Patents by Inventor Sanjay Behura

Sanjay Behura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11289577
    Abstract: A scalable process for fabricating graphene/hexagonal boron nitride (h-BN) heterostructures is disclosed herein. The process includes (BN)XHy-radical interfacing with active sites on silicon nitride coated silicon (Si3N4/Si) surfaces for nucleation and growth of large-area, uniform and ultrathin h-BN directly on Si3N4/Si substrates (B/N atomic ratio=1:1.11±0.09). Further, monolayer graphene van der Waals bonded with the produced h-BN surface benefits from h-BN's reduced roughness (3.4 times) in comparison to Si3N4/Si. Because the reduced surface roughness leads to reduction in surface roughness scattering and charge impurity scattering, therefore an enhanced intrinsic charge carrier mobility (3 folds) for graphene on h-BN/Si3N4/Si is found.
    Type: Grant
    Filed: December 24, 2019
    Date of Patent: March 29, 2022
    Assignees: GlobalWafers Co., Ltd., Board of the Trustees of the University of Illinois
    Inventors: Vikas Berry, Sanjay Behura, Phong Nguyen, Michael R. Seacrist
  • Patent number: 11276759
    Abstract: A scalable process for fabricating graphene/hexagonal boron nitride (h-BN) heterostructures is disclosed herein. The process includes (BN)XHy-radical interfacing with active sites on silicon nitride coated silicon (Si3N4/Si) surfaces for nucleation and growth of large-area, uniform and ultrathin h-BN directly on Si3N4/Si substrates (B/N atomic ratio=1:1.11±0.09). Further, monolayer graphene van der Waals bonded with the produced h-BN surface benefits from h-BN's reduced roughness (3.4 times) in comparison to Si3N4/Si. Because the reduced surface roughness leads to reduction in surface roughness scattering and charge impurity scattering, therefore an enhanced intrinsic charge carrier mobility (3 folds) for graphene on h-BN/Si3N4/Si is found.
    Type: Grant
    Filed: December 24, 2019
    Date of Patent: March 15, 2022
    Assignees: GlobalWafers Co., Ltd., Board of Trustees of the University of Illinois
    Inventors: Vikas Berry, Sanjay Behura, Phong Nguyen, Michael R. Seacrist
  • Patent number: 10658472
    Abstract: A scalable process for fabricating graphene/hexagonal boron nitride (h-BN) heterostructures is disclosed herein. The process includes (BN)XHy-radical interfacing with active sites on silicon nitride coated silicon (Si3N4/Si) surfaces for nucleation and growth of large-area, uniform and ultrathin h-BN directly on Si3N4/Si substrates (B/N atomic ratio=1:1.11±0.09). Further, monolayer graphene van der Waals bonded with the produced h-BN surface benefits from h-BN's reduced roughness (3.4 times) in comparison to Si3N4/Si. Because the reduced surface roughness leads to reduction in surface roughness scattering and charge impurity scattering, therefore an enhanced intrinsic charge carrier mobility (3 folds) for graphene on h-BN/Si3N4/Si is found.
    Type: Grant
    Filed: April 28, 2017
    Date of Patent: May 19, 2020
    Assignee: GlobalWafers Co., Ltd.
    Inventors: Vikas Berry, Sanjay Behura, Phong Nguyen, Michael R. Seacrist
  • Publication number: 20200152744
    Abstract: A scalable process for fabricating graphene/hexagonal boron nitride (h-BN) heterostructures is disclosed herein. The process includes (BN)xHy-radical interfacing with active sites on silicon nitride coated silicon (Si3N4/Si) surfaces for nucleation and growth of large-area, uniform and ultrathin h-BN directly on Si3N4/Si substrates (B/N atomic ratio=1:1.11±0.09). Further, monolayer graphene van der Waals bonded with the produced h-BN surface benefits from h-BN's reduced roughness (3.4 times) in comparison to Si3N4/Si. Because the reduced surface roughness leads to reduction in surface roughness scattering and charge impurity scattering, therefore an enhanced intrinsic charge carrier mobility (3 folds) for graphene on h-BN/Si3N4/Si is found.
    Type: Application
    Filed: December 24, 2019
    Publication date: May 14, 2020
    Inventors: Vikas Berry, Sanjay Behura, Phong Nguyen, Michael R. Seacrist
  • Publication number: 20200152745
    Abstract: A scalable process for fabricating graphene/hexagonal boron nitride (h-BN) heterostructures is disclosed herein. The process includes (BN)XHy-radical interfacing with active sites on silicon nitride coated silicon (Si3N4/Si) surfaces for nucleation and growth of large-area, uniform and ultrathin h-BN directly on Si3N4/Si substrates (B/N atomic ratio=1:1.11±0.09). Further, monolayer graphene van der Waals bonded with the produced h-BN surface benefits from h-BN's reduced roughness (3.4 times) in comparison to Si3N4/Si. Because the reduced surface roughness leads to reduction in surface roughness scattering and charge impurity scattering, therefore an enhanced intrinsic charge carrier mobility (3 folds) for graphene on h-BN/Si3N4/Si is found.
    Type: Application
    Filed: December 24, 2019
    Publication date: May 14, 2020
    Inventors: Vikas Berry, Sanjay Behura, Phong Nguyen, Michael R. Seacrist
  • Publication number: 20200147559
    Abstract: Disclosed herein are boron-nitride nanoparticle membranes and methods of manufacturing boron-nitride nanoparticle membranes. In an embodiment, a boron-nitride nanoparticle membrane includes a matrix and a plurality of one-dimensional boron-nitride nanoparticles disposed within the matrix, where he plurality of boron-nitride nanoparticles are configured for selective molecular transport through each of the plurality of one-dimensional boron-nitride nanoparticles.
    Type: Application
    Filed: July 13, 2018
    Publication date: May 14, 2020
    Inventors: Sangil Kim, Jerry Shan, Vikas Berry, Semih Cetindag, Sanjay Behura, Aaditya Pendse, Robert Praino
  • Patent number: 10573517
    Abstract: A method for depositing a layer of graphene directly on the surface of a substrate, such as a semiconductor substrate is provided. Due to the strong adhesion of graphene and cobalt to a semiconductor substrate, the layer of graphene is epitaxially deposited.
    Type: Grant
    Filed: September 28, 2016
    Date of Patent: February 25, 2020
    Assignee: GlobalWafers Co., Ltd.
    Inventors: Vikas Berry, Sanjay Behura, Phong Nguyen, Michael R. Seacrist
  • Publication number: 20190139762
    Abstract: A method for depositing a layer of graphene directly on the surface of a substrate, such as a semiconductor substrate is provided. Due to the strong adhesion of graphene and cobalt to a semiconductor substrate, the layer of graphene is epitaxially deposited.
    Type: Application
    Filed: December 28, 2018
    Publication date: May 9, 2019
    Inventors: Vikas Berry, Sanjay Behura, Phong Nguyen, Michael R. Seacrist
  • Publication number: 20190097000
    Abstract: A scalable process for fabricating graphene/hexagonal boron nitride (h-BN) heterostructures is disclosed herein. The process includes (BN)XHy-radical interfacing with active sites on silicon nitride coated silicon (Si3N4/Si) surfaces for nucleation and growth of large-area, uniform and ultrathin h-BN directly on Si3N4/Si substrates (B/N atomic ratio=1:1.11±0.09). Further, monolayer graphene van der Waals bonded with the produced h-BN surface benefits from h-BN's reduced roughness (3.4 times) in comparison to Si3N4/Si. Because the reduced surface roughness leads to reduction in surface roughness scattering and charge impurity scattering, therefore an enhanced intrinsic charge carrier mobility (3 folds) for graphene on h-BN/Si3N4/Si is found.
    Type: Application
    Filed: April 28, 2017
    Publication date: March 28, 2019
    Inventors: Vikas Berry, Sanjay Behura, Phong Nguyen, Michael R. Seacrist
  • Publication number: 20180315599
    Abstract: A method for depositing a layer of graphene directly on the surface of a substrate, such as a semiconductor substrate is provided. Due to the strong adhesion of graphene and cobalt to a semiconductor substrate, the layer of graphene is epitaxially deposited.
    Type: Application
    Filed: September 28, 2016
    Publication date: November 1, 2018
    Inventors: Vikas Berry, Sanjay Behura, Phong Nguyen, Michael R. Seacrist