Patents by Inventor Sang Mi Park

Sang Mi Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240120465
    Abstract: An anode active material for a secondary battery includes a carbon-based active material, and silicon-based active material particles doped with magnesium. At least some of the silicon-based active material particles include pores, and a volume ratio of pores having a diameter of 50 nm or less among the pores is 2% or less based on a total volume of the silicon-based active material particles.
    Type: Application
    Filed: September 7, 2023
    Publication date: April 11, 2024
    Inventors: Hwan Ho JANG, Moon Sung KIM, Hyo Mi KIM, Sang Baek RYU, Da Hye PARK, Eun Jun PARK, Seung Hyun YOOK, Da Bin CHUNG, Jun Hee HAN
  • Patent number: 11944661
    Abstract: The present invention provides a pharmaceutical composition for prevention or treatment of a stress disease and depression, the pharmaceutical composition be safely useable without toxicity and side effects by using an extract of leaves of Vaccinium bracteatum Thunb., which is natural resource of Korea, so that the reduction of manufacturing and production costs and the import substitution and export effects can be expected through the replacement of a raw material for preparation with a plant inhabiting in nature.
    Type: Grant
    Filed: February 7, 2018
    Date of Patent: April 2, 2024
    Assignee: JEONNAM BIOINDUSTRY FOUNDATION
    Inventors: Chul Yung Choi, Dool Ri Oh, Yu Jin Kim, Eun Jin Choi, Hyun Mi Lee, Dong Hyuck Bae, Kyo Nyeo Oh, Myung-A Jung, Ji Ae Hong, Kwang Su Kim, Hu Won Kang, Jae Yong Kim, Sang O Pan, Sung Yoon Park, Rack Seon Seong
  • Publication number: 20240097104
    Abstract: The technology and implementations disclosed in this patent document generally relate to a lithium secondary battery including: a first unit cell including a first anode including a 1-1 anode mixture layer and a 1-2 anode mixture layer on the 1-1 anode mixture layer, and a second unit cell including a second anode including a 2-1 anode mixture layer and a 2-2 anode mixture layer on the 2-1 anode mixture layer, wherein a weight ratio of the silicon-based active material in the 1-2 anode mixture layer is greater than a weight ratio of the silicon-based active material in the 1-1 anode mixture layer, and a weight ratio of the silicon-based active material in the 2-2 anode mixture layer is less than or equal to a weight ratio of the silicon-based active material in the 2-1 anode mixture layer.
    Type: Application
    Filed: August 2, 2023
    Publication date: March 21, 2024
    Inventors: Jun Hee HAN, Moon Sung KIM, Hyo Mi KIM, Sang Baek RYU, Da Hye PARK, Sang In BANG, Seung Hyun YOOK, Hwan Ho JANG, Da Bin CHUNG
  • Publication number: 20240099071
    Abstract: A display device includes a first substrate, a first electrode above the first substrate, a pixel-defining film above the first electrode, and defining an emission area, a light-emitting layer above the first electrode and the pixel-defining film, a second electrode above the light-emitting layer, a thin-film encapsulation structure above the second electrode, and including an organic film defining an opening, and a color control layer above the thin-film encapsulation structure in the opening.
    Type: Application
    Filed: June 23, 2023
    Publication date: March 21, 2024
    Inventors: Sang Hyung LIM, Se Jin PARK, Jae Ho EO, Soon Mi CHOI
  • Publication number: 20240097235
    Abstract: A composite pad and a battery cell assembly and a battery module including the composite pad are disclosed. In some implementations, the battery cell assembly comprises a plurality of battery cells arranged in a direction, and one or more pads, each pad disposed between two adjacent battery cells of the plurality of battery cells, at least one of the one or more pads including a pad body with elasticity, and a heat generating part coupled to the pad body and connected to an edge of the at least one of the one or more pads and configured to generate heat upon application of electric power to the heat generating part.
    Type: Application
    Filed: July 7, 2023
    Publication date: March 21, 2024
    Inventors: Jeong Tae HWANG, You Kyung PARK, Sang Gi SHIM, So Mi LEE
  • Patent number: 11929491
    Abstract: An anode for a lithium secondary battery includes an anode current collector, and an anode active material layer formed on at least one surface of the anode current collector. The anode active material layer includes a carbon-based active material, a first silicon-based active material doped with magnesium and a second silicon-based active material not doped with magnesium. A content of the first silicon-based active material is in a range from 2 wt % to 20 wt % based on a total weight of the anode active material layer.
    Type: Grant
    Filed: June 6, 2023
    Date of Patent: March 12, 2024
    Assignee: SK ON CO., LTD.
    Inventors: Hwan Ho Jang, Moon Sung Kim, Hyo Mi Kim, Sang Baek Ryu, Da Hye Park, Seung Hyun Yook, Da Bin Chung, Jun Hee Han
  • Patent number: 11929495
    Abstract: In some implementations, the anode includes a current collector, a first anode mixture layer formed on at least one surface of the current collector, and a second anode mixture layer formed on the first anode mixture layer. The first anode mixture layer and the second anode mixture layer include a carbon-based active material, respectively. The first anode mixture layer includes a first binder, a first silicon-based active material, and a first conductive material. The second anode mixture layer includes a second binder, a second silicon-based active material, and a second conductive material. Contents of the first conductive material and the second conductive material are different from each other with respect to the total combined weight of the first anode mixture layer and the second anode mixture layer. Types of the first silicon-based active material and the second silicon-based active material are different from each other.
    Type: Grant
    Filed: May 18, 2023
    Date of Patent: March 12, 2024
    Assignee: SK ON CO., LTD.
    Inventors: Hyo Mi Kim, Moon Sung Kim, Sang Baek Ryu, Da Hye Park, Seung Hyun Yook, Hwan Ho Jang, Kwang Ho Jeong, Da Bin Chung, Jun Hee Han
  • Patent number: 11929200
    Abstract: A coil component includes a body; first and second coil portions spaced apart from each other in the body; first and second external electrodes disposed on the body to be spaced apart from each other and connected to both ends of the first coil portion; and first and second ground electrodes spaced apart from each other on the body and connected to both ends of the second coil portion.
    Type: Grant
    Filed: December 10, 2020
    Date of Patent: March 12, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dong Hwan Lee, Sang Soo Park, Chan Yoon, Dong Jin Lee, Hwi Dae Kim, Hye Mi Yoo
  • Publication number: 20230293483
    Abstract: The present invention relates to a composition for preventing or treating liver disease, comprising icaritin and quercetin. It is ascertained that when icaritin and quercetin are used in combination rather than individually, the composition of the present invention has a superior effect of hepatic cell protection, and the optimal mixing ratio is derived, and it is also ascertained that the composition exhibits hepatoprotective action and does not induce toxicity in normal cells, and thus the present invention can be used as an active ingredient of a therapeutic agent for liver disease or a health functional food for preventing liver disease.
    Type: Application
    Filed: September 25, 2020
    Publication date: September 21, 2023
    Applicant: INDUSTRY-ACADEMIC COORPERATION FOUNDATION DAEGU HAANY UNIVERSITY
    Inventors: Sang-Chan KIM, Sang-Mi PARK, ll-Je CHO, Jae-Kwang KIM, Eun-Ok KIM, Chung-A PARK, Sung-Hui BYUN, Sook-Jahr PARK
  • Patent number: 9576940
    Abstract: The present invention provides a light emitting device which comprises blue and red light emitting diode (LED) chips and at least one phosphor for emitting green light by means of light emitted from the blue LED chip, and an LCD backlight including the light emitting device. According to the light emitting device of the present invention, uniform white light can be implemented and both high luminance and wider color reproduction range can also be obtained. Accordingly, an LCD backlight for uniform light distribution on an LCD as well as low power consumption and high durability can be manufactured using the light emitting device.
    Type: Grant
    Filed: July 31, 2012
    Date of Patent: February 21, 2017
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Kyung Nam Kim, Sang Mi Park, Tomizo Matsuoka
  • Patent number: 9564940
    Abstract: A method and apparatus for providing information about a plurality of wireless charging pads to an electronic device such that the electronic device performs wireless charging efficiently is provided. The method includes receiving information about the plurality of wireless charging pads and displaying the information about the plurality of wireless charging pads on a screen of the electronic device.
    Type: Grant
    Filed: January 8, 2014
    Date of Patent: February 7, 2017
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ji-Hyun Park, Jung-Hyung Kim, Bo-Ram Namgoong, Sang-Mi Park, Sung-Kwang Yang, Bo-Kun Choi
  • Patent number: 9406579
    Abstract: A semiconductor device has a substrate. An insulating layer is formed over a surface of the substrate. A semiconductor die is mounted over the surface of the substrate. A channel is formed in the insulating layer around the semiconductor die. An underfill material is deposited between the semiconductor die and the substrate and in the channel. A heat spreader is mounted over the semiconductor die with the heat spreader thermally connected to the substrate. A thermal interface material is formed over the semiconductor die. The underfill material is deposited between the semiconductor die and the substrate along a first edge of the semiconductor die and along a second edge of the semiconductor die opposite the first edge. The channel extends partially through the insulating layer formed over the substrate with the insulating layer maintaining coverage over the substrate within a footprint of the channel.
    Type: Grant
    Filed: May 14, 2012
    Date of Patent: August 2, 2016
    Assignee: STATS ChipPAC Pte. Ltd.
    Inventors: DaeSik Choi, JoungIn Yang, Sang Mi Park, WonIl Kwon, YiSu Park
  • Patent number: 9390945
    Abstract: A semiconductor device has a substrate and insulating layer formed over a surface of the substrate. A first conductive layer is formed over the surface of the substrate. A second conductive layer is formed over an opposing surface of the substrate. A conductive via is formed through the substrate. An opening is formed in the insulating layer while leaving the first conductive layer intact. The opening narrows with a non-linear side or linear side. The opening can have a rectangular shape. A semiconductor die is mounted over the surface of the substrate. An underfill material is deposited between the semiconductor die and substrate. The opening in the insulating layer reduces a flow rate of the underfill material proximate to the opening. The flow rate of the underfill material proximate to the opening is substantially equal to a flow rate of the underfill material away from the opening.
    Type: Grant
    Filed: May 8, 2012
    Date of Patent: July 12, 2016
    Assignee: STATS ChipPAC Pte. Ltd.
    Inventors: KyungHoon Lee, JoungIn Yang, Sang Mi Park, DaeSik Choi, YiSu Park
  • Patent number: 9378983
    Abstract: A semiconductor device has an interposer with a die attach area interior to the interposer and cover attach area outside the die attach area. A channel is formed into a surface of the interposer within the cover attach area. A dam material is formed over the surface of the interposer within the cover attach area between the channel and edge of the interposer. A semiconductor die is mounted to the die attach area of the interposer. An adhesive material is deposited in the cover attach area away from the channel and dam material. A cover, such as a heat spreader or shielding layer, is mounted to the die and interposer within the cover attach area. The cover presses the adhesive material into the channel and against the dam material to control outward flow of the adhesive material. Alternatively, ACF can be formed over the interposer to mount the cover.
    Type: Grant
    Filed: April 26, 2013
    Date of Patent: June 28, 2016
    Assignee: STATS ChipPAC Pte. Ltd.
    Inventors: DaeSik Choi, Sang Mi Park, KyungHoon Lee
  • Patent number: 9287241
    Abstract: The present invention provides a light emitting device which comprises blue and red light emitting diode (LED) chips and at least one phosphor for emitting green light by means of light emitted from the blue LED chip, and an LCD backlight including the light emitting device. According to the light emitting device of the present invention, uniform white light can be implemented and both high luminance and wider color reproduction range can also be obtained. Accordingly, an LCD backlight for uniform light distribution on an LCD as well as low power consumption and high durability can be manufactured using the light emitting device.
    Type: Grant
    Filed: September 29, 2006
    Date of Patent: March 15, 2016
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Kyung Nam Kim, Sang Mi Park, Tomizo Matsuoka
  • Patent number: 9281228
    Abstract: A semiconductor device has a semiconductor die mounted to a substrate. A recess is formed in a back surface of the semiconductor die to an edge of the semiconductor die with sidewalls on at least two sides of the semiconductor die. The sidewalls are formed by removing a portion of the back surface of the die, or by forming a barrier layer on at least two sides of the die. A channel can be formed in the back surface of the semiconductor die to contain the TIM. A TIM is formed in the recess. A heat spreader is mounted in the recess over the TIM with a down leg portion of the heat spreader thermally connected to the substrate. The sidewalls contain the TIM to maintain uniform coverage of the TIM between the heat spreader and back surface of the semiconductor die.
    Type: Grant
    Filed: November 1, 2011
    Date of Patent: March 8, 2016
    Assignee: STATS ChipPAC, Ltd.
    Inventors: DaeSik Choi, JoungIn Yang, MinJung Kim, Sang Mi Park, MinWook Yu
  • Patent number: 9252094
    Abstract: A semiconductor device has a semiconductor die with a first conductive layer formed over an active surface of the semiconductor die. An insulation layer is formed over the active surface of the semiconductor die. A second conductive layer is conformally applied over the insulating layer and first conductive layer. Conductive pillars are formed over the first conductive layer. Conductive rings are formed around a perimeter of the conductive pillars. A conductive material is deposited over the surface of the conductive pillars within the conductive rings. A substrate has a third conductive layer formed over a surface of the substrate. The semiconductor die is mounted to a substrate with the third conductive layer electrically connected to the conductive material within the conductive rings. The conductive rings inhibit outward flow of the conductive material from under the conductive pillars to prevent electrical bridging between adjacent conductive pillars.
    Type: Grant
    Filed: April 30, 2011
    Date of Patent: February 2, 2016
    Assignee: STATS ChipPAC, Ltd.
    Inventors: DaeSik Choi, Sang Mi Park
  • Patent number: 9147849
    Abstract: Provided are a new electron transport material and an organic electroluminescent device including the same. The electron transport material according to the present invention may have the excellent luminescence property and reduce the driving voltage to increase the power efficiency, such that the organic electroluminescent device using less consumption power may be manufactured.
    Type: Grant
    Filed: February 21, 2013
    Date of Patent: September 29, 2015
    Assignee: Alpha Chem Co., Ltd.
    Inventors: Hyun-Goog Nam, Dae Won Lim, Je-yong Kim, Sang-mi Park, Seung-hee Jang, Sang Youn Lee, Juseok Ham, Kyu-oh Cho, Hyun-don Kim
  • Patent number: 9131267
    Abstract: An apparatus and a method of a portable terminal for dual display of a broadcasting receiver by a High Definition Multimedia Interface (HDMI) signal are provided. The method includes receiving at least one input signal from a broadcasting receiver, generating an output signal based on the received input signal, and transmitting the output signal to the broadcasting receiver so that the output signal can be output from the broadcasting receiver.
    Type: Grant
    Filed: November 1, 2012
    Date of Patent: September 8, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sang-Mi Park, Hyun-Ho Park, Woo-Jong Yoo, Ju-Pyo Hong
  • Publication number: 20130300004
    Abstract: A semiconductor device has a substrate. An insulating layer is formed over a surface of the substrate. A semiconductor die is mounted over the surface of the substrate. A channel is formed in the insulating layer around the semiconductor die. An underfill material is deposited between the semiconductor die and the substrate and in the channel. A heat spreader is mounted over the semiconductor die with the heat spreader thermally connected to the substrate. A thermal interface material is formed over the semiconductor die. The underfill material is deposited between the semiconductor die and the substrate along a first edge of the semiconductor die and along a second edge of the semiconductor die opposite the first edge. The channel extends partially through the insulating layer formed over the substrate with the insulating layer maintaining coverage over the substrate within a footprint of the channel.
    Type: Application
    Filed: May 14, 2012
    Publication date: November 14, 2013
    Applicant: STATS CHIPPAC, LTD.
    Inventors: DaeSik Choi, JoungIn Yang, Sang Mi Park, WonIl Kwon, YiSu Park