Abstract: A sensor shifting module includes a fixed body, a first movable body movably disposed on the fixed body and coupled to an image sensor having an imaging plane oriented in a first direction, and a first driver configured to rotate the first movable body about an axis orthogonal to the first direction with respect to the fixed body, wherein the first driver includes a tilt guide ball disposed between the fixed body and the first movable body to provide a tilt center for the first movable body with respect to the fixed body.

Abstract: The present invention relates to an eco-friendly photoresist stripper composition and, more specifically, to an eco-friendly photoresist stripper composition including 20-50 wt % of a glycol ether, 1-10 wt % of a cyclic alcohol, 1-10 wt % of an inhibitor for preventing the corrosion of aluminum and copper, 0.5-10 wt % of an alkanolamine, 0.01-10 wt % of a reducing sulfur compound and the balance of water, thereby generating no toxic formaldehyde.

Abstract: Disclosed is a method for producing hyaluronidase or a variant thereof. Specifically, the method is capable of changing the N-glycan levels under culture conditions including a controlled concentration of glucose in the culture medium and a decreased culture temperature for a specific culture time period, thereby increasing the specific activity by 10% or more and improving the quality and production yield.

Abstract: An enhanced bass drum pedal is provided with an eccentricity-adjustable cam system comprising a cam core mounted on a rotating shaft, a cam member rotatably connected to the cam core by a first pin, a positioning member rotatably connected to the cam member by a second pin, and a set screw. The positioning member is fastened onto the cam core by the set screw at a selected position of the positioning member to adjust the eccentricity of the cam system relative to the axis of rotation. As a result, a user can readily alter the impact force acted on a drum head and the restoring force applied to the foot board thereby tuning the bass drum pedal to suit the user's playing style and ability.

Abstract: The present invention relates to a carrier module for micro-BGA (&mgr;-BGA) type device which is capable of testing a produced device without damaging to a solder ball thereunder after being rapidly connected to a test socket. A carrier module for a &mgr;-BGA type device according to the present invention comprises: an upper and lower carrier module body formed with protrusions at the upper and lower portions thereof; a device receiving unit inserted to the upper carrier module body for receiving a &mgr;-BGA type device; and a spring secured elastically to the upper and lower protrusions by being inserted thereto.

Abstract: An enhanced bass drum pedal is provided with an eccentricity-adjustable cam system comprising a cam core mounted on a rotating shaft, a cam member rotatably connected to the cam core by a first pin, a positioning member rotatably connected to the cam member by a second pin, and a set screw. The positioning member is fastened onto the cam core by the set screw at a selected position of the positioning member to adjust the eccentricity of the cam system relative to the axis of rotation. As a result, a user can readily alter the impact force acted on a drum head and the restoring force applied to the foot board thereby tuning the bass drum pedal to suit the user's playing style and ability.

Abstract: The present invention relates to a carrier module for micro-BGA (&mgr;-BGA) type device which is capable of testing a produced device without damaging to a solder ball thereunder after being rapidly connected to a test socket. A carrier module for a BGA type device according to the present invention comprises: an upper and lower carrier module body formed with protrusions at the upper and lower portions thereof; a device receiving unit inserted to the upper carrier module body for receiving a &mgr;-BGA type device; and a spring secured elastically to the upper and lower protrusions by being inserted thereto.

Abstract: The present invention relates to a carrier module for micro-BGA(&mgr;-BGA) type device which is capable of testing a produced device without damaging to a solder ball thereunder after being rapidly connected to a test socket. A carrier module for a &mgr;-BGA type device according to the present invention comprises: an upper and lower carrier module body formed with protrusions at the upper and lower portions thereof; a device receiving unit inserted to the upper carrier module body for receiving a &mgr;-BGA type device; and a spring secured elastically to the upper and lower protrusions by being inserted thereto.

Abstract: The present invention relates to a wafer formed with a CSP device and a test socket of a BGA device in which a test socket has a contact member to perform a wiping action for increasing an electric conductivity between a wafer formed with a CSP device and a solder ball formed at a BGA device and a test socket. The present invention provides a test socket including: a contact member block having a slanting face to apply an uniform pressing force to the surface of a solder ball when a BGA device is contacted with the solder ball, formed with a two-dimensionally arranged long hole, the long hole being formed at its central portion with a through hole, the slanting face of the long hole and the surface of the through hole being coated with a conductive material; and a housing formed with a contact member block groove for mounting the contact member block and formed at the upper portion of the groove with a mounting portion for receiving a BGA device.

Abstract: There is disclosed a carrier module capable of accurately fixing IC device when the producted IC device is tested on the performance thereof. The carrier module includes a body having an insertion groove formed therein in a predetermined direction and holes, an elastic unit inserted and fixed to the insertion groove, for being elastically moved upward and downward, a latch installed on upper portion of the elastic means, for fixing an IC device, and a pin for fixing the latch by being inserted and fixed into the body, wherein the IC device is fixed or released by operation of the latch. The carrier module has a structure permitting the latches to be pressed at both sides thereof, and therefore the present invention provides an easy machining and assembling of the carrier module, and lowers the production cost by reducing the number of parts.