Abstract: There are provided a method and device for detecting a zero phase component. The device for detecting a zero phase component includes a meter chip of a sequential sampling method, a data acquiring unit configured to acquire sequential data on a plurality of phases from the meter chip, and a zero phase current value calculating unit configured to calculate an instantaneous current value for fault detection by summing instantaneous current values for each phase from the acquired sequential data, and calculate a zero phase current value using the calculated instantaneous current value for fault detection.

Abstract: A method and system for controlling charging of a hybrid vehicle are provided. The method includes generating a request to charge a battery by driving a hybrid starter generator (HSG) with power of an engine in an electric vehicle (EV) mode of the hybrid vehicle. In addition, the method includes decreasing torque of the engine to HSG charging engine torque, maintaining the torque of the engine at the HSG charging engine torque, and shifting torque of the HSG into charging-target HSG torque. A pressure of a clutch disposed between the engine and a driving motor of the vehicle is released to interrupt transference of power from the engine to the driving motor. The battery is then charged with power output from the HSG while the HSG is rotating by driving power output from the engine.

Abstract: Provided are a connection error detecting apparatus and method. The connection error detecting apparatus, which detects connection errors for each rating of a smart meter, comprises: a parameter calculating unit for calculating connection error detecting parameters including an actual three-phase voltage value, an actual three-phase current value, an effective amount of three-phase power, and an ineffective amount of three-phase power; and a connection error determining unit for setting connection error criteria for detecting connection errors for each rating of the smart meter, and detecting the connection errors for each rating by determining whether or not any one of the connection error detecting parameters satisfies the connection error criteria.

Abstract: A method of fabricating a semiconductor package includes providing a wafer which includes an upper area having through silicon vias (TSVs) and a lower area not having the TSVs; mounting a semiconductor chip on the upper area of the wafer; forming a passivation layer to a predetermined thickness to cover the semiconductor chip; exposing the TSVs by removing the lower area of the wafer in a state where no support is attached to the wafer; and exposing a top surface of the semiconductor chip by partially removing the passivation layer.

Abstract: A method and system for controlling charging of a hybrid vehicle are provided. The method includes generating a request to charge a battery by driving a hybrid starter generator (HSG) with power of an engine in an electric vehicle (EV) mode of the hybrid vehicle. In addition, the method includes decreasing torque of the engine to HSG charging engine torque, maintaining the torque of the engine at the HSG charging engine torque, and shifting torque of the HSG into charging-target HSG torque. A pressure of a clutch disposed between the engine and a driving motor of the vehicle is released to interrupt transference of power from the engine to the driving motor. The battery is then charged with power output from the HSG while the HSG is rotating by driving power output from the engine.

Abstract: A method of fabricating a semiconductor package includes providing a wafer which includes an upper area having through silicon vias (TSVs) and a lower area not having the TSVs; mounting a semiconductor chip on the upper area of the wafer; forming a passivation layer to a predetermined thickness to cover the semiconductor chip; exposing the TSVs by removing the lower area of the wafer in a state where no support is attached to the wafer; and exposing a top surface of the semiconductor chip by partially removing the passivation layer.

Abstract: Provided is a rescue request signal processing device connected with a repeater and including a signal detector configured to detect identification information of a wireless communication terminal from an uplink signal outputted from the wireless communication terminal; a signal strength information generator configured to generate strength information of the uplink signal of the wireless communication terminal when the detected identification information of the wireless communication terminal is identical with identification information of a wireless communication terminal included in a request signal for location information transmitted from a location information requesting device; and a transmitter configured to transmit the strength information of the uplink signal and at least one of location information and identification information of the repeater to a location information server.

Abstract: A method of fabricating a semiconductor package includes providing a wafer which includes an upper area having through silicon vias (TSVs) and a lower area not having the TSVs; mounting a semiconductor chip on the upper area of the wafer; forming a passivation layer to a predetermined thickness to cover the semiconductor chip; exposing the TSVs by removing the lower area of the wafer in a state where no support is attached to the wafer; and exposing a top surface of the semiconductor chip by partially removing the passivation layer.

Abstract: There are provided a method and device for detecting a zero phase component. The device for detecting a zero phase component includes a meter chip of a sequential sampling method, a data acquiring unit configured to acquire sequential data on a plurality of phases from the meter chip, and a zero phase current value calculating unit configured to calculate an instantaneous current value for fault detection by summing instantaneous current values for each phase from the acquired sequential data, and calculate a zero phase current value using the calculated instantaneous current value for fault detection.

Abstract: A semiconductor device defect detecting apparatus including: a sensor disposed on semiconductor process equipment, the sensor configured to detect a signal emitted from a semiconductor device in contact with the semiconductor process equipment; and a signal analyzer configured to determine whether the semiconductor device is defective based on the detected signal in a predetermined frequency range.

Abstract: Provided are a connection error detecting apparatus and method. The connection error detecting apparatus, which detects connection errors for each rating of a smart meter, comprises: a parameter calculating unit for calculating connection error detecting parameters including an actual three-phase voltage value, an actual three-phase current value, an effective amount of three-phase power, and an ineffective amount of three-phase power; and a connection error determining unit for setting connection error criteria for detecting connection errors for each rating of the smart meter, and detecting the connection errors for each rating by determining whether or not any one of the connection error detecting parameters satisfies the connection error criteria.

Abstract: A printed circuit board and method thereof and a solder ball land and method thereof. The example printed circuit board (PCB) may include a first solder ball land having a first surface treatment portion configured for a first type of resistance and a second solder ball land having a second surface treatment portion configured for a second type of resistance. The example solder ball land may include a first surface treatment portion configured for a first type of resistance and a second surface treatment portion configured for a second type of resistance. A first example method may include first treating a first surface of a first solder ball land to increase a first type of resistance and second treating a second surface of a second solder ball land to increase a second type of resistance other than the first type of resistance.

Abstract: Provided is a rescue request signal processing device connected with a repeater and including a signal detector configured to detect identification information of a wireless communication terminal from an uplink signal outputted from the wireless communication terminal; a signal strength information generator configured to generate strength information of the uplink signal of the wireless communication terminal when the detected identification information of the wireless communication terminal is identical with identification information of a wireless communication terminal included in a request signal for location information transmitted from a location information requesting device; and a transmitter configured to transmit the strength information of the uplink signal and at least one of location information and identification information of the repeater to a location information server.

Abstract: A printed circuit board and method thereof and a solder ball land and method thereof. The example printed circuit board (PCB) may include a first solder ball land having a first surface treatment portion configured for a first type of resistance and a second solder ball land having a second surface treatment portion configured for a second type of resistance. The example solder ball land may include a first surface treatment portion configured for a first type of resistance and a second surface treatment portion configured for a second type of resistance. A first example method may include first treating a first surface of a first solder ball land to increase a first type of resistance and second treating a second surface of a second solder ball land to increase a second type of resistance other than the first type of resistance.

Abstract: A wafer grinding and tape attaching apparatus and method, the method includes providing a wafer to a chuck table, grinding a back side of the wafer, providing a wafer ring having dicing tape and attaching the dicing tape to the back side of the ground wafer.

Abstract: A printed circuit board and method thereof and a solder ball land and method thereof. The example printed circuit board (PCB) may include a first solder ball land having a first surface treatment portion configured for a first type of resistance and a second solder ball land having a second surface treatment portion configured for a second type of resistance. The example solder ball land may include a first surface treatment portion configured for a first type of resistance and a second surface treatment portion configured for a second type of resistance. A first example method may include first treating a first surface of a first solder ball land to increase a first type of resistance and second treating a second surface of a second solder ball land to increase a second type of resistance other than the first type of resistance.

Abstract: The present invention relates to an apparatus and method for a measurement of a film thickness using an improved fast Fourier transformation. The apparatus includes a light source, a light receiving unit for converging a light from the light source, a detection unit for splitting a reflection light reflected by the surface of the sample and inputted into the optical fabric through the lens, and outputted to the other side of the optical fabric based on a light intensity of each wavelength and providing a certain amount of wavelength, a conversion unit for converting a wavelength based spectrum data detected by the detection unit into an analog signal and then converting into a digital signal through a converter, a computation unit for computing the number of vibrations based on a high speed Fourier transformation, and an analyzing unit for measuring a film thickness.

Abstract: A wiring film including wires, a semiconductor package including the wiring film, and a method of fabricating the semiconductor package are provided. The wiring film comprises a base film and first wires arranged on a first surface of the base film. First bumps are respectively positioned at ends of the first wires. A first adhesive layer is also provided to cover the first wires and the first bumps.

Abstract: A method of cleaning a board includes dipping a board having a surface on which an organic solderability preservative (OSP) is provided into a cleaning solution having glycolic acid, a surfactant and water.

Abstract: A substrate for a semiconductor package and a method of manufacturing the same are provided. More particularly, the substrate for the semiconductor package and the method for manufacturing the same include metal pieces, with some of the metal pieces having one end embedded within an insulating layer for insulating an external connection electrode of the substrate and the other end embedded within a solder. The substrate for the semiconductor package has the effects of preventing or retarding a connection failure in a solder connection portion by blocking or retarding the propagation of a crack, and allowing a solder to be easily permeated under the metal pieces and formed at a desired position.