Patents by Inventor Sang Hyun KWON

Sang Hyun KWON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250208316
    Abstract: A composition for a camera module lens includes a resin; an ultraviolet (UV) absorbing dye; and a near infrared ray (NIR) absorbing dye. The UV-absorbing dye and the NIR-absorbing dye are adsorbed or dispersed between polymer chains of the resin.
    Type: Application
    Filed: October 24, 2024
    Publication date: June 26, 2025
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Seong Chan PARK, Min Ji KIM, Sang Hyun KWON, Sang Yun YANG
  • Publication number: 20250164666
    Abstract: A composition for a camera module lens and a camera module lens including the composition are provided, the composition for a camera module lens includes a resin; and 0.01 to 0.1% by weight of a benzotriazole-based ultraviolet (UV) blocking additive with respect to a total weight of the composition, wherein when the composition for a camera module lens is applied to the lens, light with a visible light region may be transmitted without performing separate coating and light within a UV region may be cut-off.
    Type: Application
    Filed: July 11, 2024
    Publication date: May 22, 2025
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Min Ji KIM, Sang Hyun KWON, Su Min KANG
  • Patent number: 12242024
    Abstract: A lens includes a light-transmitting portion and a light-shielding portion adjacent to at least a portion of the light-transmitting portion and integrated with the light-transmitting portion. The light-shielding portion includes at least one of carbon nanotubes and carbon black.
    Type: Grant
    Filed: June 28, 2021
    Date of Patent: March 4, 2025
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Seong Chan Park, Ae Rim Kim, Sang Hyun Kwon, Sang Hyeon Hong, Hae Sung Oh, Choon Keun Lee
  • Publication number: 20250011625
    Abstract: A solvent composition for welding an optical module includes a first solvent and a second solvent. The first solvent includes at least one solvent selected from a first group having a swelling ratio of 60% or more, and the second solvent includes at least one solvent selected from a second group having a swelling ratio of less than 60%.
    Type: Application
    Filed: April 9, 2024
    Publication date: January 9, 2025
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seong Chan PARK, Sang Hyeon HONG, Sang Hyun KWON
  • Publication number: 20240408835
    Abstract: A plastic lens and a molding apparatus for manufacturing the plastic lens are provided. The plastic lens includes an optical portion that refracts light and a flange portion that extends from the optical portion, wherein a parting line is continuously formed along a circumference of the flange portion on a side surface of the flange portion. The molding apparatus includes a first mold including a first core portion and a first body portion which accommodates the first core portion, a second mold including a second core portion and a second body portion which accommodates the second core portion, and a third mold including a third body portion coupled to a first surface of the second body portion that faces the first body portion.
    Type: Application
    Filed: February 12, 2024
    Publication date: December 12, 2024
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hae Sung OH, Ae Rim KIM, Sang Hyeon HONG, Sang A KIM, Sang Hyun KWON, Seong Chan PARK
  • Patent number: 12055734
    Abstract: A lens device includes a lens including an optical unit, and a rib portion extending outwardly of the optical unit in a radial direction, where the rib portion includes a light transmission region and a light blocking region, and where the light blocking region is disposed inside of the rib portion. The light blocking region may include a non-polar colorant. The lens may include a cyclic olefin compound. The lens device may include one or more lenses with rib portions with light transmission regions and light blocking regions, and may be a lens assembly with the one or more lenses.
    Type: Grant
    Filed: January 20, 2022
    Date of Patent: August 6, 2024
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Seong Chan Park, Hae Sung Oh, Sang A Kim, Ae Rim Kim, Sang Hyun Kwon
  • Publication number: 20230221464
    Abstract: A lens includes an optical portion; and a rib portion extending to an external side of the optical portion in a radial direction and including a light transmitting region and a light-shielding region, wherein the light-shielding region includes an ester-based compound and a hydrocarbon-based compound, and wherein the hydrocarbon-based compound includes a saturated hydrocarbon compound.
    Type: Application
    Filed: May 13, 2022
    Publication date: July 13, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hae Sung OH, Ae Rim KIM, Sang Hyun KWON, Sang Hyeon HONG, Sang A KIM
  • Publication number: 20230055901
    Abstract: A lens device includes a lens including an optical unit, and a rib portion extending outwardly of the optical unit in a radial direction, where the rib portion includes a light transmission region and a light blocking region, and where the light blocking region is disposed inside of the rib portion. The light blocking region may include a non-polar colorant. The lens may include a cyclic olefin compound. The lens device may include one or more lenses with rib portions with light transmission regions and light blocking regions, and may be a lens assembly with the one or more lenses.
    Type: Application
    Filed: January 20, 2022
    Publication date: February 23, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seong Chan PARK, Hae Sung OH, Sang A KIM, Ae Rim KIM, Sang Hyun KWON
  • Publication number: 20220075096
    Abstract: A lens includes a light-transmitting portion and a light-shielding portion adjacent to at least a portion of the light-transmitting portion and integrated with the light-transmitting portion. The light-shielding portion includes at least one of carbon nanotubes and carbon black.
    Type: Application
    Filed: June 28, 2021
    Publication date: March 10, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seong Chan PARK, Ae Rim KIM, Sang Hyun KWON, Sang Hyeon HONG, Hae Sung OH, Choon Keun LEE
  • Publication number: 20220001418
    Abstract: A method of dyeing a lens, and a method of manufacturing a lens assembly is provided. The method includes an operation of dipping the lens in a dyeing solution containing a non-polar dye.
    Type: Application
    Filed: February 1, 2021
    Publication date: January 6, 2022
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Seong Chan PARK, Ae Rim KIM, Sang Hyun KWON, Sang Hyeon HONG, Choon Keun LEE
  • Patent number: 11043440
    Abstract: A semiconductor package includes a semiconductor chip having an active surface, on which a connection pad is disposed, and an inactive surface disposed to oppose the active surface, a heat dissipation member, disposed on the inactive surface of the semiconductor chip, having a plurality of holes and including a graphite-based material, an encapsulant covering at least a portion of each of the semiconductor chip and the heat dissipation member, and a connection member, disposed on the active surface of the semiconductor chip, including a redistribution layer electrically connected to the connection pad. 0<b<0.6a, in which “a” denotes a planar area of the heat dissipation member and “b” denotes a sum of planar areas of the plurality of holes on a plane.
    Type: Grant
    Filed: September 11, 2019
    Date of Patent: June 22, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hyung Kyu Kim, Seong Chan Park, Sang Hyun Kwon, Han Kim, Seung On Kang
  • Patent number: 11024556
    Abstract: A semiconductor package includes a semiconductor chip having an active surface on which a connection pad is disposed and an inactive surface opposing the active surface; a heat dissipation member disposed on the inactive surface of the semiconductor chip and including a graphite material; an adhesive member disposed between the semiconductor chip and the heat dissipation member; an encapsulant covering at least a portion of each of the semiconductor chip and the heat dissipation member; and an interconnect structure disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pad. The encapsulant covers at least a portion of aside surface of the adhesive member.
    Type: Grant
    Filed: October 1, 2019
    Date of Patent: June 1, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sang Hyun Kwon, Hyung Kyu Kim, Seong Chan Park, Hye Lee Kim, Choon Keun Lee
  • Patent number: 10914912
    Abstract: A lens assembly includes a lens barrel formed of a first material, and a lens holder coupled to the lens barrel and formed of a second material, wherein a bonding portion in which the lens barrel and the lens holder are bonded to each other includes a mixed layer in which the first material and the second material are mixed with each other, and the bonding portion includes one or more voids.
    Type: Grant
    Filed: July 2, 2019
    Date of Patent: February 9, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Seong Chan Park, Sang Hyun Kwon, Hye Lee Kim
  • Patent number: 10908505
    Abstract: A photoresist developer composition contains: a quaternary alkyl ammonium compound; and a corrosion inhibitor. The corrosion inhibitor contains a silane-based compound and an azole-based compound A manufacturing method of a semiconductor package includes using the photoresist developer composition.
    Type: Grant
    Filed: August 13, 2018
    Date of Patent: February 2, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sang Hyun Kwon, Jin Hee Hwang, Seong Chan Park, Young Ju Lee
  • Patent number: 10899962
    Abstract: A camera module includes a lens module including a lens, and a base module configured to accommodate the lens module therein. A fluorinated lubricant is disposed on a portion of at least one of the lens module and the base module, the fluorinated lubricant includes a fluorescent material capable of emitting fluorescent light when illuminated with ultraviolet (UV) light.
    Type: Grant
    Filed: July 1, 2019
    Date of Patent: January 26, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sang Hyun Kwon, Hye Lee Kim, Seong Chan Park
  • Publication number: 20210005532
    Abstract: A semiconductor package includes a semiconductor chip having an active surface on which a connection pad is disposed and an inactive surface opposing the active surface; a heat dissipation member disposed on the inactive surface of the semiconductor chip and including a graphite material; an adhesive member disposed between the semiconductor chip and the heat dissipation member; an encapsulant covering at least a portion of each of the semiconductor chip and the heat dissipation member; and an interconnect structure disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pad. The encapsulant covers at least a portion of aside surface of the adhesive member.
    Type: Application
    Filed: October 1, 2019
    Publication date: January 7, 2021
    Inventors: Sang Hyun KWON, Hyung Kyu KIM, Seong Chan PARK, Hye Lee KIM, Choon Keun LEE
  • Publication number: 20200395263
    Abstract: A semiconductor package includes a semiconductor chip having an active surface, on which a connection pad is disposed, and an inactive surface disposed to oppose the active surface, a heat dissipation member, disposed on the inactive surface of the semiconductor chip, having a plurality of holes and including a graphite-based material, an encapsulant covering at least a portion of each of the semiconductor chip and the heat dissipation member, and a connection member, disposed on the active surface of the semiconductor chip, including a redistribution layer electrically connected to the connection pad. 0<b<0.6a, in which “a” denotes a planar area of the heat dissipation member and “b” denotes a sum of planar areas of the plurality of holes on a plane.
    Type: Application
    Filed: September 11, 2019
    Publication date: December 17, 2020
    Inventors: Hyung Kyu KIM, Seong Chan PARK, Sang Hyun KWON, Han KIM, Seung On KANG
  • Patent number: 10748833
    Abstract: A fan-out semiconductor package includes a semiconductor chip having an active surface on which connection pads are disposed and an inactive surface opposing the active surface, a heat dissipation member attached to the inactive surface of the semiconductor chip and having a thickness greater than a thickness of the semiconductor chip, an encapsulant encapsulating at least a portion of each of the semiconductor chip and the heat dissipation member, and a connection member disposed on the active surface of the semiconductor chip and including redistribution layers electrically connected to the connection pads, wherein the heat dissipation member is a complex of carbon and a metal.
    Type: Grant
    Filed: February 22, 2019
    Date of Patent: August 18, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seong Chan Park, Sang Hyun Kwon, Han Kim, Hye Lee Kim, Seung On Kang
  • Publication number: 20200166725
    Abstract: A lens assembly includes a lens barrel formed of a first material, and a lens holder coupled to the lens barrel and formed of a second material, wherein a bonding portion in which the lens barrel and the lens holder are bonded to each other includes a mixed layer in which the first material and the second material are mixed with each other, and the bonding portion includes one or more voids.
    Type: Application
    Filed: July 2, 2019
    Publication date: May 28, 2020
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Seong Chan PARK, Sang Hyun KWON, Hye Lee KIM
  • Publication number: 20200131434
    Abstract: A camera module includes a lens module including a lens, and a base module configured to accommodate the lens module therein. A fluorinated lubricant is disposed on a portion of at least one of the lens module and the base module, the fluorinated lubricant includes a fluorescent material capable of emitting fluorescent light when illuminated with ultraviolet (UV) light.
    Type: Application
    Filed: July 1, 2019
    Publication date: April 30, 2020
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sang Hyun KWON, Hye Lee KIM, Seong Chan PARK