Abstract: An apparatus for managing a battery includes a voltage sensor that measures a voltage of a battery cell mounted on a vehicle, and a processor that determines a short circuit risk of the battery cell.

Abstract: A battery management apparatus includes a control circuit configured to determine an internal resistance value for each of one or more battery cells included in a battery pack by using a current change amount of the battery pack and a voltage change amount of the one or more battery cells, and diagnose defects in the one or more battery cells by using internal resistance values of the one or more battery cells, in response to charging the battery pack, where the control circuit is configured to determine the current change amount of the battery pack and the voltage change amount of the one or more battery cells based on a current change request time point requiring a charging current change based on a voltage of the battery pack reaching a predetermined voltage during the charge of the battery pack.

Abstract: In an apparatus for correcting a voltage of a battery cell and a method thereof. The apparatus includes a voltage sensor configured for measuring voltages of a plurality of battery cells, and a controller which is configured for determining an amount of voltage change of each battery cell corresponding to a preset discharge current, detects target battery cells whose identification numbers have preset intervals while the amount of voltage change does not exceed a threshold value, and corrects the amount of voltage change of each target battery cell.

Abstract: A battery management apparatus includes a voltage sensor configured to measure a voltage of one or more battery cells, a control circuit configured to diagnose a defect in the one or more battery cells by determining a voltage change amount of the one or more battery cells using the voltage of the one or more battery cells measured by the voltage sensor, and a storage configured to store data and algorithms driven by the control circuit. The control circuit is configured to obtain a voltage for each battery cell by sequentially measuring the one or more battery cells, and to perform first voltage measurement on the one or more battery cells in a forward chronological order and to perform second voltage measurement on the one or more battery cells in a reverse chronological order.

Abstract: A semiconductor device including a first interlayer insulating film; a conductive pattern in the first interlayer insulating film; a resistance pattern on the conductive pattern; an upper etching stopper film spaced apart from the resistance pattern, extending in parallel with a top surface of the resistance pattern, and including a first metal; a lower etching stopper film on the conductive pattern, extending in parallel with a top surface of the first interlayer insulating film, and including a second metal; and a second interlayer insulating film on the upper etching stopper film and the lower etching stopper film, wherein a distance from a top surface of the second interlayer insulating film to a top surface of the upper etching stopper film is smaller than a distance from the top surface of the second interlayer insulating film to a top surface of the lower etching stopper film.

Abstract: Provided is a lithium secondary battery which includes a positive electrode, a negative electrode, a separator interposed between the positive electrode and the negative electrode, and an electrolyte, wherein the positive electrode includes a lithium composite transition metal oxide powder having a layered structure and a nickel content accounting for 85 atm % or more of total transition metals, and wherein the lithium composite transition metal oxide powder undergoes a 3% or less change in lithium-oxygen (Li—O) interlayer spacing in a state-of-charge (SOC) range of 58% to 72%.

Abstract: An apparatus for detecting soft shorts of a battery cell and a method for the same are provided. The apparatus includes a sensor to measure voltages of a plurality of battery cells, and a controller to determine a slope of a voltage of each battery cell, the deviation of the slope of the voltage for each battery cell, and detect a battery cell, which has the soft shorts, of the plurality of battery cells, based on the slope and the deviation.

Abstract: An apparatus for monitoring a battery of a vehicle includes one or more sensors and a processor, wherein the one or more sensors may obtain a first voltage during a stabilization time of the battery, obtain a minimum voltage measured from a time point when the stabilization time ends to a time point when parking of the vehicle ends as a second voltage of the battery, and detect a temperature of the battery from a time point when the first voltage is obtained to a time point when the second voltage is obtained, and the processor may determine a first discharge amount based on the first voltage and the second voltage, determine a second discharge amount consumed in balancing the battery and operating the one or more sensors, determine a first self-discharge amount and a second self-discharge amount based on the first discharge amount, the second discharge amount, and the temperature, and determine whether a short circuit has occurred in the battery based on the first self-discharge amount and the second self-di

Abstract: A printed circuit board includes first and second insulating layers forming a cavity, a first heat releasing layer formed on an exterior surface of the cavity, and a circuit layer formed above or below the first the insulating layer and at least between a surface of the cavity and the first insulating layer. The heat releasing layer is electrically connected to at least a portion of the circuit layer.

Abstract: A printed circuit board includes first and second insulating layers forming a cavity, a first heat releasing layer formed on an exterior surface of the cavity, and a circuit layer formed above or below the first the insulating layer and at least between a surface of the cavity and the first insulating layer. The heat releasing layer is electrically connected to at least a portion of the circuit layer.

Abstract: An electro device embedded printed circuit board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, a printed circuit board embedded with an electro device, in which a pair of electrodes are formed on either end, includes: a core substrate in which a first cavity is formed; a first passive device embedded in the first cavity and being thinner than the core substrate; and a second passive device stacked on an upper side of the first passive device such that the second passive device is embedded in the first cavity. The first passive device and the second passive device are stacked to cross each other.

Abstract: A method of manufacturing a printed circuit board including an electronic component embedded therein, including: preparing a core substrate, which has a cavity formed therein and which includes internal circuit layers formed thereon; attaching a tape to one side of the core substrate; attaching an electronic component on the tape such that the cavity receives the electronic component therein; forming a first insulating layer on another side of the core substrate such that the first insulating layer infiltrates into the cavity; removing the tape attached to the one side of the core substrate, and forming connecting parts for electrically connecting electrode terminals of the electronic component to the internal circuit layer formed on the one side of the core substrate; and forming a second insulating layer on the one side of the core substrate from which the tape is removed

Abstract: An electro device embedded printed circuit board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, a printed circuit board embedded with an electro device, in which a pair of electrodes are formed on either end, includes: a core substrate in which a first cavity is formed; a first passive device embedded in the first cavity and being thinner than the core substrate; and a second passive device stacked on an upper side of the first passive device such that the second passive device is embedded in the first cavity. The first passive device and the second passive device are stacked to cross each other.

Abstract: An insulator and a manufacturing method of an electronic component embedded printed circuit board using the insulator are disclosed. The method includes providing a core board having a circuit pattern formed on a surface thereof, in which the core board is penetrated by a cavity, adhering an adhesive layer covering the cavity to a lower surface of the core board, disposing an electronic component on an upper surface of the adhesive layer, in which the upper surface corresponds to the cavity, and stacking an insulator on an upper surface of the core board so as to fill the cavity, in which the insulator has an upper resin layer and a lower resin layer formed on an upper surface and a lower surface of a reinforcing material, respectively. The insulator has an asymmetric structure in which the lower resin layer is thicker than the upper resin layer.

Abstract: An electronic component embedded printed circuit board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the method includes providing a core board having a circuit pattern formed on a surface thereof, in which the core board is penetrated by a cavity, adhering an adhesive layer to a lower surface of the core board so as to cover the cavity, disposing an electronic component on an upper surface of the adhesive layer, the upper surface corresponding to the cavity, covering the circuit pattern by stacking a first insulator on an upper surface of the core board such that the cavity is filled, the first insulator having no backing material filled therein, and stacking a second insulator on both upper and lower sides of the cord board, in which the second insulator has a backing material filled therein.

Abstract: The present invention relates to a printed circuit board including an electronic component embedded therein and a method of manufacturing the board, which electrically connect electrode terminals of the electronic component to the internal circuit layers using connecting parts, thus the circuit density is dispersed

Abstract: Disclosed herein is a Printed Circuit Board (PCB) having embedded resistors and a method of manufacturing the same, in which contact pads are formed by filling via holes formed on electrode pads with oxidation-resistant conductive material, and resistors are formed on the contact pads. Accordingly, erosion that occurs between the electrode pads and the resistors can be prevented using the contact pads made of oxidation-resistant conductive material, and connections between circuits also can be realized. Furthermore, resistors are formed on a flat plane without any difference in height, attributable to the electrode pads, and thus differences between the resistance values of the built-in resistors can be greatly reduced.

Abstract: A printed circuit board with embedded electronic components and fabrication method thereof are disclosed. The printed circuit board with embedded electronic components having outer electrodes comprising a substrate on which insertion holes are formed for containing the electronic components, a filler for filling the gap between the electronic component and the insertion hole to secure the electronic components, and attachment layers laminated onto the substrate in contact with the electrodes, with circuits formed on the attachment layers, may provide superior electrical reliability, as the outer electrodes of the electronic components are in contact with the attachment layers, and may reduce fabrication cost and time, as it is not necessary to form via holes.