Patents by Inventor Sang Jin Cha

Sang Jin Cha has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • EMI shielded semiconductor package
    Patent number: 7576415
    Abstract: An EMI shielded semiconductor package is provided. The package includes a substrate and a chip disposed on the substrate. The chip is electrically connected to the substrate by a plurality of bonding wires. At least one shielding conductive block is formed on the substrate and electrically connected to the ground trace of the substrate. A sealant is formed on the substrate and covers the chip, bonding wires and the shielding conductive block. The sealant has a side surface to expose a surface of the shielding conductive block. A layer of conductive film is formed on the outer surface of the sealant and covers the exposed surface of the shielding conductive block thereby shielding the chip from electromagnetic interference.
    Type: Grant
    Filed: June 15, 2007
    Date of Patent: August 18, 2009
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Sang Jin Cha, Hyeongno Kim
  • EMI SHIELDED SEMICONDUCTOR PACKAGE
    Publication number: 20080308912
    Abstract: An EMI shielded semiconductor package is provided. The package includes a substrate and a chip disposed on the substrate. The chip is electrically connected to the substrate by a plurality of bonding wires. At least one shielding conductive block is formed on the substrate and electrically connected to the ground trace of the substrate. A sealant is formed on the substrate and covers the chip, bonding wires and the shielding conductive block. The sealant has a side surface to expose a surface of the shielding conductive block. A layer of conductive film is formed on the outer surface of the sealant and covers the exposed surface of the shielding conductive block thereby shielding the chip from electromagnetic interference.
    Type: Application
    Filed: June 15, 2007
    Publication date: December 18, 2008
    Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Sang Jin Cha, Hyeongno Kim