Patents by Inventor Sangmin YE

Sangmin YE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250098129
    Abstract: A speaker module includes a speaker housing including a first speaker housing defining at least one first surface of the speaker module and a second speaker housing defining at least one second surface of the speaker module that is opposite to the least one first surface, a speaker assembly including a voice coil and a vibration member, the speaker assembly being accommodated in an interior of the speaker housing, a back volume in an interior of the speaker housing and defined by the first speaker housing and the second speaker housing, and a side surface shield member between an inner surface of the speaker assembly and the back volume, the side surface shield member including a ferrite-based magnetic substance, where at least one vent hole communicating the speaker assembly and the back volume is in the side surface shield member.
    Type: Application
    Filed: December 5, 2024
    Publication date: March 20, 2025
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Sangmin YE, Byunggun CHOI, Kwanhee HAN
  • Patent number: 12096178
    Abstract: In various example embodiments, an electronic device 300 may include: a housing 310 including a first housing 311 facing a first direction, and a second housing 312 facing a second direction opposite to the first direction; a sound module 340 disposed on a surface of the first housing 311 facing the second direction and configured to generate a sound; an acoustic duct 350 formed in the first housing 311 such that the sound module 340 and an outside of the electronic device 300 communicate with each other, and configured to transmit the sound generated by the sound module 340 to the outside of the electronic device 300; and a resonance structure 360 formed in the first housing 311 to communicate with the acoustic duct 350 to tune a resonance characteristic according to a shape of the acoustic duct 350.
    Type: Grant
    Filed: August 3, 2022
    Date of Patent: September 17, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Byunggun Choi, Sangmin Ye, Sangmin Baek, Changi Park
  • Publication number: 20230006482
    Abstract: An electronic device is provided. The electronic device includes a battery, at least one coil, a wireless power transmission/reception circuit electrically coupled to the at least one coil, a charging circuit electrically coupled between the wireless power transmission/reception circuit and the battery, and a processor.
    Type: Application
    Filed: March 29, 2022
    Publication date: January 5, 2023
    Inventors: Jinsik CHOI, Baewon PARK, Seungshik SHIN, Sangmin YE
  • Publication number: 20220417650
    Abstract: In various example embodiments, an electronic device 300 may include: a housing 310 including a first housing 311 facing a first direction, and a second housing 312 facing a second direction opposite to the first direction; a sound module 340 disposed on a surface of the first housing 311 facing the second direction and configured to generate a sound; an acoustic duct 350 formed in the first housing 311 such that the sound module 340 and an outside of the electronic device 300 communicate with each other, and configured to transmit the sound generated by the sound module 340 to the outside of the electronic device 300; and a resonance structure 360 formed in the first housing 311 to communicate with the acoustic duct 350 to tune a resonance characteristic according to a shape of the acoustic duct 350.
    Type: Application
    Filed: August 3, 2022
    Publication date: December 29, 2022
    Inventors: Byunggun CHOI, Sangmin YE, Sangmin BAEK, Changi PARK
  • Publication number: 20220329937
    Abstract: According to various embodiments of the disclosure, an electronic device may include a housing, a speaker module disposed inside the housing, a printed circuit board disposed within the housing and including a power transmission line configured to supply power to an electronic component of the electronic device, and a loop line extending from the power transmission line toward the speaker module.
    Type: Application
    Filed: April 7, 2022
    Publication date: October 13, 2022
    Inventors: Kwanhee HAN, Byunggun CHOI, Sangmin YE