Patents by Inventor Sang Jun Jung

Sang Jun Jung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10427966
    Abstract: Disclosed here are a glass forming apparatus and a method of forming a glass. A glass forming apparatus of the present invention includes a transfer unit which moves a material, a preheating unit which preheats the material supplied by the transfer unit, a curved surface forming unit which forms the material in a curved shape, and a cooling unit which cools the material in the curved shape transformed by the curved surface forming unit, wherein the curved surface forming unit includes a moving mold in which a plurality of curved surface-shaped cores configured to seat the preheated material are formed and the moving mold is provided to be movable, a first mold disposed to face the moving mold, a plurality of cavities formed between the moving mold and the first mold, and a pneumatic device which generates a vacuum pressure in the plurality of cavities to adhere the material to the curved surface-shaped cores.
    Type: Grant
    Filed: September 2, 2015
    Date of Patent: October 1, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jeong Soo Yea, Sang Jun Jung, Kyong Rok Kang, Dong Oh Min, In Youl Seo, Sung Jin Jang
  • Publication number: 20170349472
    Abstract: A apparatus for molding curved glass comprises: a plurality of mold units formed in a chamber for thermomolding and including a lower mold which has one or more cavities such that each of the cavities is injected with glass and an upper mold corresponding to the shape of glass to be processed and arranged on the upper side of the lower mold; and first and second processing apparatuses respectively including an inlet part for the plurality of mold units which are put, a preheating part for increasing the temperature of the glass, a molding part for molding the glass, a cooling part for cooling the molded glass and an outlet part for discharging the cooled glass, wherein the molding part can gradually decrease the increase rate of the heat applied to the plurality of mold units from the inlet part side to the cooling part side.
    Type: Application
    Filed: June 26, 2015
    Publication date: December 7, 2017
    Inventors: Sang-jun JUNG, Dong-oh MIN, Jeong-soo YEA, Jong-duck LEE, Sung-jin JANG, Kyung-sun CHOI
  • Publication number: 20170297944
    Abstract: Disclosed here are a glass forming apparatus and a method of forming a glass. A glass forming apparatus of the present invention includes a transfer unit which moves a material, a preheating unit which preheats the material supplied by the transfer unit, a curved surface forming unit which forms the material in a curved shape, and a cooling unit which cools the material in the curved shape transformed by the curved surface forming unit, wherein the curved surface forming unit includes a moving mold in which a plurality of curved surface-shaped cores configured to seat the preheated material are formed and the moving mold is provided to be movable, a first mold disposed to face the moving mold, a plurality of cavities formed between the moving mold and the first mold, and a pneumatic device which generates a vacuum pressure in the plurality of cavities to adhere the material to the curved surface-shaped cores.
    Type: Application
    Filed: September 2, 2015
    Publication date: October 19, 2017
    Applicant: Samsung Electronics Co., Ltd
    Inventors: Jeong Soo Yea, Sang Jun Jung, Kyong Rok Kang, Dong Oh Min, In Youl Seo, Sung Jin Jang
  • Publication number: 20110155997
    Abstract: The vertical light emitting diode includes a substrate having a plurality of penetrating via-holes, a plurality of nitride semiconductor layers formed on the substrate, a first electrode formed on the plurality of nitride semiconductor layers, and a second electrode formed to fill the plurality of via-holes thereby contacting part of the plurality of nitride semiconductor layers.
    Type: Application
    Filed: December 13, 2010
    Publication date: June 30, 2011
    Inventors: Ung Lee, So-Young Jang, Sang-Jun Jung, Hyun-Goo Kim
  • Patent number: 7885068
    Abstract: Provided is a cooler for a notebook computer. The cooler includes: a body comprising an upper plate, a lower plate, and an air passage formed between the upper plate and the lower plate; one or more cooling fans mounted on the body and drawing air into the air passage; and one or more vent holes formed in portions of the upper plate other than portions of the upper plate over the cooling fans, wherein the air drawn by the cooling fan is flown through the air passage of the body and discharged through the vent holes to the notebook computer placed on the body of the cooler. Accordingly, the air drawn by the cooling fans is flown through the air passage of the body and discharged through the vent holes to the notebook computer placed on the body of the cooler, thereby cooling the notebook computer.
    Type: Grant
    Filed: June 5, 2007
    Date of Patent: February 8, 2011
    Assignee: Zalman Tech Co., Ltd.
    Inventors: Min Whan Seo, Hee Jun Yang, Sang Jun Jung
  • Publication number: 20090154089
    Abstract: Provided is a cooler for a notebook computer. The cooler includes: a body comprising an upper plate, a lower plate, and an air passage formed between the upper plate and the lower plate; one or more cooling fans mounted on the body and drawing air into the air passage; and one or more vent holes formed in portions of the upper plate other than portions of the upper plate over the cooling fans, wherein the air drawn by the cooling fan is flown through the air passage of the body and discharged through the vent holes to the notebook computer placed on the body of the cooler.
    Type: Application
    Filed: June 5, 2007
    Publication date: June 18, 2009
    Applicant: ZALMAN TECH CO., LTD.
    Inventors: Min-Whan Seo, Hee-Jun Jun Yang, Sang-Jun Jung
  • Patent number: 7515417
    Abstract: Provided is an apparatus for cooling heat generating computer parts that installed in a computer. The apparatus includes a heat transferring block capable of being thermally coupled to the heat generating parts to conduct the heat generated by the heat dissipating parts; at least one heat pipe, each including a block coupling portion thermally coupled to the heat transferring block and a fin coupling portion formed of a generally curved shape composed essentially of one or more circular arc portions; and a plurality of heat dissipating fins, each having at least one perforation hole. The geometry of the curvature of the entirety of the fin coupling portion is shaped so that the geometry alone would not allow the heat pipe to be inserted through the perforation hole of the heat dissipating fins. The fin coupling portion of the heat pipe passes through each of the at least one perforation hole of the plurality of heat dissipating fins.
    Type: Grant
    Filed: December 10, 2007
    Date of Patent: April 7, 2009
    Assignee: Zalman Tech Co., Ltd.
    Inventors: Sang Cheol Lee, Sun Gyu Yoon, Sang Jun Jung
  • Patent number: D541232
    Type: Grant
    Filed: December 19, 2005
    Date of Patent: April 24, 2007
    Assignee: Zalman Tech Co., Ltd.
    Inventors: Sang Cheol Lee, Sun Gyu Yoon, Sang Jun Jung
  • Patent number: D541757
    Type: Grant
    Filed: December 19, 2005
    Date of Patent: May 1, 2007
    Assignee: Zalman Tech Co., Ltd.
    Inventors: Sang Cheol Lee, Sun Gyu Yoon, Sang Jun Jung, Kook Young Yoon
  • Patent number: D554597
    Type: Grant
    Filed: June 15, 2006
    Date of Patent: November 6, 2007
    Assignee: Zalman Tech Co., Ltd.
    Inventors: Min Whan Seo, Kyoung Mo Min, Sang Jun Jung
  • Patent number: D604704
    Type: Grant
    Filed: August 21, 2008
    Date of Patent: November 24, 2009
    Assignee: Zalman Tech Co., Ltd.
    Inventors: Sang Jun Jung, Min Whan Seo