Patents by Inventor Sang-Won Lee

Sang-Won Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260147709
    Abstract: A data write minimization apparatus according to one embodiment may perform caching a page stored in a storage device into a buffer of a volatile memory; generating, when a data update transaction occurs for the page, a PPL block including a per-page log (PPL), which is a per-page redo log, for the data update transaction in a non-volatile memory, and storing, when the PPL block grows larger than a preset size, an entire page in the storage device; and maintaining, when a page write occurs for a PPL page in which the redo log is stored as a PPL block in the non-volatile memory, the PPL block stored in the non-volatile memory, and performing, when a page write occurs for a normal page, an entire page write to the storage device.
    Type: Application
    Filed: November 17, 2025
    Publication date: May 28, 2026
    Applicant: SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION
    Inventors: Sang-Won LEE, Jonghyeok PARK, Bo-Hyun LEE, Seongjae MOON
  • Patent number: 12639822
    Abstract: Disclosed is an image segmentation device. The image segmentation device may include: a storage unit storing a segmentation model learned so as to segment at least one predetermined object; and at least one processor inputting input data into the segmentation model and segmenting at least one predetermined object in the input data, in which the segmentation model may include an encoder including at least one dimension reduction block reducing a dimension of the input data, a decoder including at least one dimension increase block increasing the dimension of output data output from the encoder by using data output from at least one dimension reduction block, and an auxiliary classification model receiving the output data and recognizing whether a specific object is included in the output data.
    Type: Grant
    Filed: March 13, 2024
    Date of Patent: May 26, 2026
    Assignee: DOTTER INC.
    Inventors: Hyeong-Soo Nam, Aleksandr Dolgov, Sang-Won Lee, Sogi Choi, Hong-Ki Yoo, Hyung-Il Kim
  • Publication number: 20260086051
    Abstract: A method of analyzing the pore distribution of porous structures includes observing a cross-section of a porous structure using scanning electron microscopy (SEM) to obtain a raw image of the cross-section of the porous structure and quantifying a pore distribution of the obtained raw image through Voronoi diagram.
    Type: Application
    Filed: September 6, 2023
    Publication date: March 26, 2026
    Applicant: LG Chem, Ltd.
    Inventors: Hosung Kang, Sang-Won Lee, Kyeong-Rak Kim, Je-Seob Park
  • Publication number: 20260016675
    Abstract: The present disclosure relates to a bright- and dark-field microscope for biological tissue analysis. The object of the present disclosure is to provide a bright- and dark-field microscope, which can obtain both bright-field and dark-field images at the same time and, particularly, can be conveniently used for biological tissue analysis. More specifically, the object of the present disclosure is to provide a bright- and dark-field microscope for biological tissue analysis, the microscope having, as a single optical path and a reflective type, an optical system that can acquire bright-field and dark-field images and, particularly, using white light as a light source so as to even smoothly perform conventional H&E analysis in which a biological tissue is analyzed.
    Type: Application
    Filed: July 18, 2023
    Publication date: January 15, 2026
    Inventors: Ik Hwan Kwon, Sang-Won Lee, Tae Guel Lee
  • Patent number: 12469749
    Abstract: A method of manufacturing a semiconductor package includes estimating an error in a solder ball attaching process, determining a specification of a ball tool and a method of the solder ball attaching process, based on the estimated error, manufacturing the ball tool according to the determined specification thereof, and performing the solder ball attaching process based on the method of the solder ball attaching process. The determining of the specification of the ball tool and the method of the solder ball attaching process includes determining a number of a plurality of holders in the ball tool and a position and a width of each of the plurality of holders, determining a number of a plurality of working regions of a substrate and a position and a width of each of the plurality of working regions, and dividing a substrate into the plurality of working regions.
    Type: Grant
    Filed: August 8, 2022
    Date of Patent: November 11, 2025
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sang-Won Lee, Hyunki Kim, Young-Ja Kim, Hyunggil Baek
  • Patent number: 12455816
    Abstract: Provided is a file system including a sequential-writing unit configured to perform sequential write to a new block position of a segment when updating a data block, an updating unit configured to update a page mapping table by mapping a logical page number newly allocated to the new block position and a physical page number newly allocated corresponding thereto, and a remapping unit configured to modify the page mapping table by applying a remap command.
    Type: Grant
    Filed: August 2, 2023
    Date of Patent: October 28, 2025
    Assignee: RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY
    Inventors: Sang-Won Lee, Jonghyeok Park, Young Ik Eom, Dongkun Shin, Yongmyung Lee
  • Publication number: 20250183113
    Abstract: A semiconductor package includes a package substrate, a chip structure on the package substrate, a first mold layer on side surfaces of the chip structure and an upper surface of the package substrate, a heat spreader on the chip structure, and a second mold layer on a side surface of the heat spreader and an upper surface of the first mold layer, where the side surface of the heat spreader includes at least one groove.
    Type: Application
    Filed: July 18, 2024
    Publication date: June 5, 2025
    Inventors: Kang Gyune Lee, Sang-Won Lee, Hyeon Hwang
  • Publication number: 20250029864
    Abstract: A chuck table includes a support part receiving a package substrate. The package substrate includes a package area having semiconductor packages arranged thereon and a scrap area surrounding the package area. A package pad part is between the support part and the package substrate and directly contacts the package area. A scrap pad part is disposed between the support part and the package substrate and directly contacts the scrap area. A vacuum pipe extends through the package pad part and extends into the support part. The vacuum pipe has vacuum pressure applied thereto and has the vacuum pressure released therefrom. A fixing device is connected to the vacuum pipe. The fixing device moves closer to an upper surface of the scrap area as the vacuum pressure is applied to the vacuum pipe, and moves away from the upper surface of the scrap area as the vacuum pressure is released.
    Type: Application
    Filed: February 13, 2024
    Publication date: January 23, 2025
    Inventors: KANG GYUNE LEE, SANG-WON LEE, HYEON HWANG, Younhwan SHIN
  • Patent number: 12179245
    Abstract: An apparatus for cooling a steel sheet includes: an apparatus body provided spaced apart from a steel sheet in the conveying path of the steel sheet; and a cooling unit provided in the apparatus body to supply a cooling fluid. The apparatus body includes: a first edge body that faces a first edge portion extending a certain distance from one side end of the steel sheet toward the center of the steel sheet; and a second edge body that faces a second edge portion extending a certain distance from the other side end of the steel sheet toward the center of the steel sheet. The first and second edge bodies may have stepped cross-sections in a direction perpendicular to the conveying direction of the steel sheet.
    Type: Grant
    Filed: June 11, 2019
    Date of Patent: December 31, 2024
    Assignee: POSCO CO., LTD
    Inventors: Hae-Kwon Jeong, Jae-Hwa Lee, Won-Suk Choi, Kyo-Ha Joo, Sang-Won Lee
  • Patent number: 12142178
    Abstract: A method of driving a display device includes: sensing characteristic information of pixels by outputting sensing voltages to sensing lines; and operating an external compensation of the pixels based on the characteristic information. The sensing of the characteristic information of pixels includes: detecting a capacitance deviation of sensing capacitors of first sensing lines connected to the sensing lines; and sensing the characteristic information of the pixels by replacing at least one of the first sensing lines with a second sensing line based on the capacitance deviation.
    Type: Grant
    Filed: August 15, 2023
    Date of Patent: November 12, 2024
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Jiyoung Eom, Sang-Won Lee, Dong-Sung Im, Seonghwan Choi
  • Patent number: 12051680
    Abstract: A semiconductor package may include; a first substrate, a first semiconductor chip disposed on the first substrate, an interposer disposed on the first semiconductor chip, a connecter spaced apart from the first semiconductor chip in a first horizontal direction and extending between the first substrate and the interposer, wherein the connecter directly electrically connects the first substrate and the interposer, a capacitor disposed between the connecter and the first semiconductor chip, and a guide pattern including a first guide portion and an opposing second guide portion spaced apart in the first horizontal direction, wherein the first guide portion is disposed between the connecter and the capacitor, the second guide portion is disposed between the capacitor and the first semiconductor chip, and at least part of the capacitor is inserted between the first guide portion and the second guide portion.
    Type: Grant
    Filed: May 3, 2022
    Date of Patent: July 30, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Tae Hwan Kim, Hyung Gil Baek, Young-Ja Kim, Kang Gyune Lee, Sang-Won Lee, Yong Kwan Lee
  • Publication number: 20240232069
    Abstract: Provided is a file system including a sequential-writing unit configured to perform sequential write to a new block position of a segment when updating a data block, an updating unit configured to update a page mapping table by mapping a logical page number newly allocated to the new block position and a physical page number newly allocated corresponding thereto, and a remapping unit configured to modify the page mapping table by applying a remap command.
    Type: Application
    Filed: August 2, 2023
    Publication date: July 11, 2024
    Applicant: RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY
    Inventors: Sang-Won LEE, Jonghyeok Park, Young Ik Eom, Dongkun Shin, Yongmyung Lee
  • Publication number: 20240221171
    Abstract: Disclosed is an image segmentation device. The image segmentation device may include: a storage unit storing a segmentation model learned so as to segment at least one predetermined object; and at least one processor inputting input data into the segmentation model and segmenting at least one predetermined object in the input data, in which the segmentation model may include an encoder including at least one dimension reduction block reducing a dimension of the input data, a decoder including at least one dimension increase block increasing the dimension of output data output from the encoder by using data output from at least one dimension reduction block, and an auxiliary classification model receiving the output data and recognizing whether a specific object is included in the output data.
    Type: Application
    Filed: March 13, 2024
    Publication date: July 4, 2024
    Inventors: Hyeong-Soo NAM, Aleksandr DOLGOV, Sang-Won LEE, Sogi CHOI, Hong-Ki YOO, Hyung-Il KIM
  • Patent number: 11982652
    Abstract: Disclosed are non-contiguous sample fractionating and concatenating device and a dual online multidimensional liquid chromatography system having the same. The non-contiguous sample fractionating and concatenating device according to an embodiment of the present disclosure includes a sample supply module which supplies a sample to be analyzed, and a sample fractionation module connected to the sample supply module, and which is continuously supplied with the sample, sets a plurality of unit sample supply times obtained by equally dividing a total sample supply time during which the sample is supplied from the sample supply module, sets a plurality of unit fractionation intervals obtained by equally dividing each of the plurality of unit sample supply times, and concatenates and stores the sample supplied during corresponding unit fractionation intervals within each unit sample supply time to acquire a plurality of fractions.
    Type: Grant
    Filed: October 27, 2021
    Date of Patent: May 14, 2024
    Assignee: KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION
    Inventors: Sang-Won Lee, Hangyeore Lee
  • Patent number: 11972574
    Abstract: Disclosed is an image segmentation device. The image segmentation device may include: a storage unit storing a segmentation model learned so as to segment at least one predetermined object; and at least one processor inputting input data into the segmentation model and segmenting at least one predetermined object in the input data, in which the segmentation model may include an encoder including at least one dimension reduction block reducing a dimension of the input data, a decoder including at least one dimension increase block increasing the dimension of output data output from the encoder by using data output from at least one dimension reduction block, and an auxiliary classification model receiving the output data and recognizing whether a specific object is included in the output data.
    Type: Grant
    Filed: March 15, 2022
    Date of Patent: April 30, 2024
    Assignee: DOTTER CO., LTD.
    Inventors: Hyeong-Soo Nam, Aleksandr Dolgov, Sang-Won Lee, Sogi Choi, Hong-Ki Yoo, Hyung-Il Kim
  • Publication number: 20230386381
    Abstract: A method of driving a display device includes: sensing characteristic information of pixels by outputting sensing voltages to sensing lines; and operating an external compensation of the pixels based on the characteristic information. The sensing of the characteristic information of pixels includes: detecting a capacitance deviation of sensing capacitors of first sensing lines connected to the sensing lines; and sensing the characteristic information of the pixels by replacing at least one of the first sensing lines with a second sensing line based on the capacitance deviation.
    Type: Application
    Filed: August 15, 2023
    Publication date: November 30, 2023
    Inventors: JIYOUNG EOM, SANG-WON LEE, DONG-SUNG IM, SEONGHWAN CHOI
  • Patent number: 11799050
    Abstract: Disclosed are a solar cell including an upper cell includes an upper passivation layer disposed on an upper surface of a functional layer, a transparent electrode disposed on an upper surface of the upper passivation layer, an upper first charge transport layer disposed on an upper surface of the transparent electrode, an upper electrode disposed on the upper first of the transparent electrode to be adjacent to the upper surface charge transport layer, an upper second charge transport layer disposed on the upper surface of the functional layer to be spaced apart from the upper passivation layer, the transparent electrode, the upper first charge transport layer, and the upper electrode, and an upper absorption layer disposed on the upper passivation layer, the transparent electrode, the upper first charge transport layer, and the upper second charge transport layer.
    Type: Grant
    Filed: October 15, 2020
    Date of Patent: October 24, 2023
    Assignee: KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION
    Inventors: Donghwan Kim, Hae-Seok Lee, Yoonmook Kang, Soohyun Bae, Sang-Won Lee, HyunJung Park, Jae-Keun Hwang, Wonkyu Lee, Jiyeon Hyun, Solhee Lee
  • Patent number: 11773490
    Abstract: Provided is a method for producing an oriented electrical steel sheet with an ultra-low iron loss. The method for producing an oriented electrical steel sheet according to the present disclosure is a method for producing an oriented electrical steel sheet comprising the processes of performing reheating, hot rolling, hot-rolled sheet annealing, cold rolling, primary recrystallization annealing and secondary recrystallization annealing on a steel slab, whereby a ceramic coating layer is formed by subjecting a gas-phase ceramic precursor to a contact reaction in a plasma state using the atmospheric pressure plasma CVD (APP-CVD) process, on a part of or the entire one or both surfaces of a steel sheet which has been subjected to the primary recrystallization annealing, and then secondary recrystallization annealing is performed thereon.
    Type: Grant
    Filed: December 13, 2018
    Date of Patent: October 3, 2023
    Assignee: POSCO CO., LTD
    Inventors: Sang-Won Lee, Min-Serk Kwon, Jin-Su Bae
  • Patent number: 11735082
    Abstract: A method of driving a display device includes: sensing characteristic information of pixels by outputting sensing voltages to sensing lines; and operating an external compensation of the pixels based on the characteristic information. The sensing of the characteristic information of pixels includes: detecting a capacitance deviation of sensing capacitors of first sensing lines connected to the sensing lines; and sensing the characteristic information of the pixels by replacing at least one of the first sensing lines with a second sensing line based on the capacitance deviation.
    Type: Grant
    Filed: October 12, 2021
    Date of Patent: August 22, 2023
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Jiyoung Eom, Sang-Won Lee, Dong-Sung Im, Seonghwan Choi
  • Patent number: 11728319
    Abstract: A semiconductor package includes a first sub-semiconductor package, an interposer substrate, and a second sub-semiconductor package that are sequentially stacked. The first sub-semiconductor package includes a first package substrate, a first semiconductor device, and a first mold member that are sequentially stacked, and the interposer substrate includes at least one hole. The first mold member includes: a mold main portion which covers the first semiconductor device; a mold connecting portion extended from the mold main portion and inserted into the at least one hole; and a mold protruding portion extended from the mold connecting portion to cover a top surface of the interposer substrate outside the at least one hole. The mold main portion, the mold connecting portion, and the mold protruding portion constitute a single object.
    Type: Grant
    Filed: March 11, 2021
    Date of Patent: August 15, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD
    Inventor: Sang-Won Lee