Patents by Inventor Sangwhoo Lim
Sangwhoo Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9018667Abstract: A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and first and second adhesives. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The heat spreader includes a post and a base. The post extends upwardly from the base through an opening in the first adhesive, and the base extends laterally from the post. The first adhesive extends between the base and the conductive trace and the second adhesive extends between the post and the conductive trace. The conductive trace provides signal routing between a pad and a terminal.Type: GrantFiled: April 12, 2010Date of Patent: April 28, 2015Assignee: Bridge Semiconductor CorporationInventors: Charles W. C. Lin, Chia-Chung Wang, Sangwhoo Lim
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Patent number: 8415703Abstract: A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a post, a base and a flange. The conductive trace includes a pad and a terminal. The semiconductor device extends into a cavity in the flange, is electrically connected to the conductive trace and is thermally connected to the heat spreader. The post extends upwardly from the base into an opening in the adhesive, the flange extends upwardly from the post in the opening and extends laterally above the adhesive, the cavity extends into the opening and the base extends laterally from the post. The conductive trace is located outside the cavity and provides signal routing between the pad and the terminal.Type: GrantFiled: September 4, 2010Date of Patent: April 9, 2013Assignee: Bridge Semiconductor CorporationInventors: Charles W. C. Lin, Chia-Chung Wang, Sangwhoo Lim
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Patent number: 8241962Abstract: A method of making a semiconductor chip assembly includes providing a thermal post, a signal post and a base, mounting an adhesive on the base including inserting the thermal post into a first opening in the adhesive and the signal post into a second opening in the adhesive, mounting a conductive layer on the adhesive including aligning the thermal post with a first aperture in the conductive layer and the signal post with a second aperture in the conductive layer, then flowing the adhesive upward between the thermal post and the conductive layer and between the signal post and the conductive layer, solidifying the adhesive, providing a conductive trace that includes a pad, a terminal and the signal post, wherein the pad includes a selected portion of the conductive layer, mounting a semiconductor device on the thermal post, wherein a heat spreader includes the thermal post and the base and the semiconductor device extends into a cavity in the thermal post, electrically connecting the semiconductor device toType: GrantFiled: July 12, 2010Date of Patent: August 14, 2012Assignee: Bridge Semiconductor CorporationInventors: Charles W. C. Lin, Chia-Chung Wang, Sangwhoo Lim
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Patent number: 8232576Abstract: A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a post, a base and a ceramic block. The post extends upwardly from the base into an opening in the adhesive, the base extends laterally from the post and the ceramic block is embedded in the post. The semiconductor device overlaps the ceramic block, is electrically connected to the conductive trace and is thermally connected to the ceramic block. The adhesive extends between the post and the conductive trace and between the base and the conductive trace. The conductive trace provides signal routing between a pad and a terminal.Type: GrantFiled: August 1, 2010Date of Patent: July 31, 2012Assignee: Bridge Semiconductor CorporationInventors: Charles W. C. Lin, Chia-Chung Wang, Sangwhoo Lim
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Patent number: 8212279Abstract: A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a thermal post and a base. The conductive trace includes a pad, a terminal and a signal post. The semiconductor device extends into a cavity in the thermal post, is electrically connected to the conductive trace and is thermally connected to the heat spreader. The thermal post extends upwardly from the base into a first opening in the adhesive, and the signal post extends upwardly from the terminal into a second opening in the adhesive. The conductive trace is located outside the cavity and provides signal routing between the pad and the terminal.Type: GrantFiled: July 10, 2010Date of Patent: July 3, 2012Assignee: Bridge Semiconductor CorporationInventors: Charles W. C. Lin, Chia-Chung Wang, Sangwhoo Lim
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Patent number: 8207553Abstract: A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a base. A cavity extends through the adhesive into the base. The semiconductor device extends into the cavity, is electrically connected to the conductive trace and is thermally connected to the heat spreader. The adhesive extends between the cavity and the conductive trace and between the base and the conductive trace. The conductive trace is located outside the cavity and provides signal routing between a pad and a terminal.Type: GrantFiled: February 26, 2010Date of Patent: June 26, 2012Assignee: Bridge Semiconductor CorporationInventors: Charles W. C. Lin, Chia-Chung Wang, Sangwhoo Lim
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Patent number: 8193556Abstract: A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a post and a base. The semiconductor device extends into a cavity in the post, is electrically connected to the conductive trace and is thermally connected to the heat spreader. The post extends upwardly from the base into an opening in the adhesive, and the base extends laterally from the post. The adhesive extends between the post and the conductive trace and between the base and the conductive trace. The conductive trace is located outside the cavity and provides signal routing between a pad and a terminal.Type: GrantFiled: February 26, 2010Date of Patent: June 5, 2012Assignee: Bridge Semiconductor CorporationInventors: Charles W. C. Lin, Chia-Chung Wang, Sangwhoo Lim
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Patent number: 8076182Abstract: A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a substrate on the adhesive including aligning the post with an aperture in the substrate, then flowing the adhesive into and upward in a gap located in the aperture between the post and the substrate, solidifying the adhesive, then etching the post to form a cavity in the adhesive above the post, then mounting a semiconductor device on the post, wherein a heat spreader includes the post and the base and the semiconductor device extends into the cavity, electrically connecting the semiconductor device to the substrate and thermally connecting the semiconductor device to the heat spreader.Type: GrantFiled: February 28, 2010Date of Patent: December 13, 2011Assignee: Bridge Semiconductor CorporationInventors: Charles W. C. Lin, Chia-Chung Wang, Sangwhoo Lim
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Patent number: 8003416Abstract: A method of making a semiconductor chip assembly includes providing a post and a base, mounting a first adhesive on the base including inserting the post through an opening in the first adhesive, mounting a conductive layer on the base including aligning the post with an aperture in the conductive layer, providing a conductive trace that includes a pad, a terminal and a selected portion of the conductive layer, then flowing a second adhesive into and downward in a gap between the post and the conductive trace, solidifying the second adhesive, then mounting a semiconductor device on a heat spreader that includes the post and the base, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.Type: GrantFiled: April 14, 2010Date of Patent: August 23, 2011Assignee: Bridge Semiconductor CorporationInventors: Charles W. C. Lin, Chia-Chung Wang, Sangwhoo Lim
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Patent number: 7939375Abstract: A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a substrate on the adhesive including aligning the post with an aperture in the substrate, then flowing the adhesive into and upward in a gap located in the aperture between the post and the substrate, solidifying the adhesive, then etching the post to form a cavity in the post, then mounting a semiconductor device on the post, wherein a heat spreader includes the post and the base and the semiconductor device extends into the cavity, electrically connecting the semiconductor device to the substrate and thermally connecting the semiconductor device to the heat spreader.Type: GrantFiled: February 28, 2010Date of Patent: May 10, 2011Assignee: Bridge Semiconductor CorporationInventors: Charles W. C. Lin, Chia-Chung Wang, Sangwhoo Lim
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Publication number: 20110059578Abstract: A method of making a semiconductor chip assembly includes providing a thermal post, a signal post and a base, mounting an adhesive on the base including inserting the thermal post into a first opening in the adhesive and the signal post into a second opening in the adhesive, mounting a conductive layer on the adhesive including aligning the thermal post with a first aperture in the conductive layer and the signal post with a second aperture in the conductive layer, then flowing the adhesive upward between the thermal post and the conductive layer and between the signal post and the conductive layer, solidifying the adhesive, providing a conductive trace that includes a pad, a terminal and the signal post, wherein the pad includes a selected portion of the conductive layer, mounting a semiconductor device on the thermal post, wherein a heat spreader includes the thermal post and the base and the semiconductor device extends into a cavity in the thermal post, electrically connecting the semiconductor device toType: ApplicationFiled: July 12, 2010Publication date: March 10, 2011Inventors: Charles W.C. Lin, Chia-Chung Wang, Sangwhoo Lim
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Publication number: 20110049558Abstract: A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a thermal post and a base. The conductive trace includes a pad, a terminal and a signal post. The semiconductor device extends into a cavity in the thermal post, is electrically connected to the conductive trace and is thermally connected to the heat spreader. The thermal post extends upwardly from the base into a first opening in the adhesive, and the signal post extends upwardly from the terminal into a second opening in the adhesive. The conductive trace is located outside the cavity and provides signal routing between the pad and the terminal.Type: ApplicationFiled: July 10, 2010Publication date: March 3, 2011Inventors: Charles W.C. Lin, Chia-Chung Wang, Sangwhoo Lim
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Publication number: 20110003437Abstract: A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a first conductive layer on the adhesive including aligning the post with an aperture in the first conductive layer, then flowing the adhesive between the post and the first conductive layer, solidifying the adhesive, then etching the post to form a first cavity in the adhesive above the post, depositing a second conductive layer into the first cavity to form a second cavity that extends into the first cavity, providing a conductive trace that includes a pad, a terminal and a selected portion of the first conductive layer, providing a heat spreader that includes the post, the base and a flange that includes a selected portion of the second conductive layer that defines the second cavity, mounting a semiconductor device on the flange in the second cavity, electrically connecting the semiconductor device to the conductive tType: ApplicationFiled: September 6, 2010Publication date: January 6, 2011Inventors: Charles W.C. Lin, Chia-Chung Wang, Sangwhoo Lim
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Publication number: 20100327310Abstract: A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a post, a base and a flange. The conductive trace includes a pad and a terminal. The semiconductor device extends into a cavity in the flange, is electrically connected to the conductive trace and is thermally connected to the heat spreader. The post extends upwardly from the base into an opening in the adhesive, the flange extends upwardly from the post in the opening and extends laterally above the adhesive, the cavity extends into the opening and the base extends laterally from the post. The conductive trace is located outside the cavity and provides signal routing between the pad and the terminal.Type: ApplicationFiled: September 4, 2010Publication date: December 30, 2010Inventors: Charles W.C. Lin, Chia-Chung Wang, Sangwhoo Lim
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Publication number: 20100210049Abstract: A method of making a semiconductor chip assembly includes providing a post and a base, mounting a first adhesive on the base including inserting the post through an opening in the first adhesive, mounting a conductive layer on the base including aligning the post with an aperture in the conductive layer, providing a conductive trace that includes a pad, a terminal and a selected portion of the conductive layer, then flowing a second adhesive into and downward in a gap between the post and the conductive trace, solidifying the second adhesive, then mounting a semiconductor device on a heat spreader that includes the post and the base, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.Type: ApplicationFiled: April 14, 2010Publication date: August 19, 2010Inventors: Charles W.C. Lin, Chia-Chung Wang, Sangwhoo Lim
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Publication number: 20100203679Abstract: A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a substrate on the adhesive including aligning the post with an aperture in the substrate, then flowing the adhesive into and upward in a gap located in the aperture between the post and the substrate, solidifying the adhesive, then etching the post to form a cavity in the adhesive above the post, then mounting a semiconductor device on the post, wherein a heat spreader includes the post and the base and the semiconductor device extends into the cavity, electrically connecting the semiconductor device to the substrate and thermally connecting the semiconductor device to the heat spreader.Type: ApplicationFiled: February 28, 2010Publication date: August 12, 2010Inventors: Charles W.C. Lin, Chia-Chung Wang, Sangwhoo Lim
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Publication number: 20100193830Abstract: A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and first and second adhesives. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The heat spreader includes a post and a base. The post extends upwardly from the base through an opening in the first adhesive, and the base extends laterally from the post. The first adhesive extends between the base and the conductive trace and the second adhesive extends between the post and the conductive trace. The conductive trace provides signal routing between a pad and a terminal.Type: ApplicationFiled: April 12, 2010Publication date: August 5, 2010Inventors: Charles W.C. Lin, Chia-Chung Wang, Sangwhoo Lim
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Publication number: 20100190297Abstract: A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a substrate on the adhesive including aligning the post with an aperture in the substrate, then flowing the adhesive into and upward in a gap located in the aperture between the post and the substrate, solidifying the adhesive, then etching the post to form a cavity in the post, then mounting a semiconductor device on the post, wherein a heat spreader includes the post and the base and the semiconductor device extends into the cavity, electrically connecting the semiconductor device to the substrate and thermally connecting the semiconductor device to the heat spreader.Type: ApplicationFiled: February 28, 2010Publication date: July 29, 2010Inventors: Charles W.C. Lin, Chia-Chung Wang, Sangwhoo Lim
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Publication number: 20100190300Abstract: A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a substrate on the adhesive including aligning the post with an aperture in the substrate, then flowing the adhesive into and upward in a gap located in the aperture between the post and the substrate, solidifying the adhesive, then etching the post and the base to form a cavity that extends through the adhesive into the base, then mounting a semiconductor device on the base, wherein a heat spreader includes the base and the semiconductor device extends into the cavity, electrically connecting the semiconductor device to the substrate and thermally connecting the semiconductor device to the heat spreader.Type: ApplicationFiled: February 28, 2010Publication date: July 29, 2010Inventors: Charles W.C. Lin, Chia-Chung Wang, Sangwhoo Lim
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Publication number: 20100181594Abstract: A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The semiconductor device extends into a cavity in the adhesive, is electrically connected to the conductive trace and is thermally connected to the heat spreader. The heat spreader includes a post and a base. The post extends upwardly from the base into an opening in the adhesive and is located below the cavity, and the base extends laterally from the post. The cavity extends to the post. The adhesive extends between the cavity and the conductive trace and between the base and the conductive trace. The conductive trace is located outside the cavity and provides signal routing between a pad and a terminal.Type: ApplicationFiled: February 26, 2010Publication date: July 22, 2010Inventors: Charles W.C. Lin, Chia-Chung Wang, Sangwhoo Lim