Abstract: Provided is an indeterminate copper material for electrolytic copper foil and a preparation method thereof. Specifically, the present disclosure relates to an indeterminate copper material for electrolytic copper foil, which exhibits excellent dissolution performance when dissolved in an electrolyte to manufacture electrolytic copper foil, contributes to securing work stability during the manufacture of electrolytic copper foil, and is simple to prepare, thereby reducing manufacturing costs, and a preparation method thereof.

Abstract: Provided is an aluminum alloy for a cable conductor. Specifically, the present invention relates to an aluminum alloy for a cable conductor, which is excellent in both mechanical properties, such as tensile strength, at room temperature and high temperatures and elongation, and electrical conductivity, is simple to manufacture at low costs, and is eco-friendly.

Abstract: Disclosed are a joining structure of different kinds of conductors, a joining method of different kinds of conductors, and a joint of power cables capable of improving joining reliability of a junction of the different kinds of conductors.

Abstract: Provided is an aluminum alloy for a cable conductor. Specifically, the present invention relates to an aluminum alloy for a cable conductor, which is excellent in both mechanical properties, such as tensile strength, at room temperature and high temperatures and elongation, and electrical conductivity, is simple to manufacture at low costs, and is eco-friendly.

Abstract: A method for manufacturing a very low roughness copper foil and an apparatus for manufacturing the copper foil. In the method of the present invention, a pickling process, an electrolytic polishing process and a washing process are successively performed after the copper foil was manufactured. In order to manufacture the very low roughness copper foil, the electrolytic polishing process is accomplished with the copper foil to face a metal cathode plate and supplying a current in order to perform the electrolytic polishing.

Abstract: A method for manufacturing a very low roughness copper foil and an apparatus for manufacturing the copper foil. In the method of the present invention, a pickling process, an electrolytic polishing process and a washing process are successively performed after the copper foil was manufactured. In order to manufacture the very low roughness copper foil, the electrolytic polishing process is accomplished with the copper foil to face a metal cathode plate and supplying a current in order to perform the electrolytic polishing.

Abstract: The present invention relates to a method for manufacturing a low roughness electrodeposited copper foil, and an electrodeposited copper foil manufactured thereby, and uses an electrolyte which basically consists of a sulfuric acid, a copper ion and a chloride ion is adapted with an additive which consists of a HEC (Hydroxyethyl Cellulose) of 0.05˜50 ppm, a SPS (bis(sodiumsulfopropyl)disulfide) of 0.05˜20 ppm, and a gelatin of 0.1˜100 ppm. The present invention is adapted to manufacture a low roughness electrodeposited copper foil using a conventional copper foil manufacture facility and the electrodeposited copper foil according to the present invention is adapted as a material for a copper clad laminate for a printed circuit substrate and an electrode material for a lithium ion battery.