Patents by Inventor Sangyeon PAK

Sangyeon PAK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230363126
    Abstract: An electromagnetic wave shielding film according to an embodiment comprises: a base substrate; and an electromagnetic wave shielding layer disposed on the base substrate, wherein the thickness of the electromagnetic wave shielding layer is 1 nm to 50 nm. In addition, the shielding layer comprises: a first layer on the base substrate; a second layer on the first layer; and a third layer on the second layer, wherein the first layer, the second layer, and the third layer include copper sulfide. A method for manufacturing an electromagnetic wave shielding film according to an embodiment comprises the steps of: depositing a metal layer on a base substrate; and sulfiding the metal layer, wherein the step of sulfiding the metal layer is carried out at a temperature of 25° C. to 200° C.
    Type: Application
    Filed: August 25, 2021
    Publication date: November 9, 2023
    Applicants: LG ELECTRONICS INC., RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY
    Inventors: Byungsung KIM, Seungnam CHA, Sangyeon PAK, Taehun KIM
  • Publication number: 20230079198
    Abstract: A transparent conductive film includes a metal chalcogenide compound doped with a halogen and having a sheet resistance at room temperature of less than or equal to about 60 ohm/sq.
    Type: Application
    Filed: August 29, 2022
    Publication date: March 16, 2023
    Applicants: Samsung Electronics Co., Ltd., RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY
    Inventors: Younhee LIM, Sangyeon PAK, Jiwon SON, Yong Wan JIN, SeungNam CHA, Kyungbae PARK, Chuljoon HEO