device may include one or more lenses with rib portions with light transmission regions and light blocking regions, and may be a lens assembly with the one or more lenses.Type: GrantFiled: January 20, 2022Date of Patent: August 6, 2024Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Seong Chan Park, Hae Sung Oh, Sang A Kim, Ae Rim Kim, Sang Hyun Kwon
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Publication number: 20230221464Abstract: A lens includes an optical portion; and a rib portion extending to an external side of the optical portion in a radial direction and including a light transmitting region and a light-shielding region, wherein the light-shielding region includes an ester-based compound and a hydrocarbon-based compound, and wherein the hydrocarbon-based compound includes a saturated hydrocarbon compound.Type: ApplicationFiled: May 13, 2022Publication date: July 13, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hae Sung OH, Ae Rim KIM, Sang Hyun KWON, Sang Hyeon HONG, Sang A KIM
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Publication number: 20230055901Abstract: A lens device includes a lens including an optical unit, and a rib portion extending outwardly of the optical unit in a radial direction, where the rib portion includes a light transmission region and a light blocking region, and where the light blocking region is disposed inside of the rib portion. The light blocking region may include a non-polar colorant. The lens may include a cyclic olefin compound. The lens device may include one or more lenses with rib portions with light transmission regions and light blocking regions, and may be a lens assembly with the one or more lenses.Type: ApplicationFiled: January 20, 2022Publication date: February 23, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Seong Chan PARK, Hae Sung OH, Sang A KIM, Ae Rim KIM, Sang Hyun KWON
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Publication number: 20220075096Abstract: A lens includes a light-transmitting portion and a light-shielding portion adjacent to at least a portion of the light-transmitting portion and integrated with the light-transmitting portion. The light-shielding portion includes at least one of carbon nanotubes and carbon black.Type: ApplicationFiled: June 28, 2021Publication date: March 10, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Seong Chan PARK, Ae Rim KIM, Sang Hyun KWON, Sang Hyeon HONG, Hae Sung OH, Choon Keun LEE
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Publication number: 20220001418Abstract: A method of dyeing a lens, and a method of manufacturing a lens assembly is provided. The method includes an operation of dipping the lens in a dyeing solution containing a non-polar dye.Type: ApplicationFiled: February 1, 2021Publication date: January 6, 2022Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Seong Chan PARK, Ae Rim KIM, Sang Hyun KWON, Sang Hyeon HONG, Choon Keun LEE
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Patent number: 11043440Abstract: A semiconductor package includes a semiconductor chip having an active surface, on which a connection pad is disposed, and an inactive surface disposed to oppose the active surface, a heat dissipation member, disposed on the inactive surface of the semiconductor chip, having a plurality of holes and including a graphite-based material, an encapsulant covering at least a portion of each of the semiconductor chip and the heat dissipation member, and a connection member, disposed on the active surface of the semiconductor chip, including a redistribution layer electrically connected to the connection pad. 0<b<0.6a, in which “a” denotes a planar area of the heat dissipation member and “b” denotes a sum of planar areas of the plurality of holes on a plane.Type: GrantFiled: September 11, 2019Date of Patent: June 22, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hyung Kyu Kim, Seong Chan Park, Sang Hyun Kwon, Han Kim, Seung On Kang
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Patent number: 11024556Abstract: A semiconductor package includes a semiconductor chip having an active surface on which a connection pad is disposed and an inactive surface opposing the active surface; a heat dissipation member disposed on the inactive surface of the semiconductor chip and including a graphite material; an adhesive member disposed between the semiconductor chip and the heat dissipation member; an encapsulant covering at least a portion of each of the semiconductor chip and the heat dissipation member; and an interconnect structure disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pad. The encapsulant covers at least a portion of aside surface of the adhesive member.Type: GrantFiled: October 1, 2019Date of Patent: June 1, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sang Hyun Kwon, Hyung Kyu Kim, Seong Chan Park, Hye Lee Kim, Choon Keun Lee
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Patent number: 10914912Abstract: A lens assembly includes a lens barrel formed of a first material, and a lens holder coupled to the lens barrel and formed of a second material, wherein a bonding portion in which the lens barrel and the lens holder are bonded to each other includes a mixed layer in which the first material and the second material are mixed with each other, and the bonding portion includes one or more voids.Type: GrantFiled: July 2, 2019Date of Patent: February 9, 2021Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Seong Chan Park, Sang Hyun Kwon, Hye Lee Kim
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Patent number: 10908505Abstract: A photoresist developer composition contains: a quaternary alkyl ammonium compound; and a corrosion inhibitor. The corrosion inhibitor contains a silane-based compound and an azole-based compound A manufacturing method of a semiconductor package includes using the photoresist developer composition.Type: GrantFiled: August 13, 2018Date of Patent: February 2, 2021Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sang Hyun Kwon, Jin Hee Hwang, Seong Chan Park, Young Ju Lee
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Patent number: 10899962Abstract: A camera module includes a lens module including a lens, and a base module configured to accommodate the lens module therein. A fluorinated lubricant is disposed on a portion of at least one of the lens module and the base module, the fluorinated lubricant includes a fluorescent material capable of emitting fluorescent light when illuminated with ultraviolet (UV) light.Type: GrantFiled: July 1, 2019Date of Patent: January 26, 2021Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Sang Hyun Kwon, Hye Lee Kim, Seong Chan Park
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Publication number: 20210005532Abstract: A semiconductor package includes a semiconductor chip having an active surface on which a connection pad is disposed and an inactive surface opposing the active surface; a heat dissipation member disposed on the inactive surface of the semiconductor chip and including a graphite material; an adhesive member disposed between the semiconductor chip and the heat dissipation member; an encapsulant covering at least a portion of each of the semiconductor chip and the heat dissipation member; and an interconnect structure disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pad. The encapsulant covers at least a portion of aside surface of the adhesive member.Type: ApplicationFiled: October 1, 2019Publication date: January 7, 2021Inventors: Sang Hyun KWON, Hyung Kyu KIM, Seong Chan PARK, Hye Lee KIM, Choon Keun LEE
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Publication number: 20200395263Abstract: A semiconductor package includes a semiconductor chip having an active surface, on which a connection pad is disposed, and an inactive surface disposed to oppose the active surface, a heat dissipation member, disposed on the inactive surface of the semiconductor chip, having a plurality of holes and including a graphite-based material, an encapsulant covering at least a portion of each of the semiconductor chip and the heat dissipation member, and a connection member, disposed on the active surface of the semiconductor chip, including a redistribution layer electrically connected to the connection pad. 0<b<0.6a, in which “a” denotes a planar area of the heat dissipation member and “b” denotes a sum of planar areas of the plurality of holes on a plane.Type: ApplicationFiled: September 11, 2019Publication date: December 17, 2020Inventors: Hyung Kyu KIM, Seong Chan PARK, Sang Hyun KWON, Han KIM, Seung On KANG
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Patent number: 10748833Abstract: A fan-out semiconductor package includes a semiconductor chip having an active surface on which connection pads are disposed and an inactive surface opposing the active surface, a heat dissipation member attached to the inactive surface of the semiconductor chip and having a thickness greater than a thickness of the semiconductor chip, an encapsulant encapsulating at least a portion of each of the semiconductor chip and the heat dissipation member, and a connection member disposed on the active surface of the semiconductor chip and including redistribution layers electrically connected to the connection pads, wherein the heat dissipation member is a complex of carbon and a metal.Type: GrantFiled: February 22, 2019Date of Patent: August 18, 2020Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Seong Chan Park, Sang Hyun Kwon, Han Kim, Hye Lee Kim, Seung On Kang
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Publication number: 20200166725Abstract: A lens assembly includes a lens barrel formed of a first material, and a lens holder coupled to the lens barrel and formed of a second material, wherein a bonding portion in which the lens barrel and the lens holder are bonded to each other includes a mixed layer in which the first material and the second material are mixed with each other, and the bonding portion includes one or more voids.Type: ApplicationFiled: July 2, 2019Publication date: May 28, 2020Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Seong Chan PARK, Sang Hyun KWON, Hye Lee KIM
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Publication number: 20200131434Abstract: A camera module includes a lens module including a lens, and a base module configured to accommodate the lens module therein. A fluorinated lubricant is disposed on a portion of at least one of the lens module and the base module, the fluorinated lubricant includes a fluorescent material capable of emitting fluorescent light when illuminated with ultraviolet (UV) light.Type: ApplicationFiled: July 1, 2019Publication date: April 30, 2020Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Sang Hyun KWON, Hye Lee KIM, Seong Chan PARK