Patents by Inventor Sang Min YONG

Sang Min YONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package
    Patent number: 11664331
    Abstract: A semiconductor package is provided. The semiconductor package comprises a first substrate, a second substrate disposed on the first substrate, a first semiconductor chip disposed on the second substrate, and a stiffener extending from an upper surface of the first substrate to an upper surface of the second substrate, the stiffener not being in contact with the first semiconductor chip, wherein a first height from the upper surface of the first substrate to an upper surface of the first semiconductor chip is greater than a second height from the upper surface of the first substrate to an uppermost surface of the stiffener.
    Type: Grant
    Filed: September 3, 2021
    Date of Patent: May 30, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Chul Woo Kim, Sang Min Yong, Yang Gyoo Jung
  • SEMICONDUCTOR PACKAGE
    Publication number: 20210398916
    Abstract: A semiconductor package is provided. The semiconductor package comprises a first substrate, a second substrate disposed on the first substrate, a first semiconductor chip disposed on the second substrate, and a stiffener extending from an upper surface of the first substrate to an upper surface of the second substrate, the stiffener not being in contact with the first semiconductor chip, wherein a first height from the upper surface of the first substrate to an upper surface of the first semiconductor chip is greater than a second height from the upper surface of the first substrate to an uppermost surface of the stiffener.
    Type: Application
    Filed: September 3, 2021
    Publication date: December 23, 2021
    Inventors: Chul Woo KIM, Sang Min YONG, Yang Gyoo JUNG
  • Semiconductor package
    Patent number: 11139253
    Abstract: A semiconductor package is provided. The semiconductor package comprises a first substrate, a second substrate disposed on the first substrate, a first semiconductor chip disposed on the second substrate, and a stiffener extending from an upper surface of the first substrate to an upper surface of the second substrate, the stiffener not being in contact with the first semiconductor chip, wherein a first height from the upper surface of the first substrate to an upper surface of the first semiconductor chip is greater than a second height from the upper surface of the first substrate to an uppermost surface of the stiffener.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: October 5, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Chui Woo Kim, Sang Min Yong, Yang Gyoo Jung
  • SEMICONDUCTOR PACKAGE
    Publication number: 20200312789
    Abstract: A semiconductor package is provided. The semiconductor package comprises a first substrate, a second substrate disposed on the first substrate, a first semiconductor chip disposed on the second substrate, and a stiffener extending from an upper surface of the first substrate to an upper surface of the second substrate, the stiffener not being in contact with the first semiconductor chip, wherein a first height from the upper surface of the first substrate to an upper surface of the first semiconductor chip is greater than a second height from the upper surface of the first substrate to an uppermost surface of the stiffener.
    Type: Application
    Filed: September 26, 2019
    Publication date: October 1, 2020
    Inventors: Chul Woo KIM, Sang Min YONG, Yang Gyoo JUNG