Abstract: A connected light node (CLN) induction light ballast module for powering an induction lamp includes a printed circuit board having components mounted thereon and an earth ground region electrically isolated from a PCB ground region. A heat sink is disposed on a lower layer of the printed circuit board and electrically connected to the earth ground region, wherein a parasitic capacitance occurs between the printed circuit board ground region and the heat sink. A capacitive shield sandwiched by a lower insulating pad and an upper insulating pad is electrically isolated from the heat sink supporting the shield. A damping network electrically connects the capacitive shield to the PCB ground region. Switch-mode power converters are mounted above the upper insulating pad and the shield. The damping network suppresses noise by a parasitic capacitance between the PCB ground region and the heat sink during high frequency power converter operation.

Abstract: A connected light node (CLN) induction light ballast module for powering an induction lamp includes a printed circuit board having components mounted thereon and an earth ground region electrically isolated from a PCB ground region. A heat sink is disposed on a lower layer of the printed circuit board and electrically connected to the earth ground region, wherein a parasitic capacitance occurs between the printed circuit board ground region and the heat sink. A capacitive shield sandwiched by a lower insulating pad and an upper insulating pad is electrically isolated from the heat sink supporting the shield. A damping network electrically connects the capacitive shield to the PCB ground region. Switch-mode power converters are mounted above the upper insulating pad and the shield. The damping network suppresses noise by a parasitic capacitance between the PCB ground region and the heat sink during high frequency power converter operation.