Abstract: An electronic device may include: a display; a conductive plate facing the display; a first circuit board including a first opening having an electronic component disposed thereon; a second circuit board having an integrated circuit disposed thereon, wherein the integrated circuit is disposed in the first opening; a shield can having a second opening and disposed on the first circuit board to surround the periphery of the electronic component; a shielding member covering the second opening; a vapor chamber disposed between the conductive plate and the shielding member when the display is viewed from a first direction; a first conductive member electrically connecting the conductive plate and the vapor chamber; and a second conductive member electrically connecting the vapor chamber and the shield can. The second conductive member may be disposed so as not to overlap the shielding member when viewed from the first direction.

Abstract: A semiconductor measurement apparatus includes an illumination unit including a light source, and a polarizer disposed on a propagation path of light emitted from the light source; an optical unit configured to direct the light passing through the polarizer to be incident onto a sample, and to transmit the light, reflected from the sample, to an image sensor; and a controller configured to process an original image, output by the image sensor, to determine a critical dimension of a structure included in a region of the sample on which the light is incident. The controller acquires a two-dimensional image. The controller orthogonally decomposes the two-dimensional image corresponding to a selected wavelength into a plurality of bases, generates one-dimensional data including a plurality of weights corresponding to the plurality of bases, and uses the one-dimensional data to determine a selected critical dimension among critical dimensions of the structure.

Abstract: An electronic device and method are disclosed. The electronic device includes a first antenna configured to communicate using a first frequency band group, a ground switch coupled to the first antenna, a second antenna configured to communicate using a second frequency band group, wherein the second antenna overlaps the first antenna, a band selection switch configured to select one of multiple radio frequency (RF) paths for the second frequency band group, and a processor. The processor implements the method, including determining a communication frequency band, when the communication frequency band is unsupported by the second antenna, identifying an RF path corresponding to the communication frequency band from among the multiple RF paths, and controlling the band selection switch to select the identified RF path for operative connection to the second antenna.

Abstract: A semiconductor measurement apparatus includes an illumination unit including a light source, and a polarizer disposed on a propagation path of light emitted from the light source; an optical unit configured to direct the light passing through the polarizer to be incident onto a sample, and to transmit the light, reflected from the sample, to an image sensor; and a controller configured to process an original image, output by the image sensor, to determine a critical dimension of a structure included in a region of the sample on which the light is incident. The controller acquires a two-dimensional image. The controller orthogonally decomposes the two-dimensional image corresponding to a selected wavelength into a plurality of bases, generates one-dimensional data including a plurality of weights corresponding to the plurality of bases, and uses the one-dimensional data to determine a selected critical dimension among critical dimensions of the structure.

Abstract: A method of inspecting a semiconductor processing chamber includes providing a vision sensor into the semiconductor processing chamber, aligning the vision sensor on a target in the semiconductor processing chamber, obtaining an object image of the target using an image scanning module of the vision sensor, generating a three dimensional model of the target based on the object image, and obtaining a physical quantity of the target from the three dimensional model. The obtaining of the object image of the target includes projecting a pattern onto the target using an illuminator of the image scanning module, and scanning an image of the target in which the pattern is projected, using a camera of the image scanning module.

Abstract: An electronic device and method are disclosed. The electronic device includes a first antenna configured to communicate using a first frequency band group, a ground switch coupled to the first antenna, a second antenna configured to communicate using a second frequency band group, wherein the second antenna overlaps the first antenna, a band selection switch configured to select one of multiple radio frequency (RF) paths for the second frequency band group, and a processor. The processor implements the method, including determining a communication frequency band, when the communication frequency band is unsupported by the second antenna, identifying an RF path corresponding to the communication frequency band from among the multiple RF paths, and controlling the band selection switch to select the identified RF path for operative connection to the second antenna.

Abstract: A method of inspecting a semiconductor processing chamber includes providing a vision sensor into the semiconductor processing chamber, aligning the vision sensor on a target in the semiconductor processing chamber, obtaining an object image of the target using an image scanning module of the vision sensor, generating a three dimensional model of the target based on the object image, and obtaining a physical quantity of the target from the three dimensional model. The obtaining of the object image of the target includes projecting a pattern onto the target using an illuminator of the image scanning module, and scanning an image of the target in which the pattern is projected, using a camera of the image scanning module.