Abstract: Disclosed are a design and manufacturing method for a three-dimensional electromechanical adhesive surface structure capable of adhesive force manipulation and tactile sensing by using 3D printing. The three-dimensional electromechanical adhesive surface structure includes: a body; a plurality of three-dimensional micro pillar structures which are attached to the body at a certain angle; and a wire which supplies voltage to the plurality of three-dimensional micro pillar structures. The three-dimensional micro pillar structure includes: a pillar which is attached to the body at a certain angle and is formed integrally with the body; a conductive material which is applied to surround the pillar; and an insulating material coated to surround the conductive material in order to be insulated from an opposite surface. The voltage supplied through the wire is supplied to the conductive material. A passage for providing the wire is formed under the plurality of three-dimensional micro pillar structures of the body.

Abstract: The present disclosure provides a polishing pad and a method of manufacturing a semiconductor device using the same. The method includes disposing a target layer on a semiconductor substrate and performing a chemical mechanical polishing process on the target layer using a polishing pad including a plurality of polishing protrusions facing the target layer. Each of the polishing protrusions includes a protruding portion and a surface layer at least partially covering the protruding portion, wherein the protruding portion is more elastic than the surface layer, and wherein the surface layer is harder than the protruding portion.

Abstract: An apparatus for manipulating an object includes a substrate, an electrically conductive layer disposed on the substrate, and a porous medium comprising an electrically conductive material. The apparatus also includes a dielectric layer conformally disposed on the porous medium to insulate the porous medium from the object during use. The porosity of the porous medium is about 90% or greater. The adhesive strength of the porous medium is about 1 kPa or lower, and the modulus of the porous medium is about 1 GPa or lower.

Abstract: Various embodiments of the present disclosure relate to a fixed-abrasive pad using vertically aligned carbon nanotubes and a fabrication method for the same. The fixed-abrasive pad may include a pad made of a polymer material; and vertically aligned carbon nanotubes (VACNT) which are configured such that one side thereof is impregnated into the pad and the other side protrudes from the pad.

Abstract: Methods and apparatus for contacting printing via electrostatic force. In one example, an apparatus for contact printing using an ink includes a substrate, a conductive layer disposed on the substrate, and a group of microstructures disposed on the conductive layer. Each microstructure includes a group of conductive porous medium extending from the conductive layer. The apparatus also includes a dielectric layer conformally disposed on the microstructures and configured to electrically insulate the microstructures from the ink during use. The conductive layer is configured to apply a voltage on the group of microstructures to facilitate the loading and dispensing of ink.

Abstract: Disclosed are a design and manufacturing method for a three-dimensional electromechanical adhesive surface structure capable of adhesive force manipulation and tactile sensing by using 3D printing. The three-dimensional electromechanical adhesive surface structure includes: a body; a plurality of three-dimensional micro pillar structures which are attached to the body at a certain angle; and a wire which supplies voltage to the plurality of three-dimensional micro pillar structures. The three-dimensional micro pillar structure includes: a pillar which is attached to the body at a certain angle and is formed integrally with the body; a conductive material which is applied to surround the pillar; and an insulating material coated to surround the conductive material in order to be insulated from an opposite surface. The voltage supplied through the wire is supplied to the conductive material. A passage for providing the wire is formed under the plurality of three-dimensional micro pillar structures of the body.

Abstract: Controllable electromechanical adhesive devices including three-dimensional dielectrically-coated microstructures that are mechanically compliant are provided. The microstructures can be controlled to provide tunable electromechanical surface adhesion, allowing for dexterous gripping of microscale and/or macroscale objects. For example, the devices can tune the surface adhesion strength of one or more microstructures without complex mechanical actuation in a wide range of on/off ratios with low voltage. The devices can be configured as a force sensor capable of providing tactile feedback for determining the load applied against the microstructures by the surface of an object. For example, the devices can provide output indicative of changes in an electrical property of one or more microstructures for determining the applied load of an object. The devices can be pixelated or otherwise configured to provide localized force sensing and/or surface adhesion.

Abstract: Systems, devices, and related methods are disclosed for electromechanical transfer printing of 2D materials disposed on one substrate to another. The printing device can be configured to transfer a 2D material from a source substrate to the target substrate by applying a combination of mechanical and electrostatic forces to facilitate electromechanical adhesion between the 2D material layer and the target substrate. Some embodiments of the printing device can effect direct transfer printing of a 2D material from a source substrate to a target substrate without the use of etchants and adhesives.

Abstract: Methods and apparatus for contacting printing via electrostatic force. In one example, an apparatus for contact printing using an ink includes a substrate, a conductive layer disposed on the substrate, and a group of microstructures disposed on the conductive layer. Each microstructure includes a group of conductive porous medium extending from the conductive layer. The apparatus also includes a dielectric layer conformally disposed on the microstructures and configured to electrically insulate the microstructures from the ink during use. The conductive layer is configured to apply a voltage on the group of microstructures to facilitate the loading and dispensing of ink.

Abstract: An apparatus for manipulating an object includes a substrate, an electrically conductive layer disposed on the substrate, and a porous medium comprising an electrically conductive material. The apparatus also includes a dielectric layer conformally disposed on the porous medium to insulate the porous medium from the object during use. The porosity of the porous medium is about 90% or greater. The adhesive strength of the porous medium is about 1 kPa or lower, and the modulus of the porous medium is about 1 GPa or lower.

Abstract: Methods of printing nanoparticulate ink using nanoporous print stamps are disclosed. A nanoporous print stamp can include a substrate, a patterned arrangement of carbon nanotubes disposed on the substrate, and a secondary material disposed on the carbon nanotubes to reduce capillary-induced deformation of the patterned arrangement of carbon nanotubes when printing nanoparticulate ink. Some methods include loading a nanoporous print stamp with nanoparticulate colloidal ink such that the nanoparticulate colloidal ink is drawn into microstructures of the patterned arrangement of carbon nanotubes via capillary wicking. Nanoparticulate colloidal ink can include nanoparticles dispersed in a solution.

Abstract: Controllable electromechanical adhesive devices including three-dimensional dielectrically-coated microstructures that are mechanically compliant are provided. The microstructures can be controlled to provide tunable electromechanical surface adhesion, allowing for dexterous gripping of microscale and/or macroscale objects. For example, the devices can tune the surface adhesion strength of one or more microstructures without complex mechanical actuation in a wide range of on/off ratios with low voltage. The devices can be configured as a force sensor capable of providing tactile feedback for determining the load applied against the microstructures by the surface of an object. For example, the devices can provide output indicative of changes in an electrical property of one or more microstructures for determining the applied load of an object. The devices can be pixelated or otherwise configured to provide localized force sensing and/or surface adhesion.

Abstract: A nanoporous stamp for printing a variety of materials is disclosed. The nanoporous stamp may include a substrate and an array of carbon nanotubes disposed on and attached to the substrate. The array of carbon nanotubes can have an etched top surface and a wettable, nanoporous structure, and may include a coating thereon. The nanoporous stamp can be used in a variety of printing applications, and can print, among other things, colloidal and non-colloidal inks on a variety of substrates with a high degree of accuracy and fidelity.

Abstract: Systems, devices, and related methods are disclosed for electromechanical transfer printing of 2D materials disposed on one substrate to another. The printing device can be configured to transfer a 2D material from a source substrate to the target substrate by applying a combination of mechanical and electrostatic forces to facilitate electromechanical adhesion between the 2D material layer and the target substrate. Some embodiments of the printing device can effect direct transfer printing of a 2D material from a source substrate to a target substrate without the use of etchants and adhesives.

Abstract: Methods of printing nanoparticulate ink using nanoporous print stamps are disclosed. A nanoporous print stamp can include a substrate, a patterned arrangement of carbon nanotubes disposed on the substrate, and a secondary material disposed on the carbon nanotubes to reduce capillary-induced deformation of the patterned arrangement of carbon nanotubes when printing nanoparticulate ink. Some methods include loading a nanoporous print stamp with nanoparticulate colloidal ink such that the nanoparticulate colloidal ink is drawn into microstructures of the patterned arrangement of carbon nanotubes via capillary wicking. Nanoparticulate colloidal ink can include nanoparticles dispersed in a solution.

Abstract: A nanoporous stamp for printing a variety of materials is disclosed. The nanoporous stamp may include a substrate and an array of carbon nanotubes disposed on and attached to the substrate. The array of carbon nanotubes can have an etched top surface and a wettable, nanoporous structure, and may include a coating thereon. The nanoporous stamp can be used in a variety of printing applications, and can print, among other things, colloidal and non-colloidal inks on a variety of substrates with a high degree of accuracy and fidelity.