Patents by Inventor Sanjay D. Yadav
Sanjay D. Yadav has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11967516Abstract: Embodiments of the disclosure include methods and apparatus for electrostatically coupling a mask to a substrate support in a deposition chamber. In one embodiment, a substrate support is disclosed that includes a substrate receiving surface, a recessed portion disposed about a periphery of the substrate receiving surface, an electrostatic chuck disposed below the substrate receiving surface, and a plurality of compressible buttons disposed within a respective opening formed in the recessed portion that form an electrical circuit with the electrostatic chuck.Type: GrantFiled: January 17, 2020Date of Patent: April 23, 2024Assignee: Applied Materials, Inc.Inventors: Jrjyan Jerry Chen, Sanjay D. Yadav, Tae Kyung Won, Jun Li, Shouqian Shao, Surendra Kanimihally Setty
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Publication number: 20240105427Abstract: Embodiments of the present disclosure include methods and apparatus for depositing a plurality of layers on a large area substrate. In one embodiment, a processing chamber for plasma deposition is provided. The processing chamber includes a showerhead and a substrate support assembly. The showerhead is coupled to an RF power source and a ground and includes a plurality of perforated gas diffusion members. A plurality of plasma applicators is disposed within the showerhead, wherein one plasma applicator of the plurality of plasma applicators corresponds to one of the plurality of perforated gas diffusion members. Further, a DC bias power source is coupled to a substrate support assembly.Type: ApplicationFiled: December 4, 2023Publication date: March 28, 2024Inventors: Chien-Teh KAO, Tae Kyung WON, Carl A. SORENSEN, Sanjay D. YADAV, Young Dong LEE, Shinichi KURITA, Soo Young CHOI
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Publication number: 20240047291Abstract: Embodiments of the present disclosure generally relate to moisture barrier films utilized in an organic light emitting diode device. A moisture barrier film is deposited in a high density plasma chemical vapor deposition chamber at a temperature of less than about 250 degrees Celsius, an inductively coupled plasma power frequency of about 2 MHz to about 13.56 MHz or a microwave power frequency of about 2.45 GHz, and a plasma density of about 1011 cm3 to about 1012 cm3. The moisture barrier film comprises a material selected from the group consisting of silicon oxynitride, silicon nitride, and silicon oxide. The moisture barrier film has a thickness of less than about 3,000 Angstroms, a refractive index between about 1.45 and 1.95, and an absorption coefficient of about zero at UV wavelengths. The moisture barrier film may be utilized in a thin film encapsulation structure or a thin film transistor.Type: ApplicationFiled: September 10, 2019Publication date: February 8, 2024Inventors: Tae Kyung WON, Soo Young CHOI, Dong Kil YIM, Young Dong LEE, Zongkai WU, Sanjay D. YADAV
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Patent number: 11854771Abstract: Embodiments of the present disclosure include methods and apparatus for depositing a plurality of layers on a large area substrate. In one embodiment, a processing chamber for plasma deposition is provided. The processing chamber includes a showerhead and a substrate support assembly. The showerhead is coupled to an RF power source and a ground and includes a plurality of perforated gas diffusion members. A plurality of plasma applicators is disposed within the showerhead, wherein one plasma applicator of the plurality of plasma applicators corresponds to one of the plurality of perforated gas diffusion members. Further, a DC bias power source is coupled to a substrate support assembly.Type: GrantFiled: May 24, 2021Date of Patent: December 26, 2023Assignee: APPLIED MATERIALS, INC.Inventors: Chien-Teh Kao, Tae Kyung Won, Carl A. Sorensen, Sanjay D. Yadav, Young Dong Lee, Shinichi Kurita, Soo Young Choi
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Patent number: 11770964Abstract: A method of encapsulating an organic light emitting diode (OLED) is provided. The method includes generating a first plasma in a process chamber, the first plasma having an electron density of at least 1011 cm?3 when an OLED device is positioned within the process chamber. The OLED device includes a substrate and an OLED formed on the substrate. The method further includes pretreating one or more surfaces of the OLED and substrate with the first plasma; depositing a first barrier layer comprising silicon and nitrogen over the OLED by generating a second plasma comprising silicon and nitrogen in the process chamber, the second plasma having an electron density of at least 1011 cm?3, and depositing a buffer layer over the first barrier layer; and depositing a second barrier layer comprising silicon and nitrogen over the buffer layer by generating a third plasma comprising silicon and nitrogen in the process chamber.Type: GrantFiled: March 25, 2021Date of Patent: September 26, 2023Assignee: Applied Materials, Inc.Inventors: Tae Kyung Won, Soo Young Choi, Sanjay D. Yadav
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Publication number: 20220122876Abstract: Embodiments of the disclosure include methods and apparatus for electrostatically coupling a mask to a substrate support in a deposition chamber. In one embodiment, a substrate support is disclosed that includes a substrate receiving surface, a recessed portion disposed about a periphery of the substrate receiving surface, an electrostatic chuck disposed below the substrate receiving surface, and a plurality of compressible buttons disposed within a respective opening formed in the recessed portion that form an electrical circuit with the electrostatic chuck.Type: ApplicationFiled: January 17, 2020Publication date: April 21, 2022Applicant: Applied Materials, Inc.Inventors: Jrjyan Jerry CHEN, Sanjay D. YADAV, Tae Kyung WON, Jun LI, Shouqian SHAO, Surendra Kanimihally SETTY
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Publication number: 20210292894Abstract: Embodiments described herein generally relate to a substrate processing chamber, and more specifically to an apparatus and method for monitoring a cleaning processing for the substrate processing chamber. A processor receives one or more temperature readings from one or more sensors disposed in a substrate processing chamber. The processor determines a peak for each temperature reading from the one or more temperature readings, which indicate an end of exothermic film clean reaction. Upon determining that each temperature reading has peaked, the process issues a notification to cease the cleaning process.Type: ApplicationFiled: August 18, 2017Publication date: September 23, 2021Applicants: Applied Materials, Inc., Applied Materials, Inc.Inventors: Fei PENG, Beom Soo PARK, Soo Young CHOI, Sanjay D. YADAV, Young-Jin CHOI, Himanshu JOSHI
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Publication number: 20210280392Abstract: Embodiments of the present disclosure include methods and apparatus for depositing a plurality of layers on a large area substrate. In one embodiment, a processing chamber for plasma deposition is provided. The processing chamber includes a showerhead and a substrate support assembly. The showerhead is coupled to an RF power source and a ground and includes a plurality of perforated gas diffusion members. A plurality of plasma applicators is disposed within the showerhead, wherein one plasma applicator of the plurality of plasma applicators corresponds to one of the plurality of perforated gas diffusion members. Further, a DC bias power source is coupled to a substrate support assembly.Type: ApplicationFiled: May 24, 2021Publication date: September 9, 2021Inventors: Chien-Teh KAO, Tae Kyung WON, Carl A. SORENSEN, Sanjay D. YADAV, Young Dong LEE, Shinichi KURITA, Soo Young CHOI
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Patent number: 11094508Abstract: Embodiments of the present disclosure include methods and apparatus for depositing a plurality of layers on a large area substrate. In one embodiment, a processing chamber for plasma deposition is provided. The processing chamber includes a showerhead and a substrate support assembly. The showerhead is coupled to an RF power source and a ground and includes a plurality of perforated gas diffusion members. A plurality of plasma applicators is disposed within the showerhead, wherein one plasma applicator of the plurality of plasma applicators corresponds to one of the plurality of perforated gas diffusion members. Further, a DC bias power source is coupled to a substrate support assembly.Type: GrantFiled: December 14, 2018Date of Patent: August 17, 2021Assignee: APPLIED MATERIALS, INC.Inventors: Chien-Teh Kao, Tae Kyung Won, Carl A. Sorensen, Sanjay D. Yadav, Young Dong Lee, Shinichi Kurita, Soo Young Choi
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Publication number: 20210210737Abstract: A method of encapsulating an organic light emitting diode (OLED) is provided. The method includes generating a first plasma in a process chamber, the first plasma having an electron density of at least 1011 cm?3 when an OLED device is positioned within the process chamber. The OLED device includes a substrate and an OLED formed on the substrate. The method further includes pretreating one or more surfaces of the OLED and substrate with the first plasma; depositing a first barrier layer comprising silicon and nitrogen over the OLED by generating a second plasma comprising silicon and nitrogen in the process chamber, the second plasma having an electron density of at least 1011 cm?3, and depositing a buffer layer over the first barrier layer; and depositing a second barrier layer comprising silicon and nitrogen over the buffer layer by generating a third plasma comprising silicon and nitrogen in the process chamber.Type: ApplicationFiled: March 25, 2021Publication date: July 8, 2021Inventors: Tae Kyung WON, Soo Young CHOI, Sanjay D. YADAV
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Patent number: 11053592Abstract: Embodiments disclosed herein generally relate to a substrate temperature monitoring system in a substrate support assembly. In one embodiment, the substrate support assembly includes a lift pin. The lift pin has a body. The body has an interior passage and a rounded top surface configured for contacting a substrate when in use. A substrate temperature sensor disposed in the interior passage.Type: GrantFiled: January 22, 2019Date of Patent: July 6, 2021Assignee: Applied Materials, Inc.Inventor: Sanjay D. Yadav
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Patent number: 10991916Abstract: A method of encapsulating an organic light emitting diode (OLED) is provided. The method includes generating a first plasma in a process chamber, the first plasma having an electron density of at least 1011 cm?3 when an OLED device is positioned within the process chamber. The OLED device includes a substrate and an OLED formed on the substrate. The method further includes pretreating one or more surfaces of the OLED and substrate with the first plasma; depositing a first barrier layer comprising silicon and nitrogen over the OLED by generating a second plasma comprising silicon and nitrogen in the process chamber, the second plasma having an electron density of at least 1011 cm?3, and depositing a buffer layer over the first barrier layer; and depositing a second barrier layer comprising silicon and nitrogen over the buffer layer by generating a third plasma comprising silicon and nitrogen in the process chamber.Type: GrantFiled: July 23, 2018Date of Patent: April 27, 2021Assignee: APPLIED MATERIALS, INC.Inventors: Tae Kyung Won, Soo Young Choi, Sanjay D. Yadav
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Patent number: 10751765Abstract: The present disclosure relates to a chemical vapor deposition system for processing large area substrates. The chemical vapor deposition system includes a chemical vapor deposition chamber comprising a chamber body having a plurality of sidewalls, a lid assembly, and a bottom. A substrate support extends upward from the bottom within the chamber body. A gas distribution plate is located within the lid assembly. One or more cleaning gas injector ports coupled to corresponding one or more inlets in the plurality of sidewalls. Each of the one or more cleaning gas injector ports has a substantially oval-shaped or circular-shaped cleaning gas nozzle configured to provide reactive species from a remote plasma source to clean an underside of the gas distribution plate.Type: GrantFiled: August 13, 2018Date of Patent: August 25, 2020Assignee: APPLIED MATERIALS, INC.Inventors: Tae Kyung Won, Young Dong Lee, Chien-Teh Kao, Soo Young Choi, Sanjay D. Yadav
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Patent number: 10697063Abstract: The present disclosure relates to a corner spoiler designed to decrease high deposition rates on corner regions of substrates by changing the gas flow. In one embodiment, a corner spoiler for a processing chamber includes an L-shaped body fabricated from a dielectric material, wherein the L-shaped body is configured to change plasma distribution at a corner of a substrate in the processing chamber. The L-shaped body includes a first and second leg, wherein the first and second legs meet at an inside corner of the L-shaped body. The length of the first or second leg is twice the distance defined between the first or second leg and the inside corner. In another embodiment, a shadow frame for a depositing chamber includes a rectangular shaped body having a rectangular opening therethrough, and one or more corner spoilers coupled to the rectangular shaped body at corners of the rectangular shaped body.Type: GrantFiled: January 30, 2015Date of Patent: June 30, 2020Assignee: APPLIED MATERIALS, INC.Inventors: Lai Zhao, Gaku Furuta, Qunhua Wang, Robin L. Tiner, Beom Soo Park, Soo Young Choi, Sanjay D. Yadav
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Publication number: 20200194233Abstract: Embodiments of the present disclosure include methods and apparatus for depositing a plurality of layers on a large area substrate. In one embodiment, a processing chamber for plasma deposition is provided. The processing chamber includes a showerhead and a substrate support assembly. The showerhead is coupled to an RF power source and a ground and includes a plurality of perforated gas diffusion members. A plurality of plasma applicators is disposed within the showerhead, wherein one plasma applicator of the plurality of plasma applicators corresponds to one of the plurality of perforated gas diffusion members. Further, a DC bias power source is coupled to a substrate support assembly.Type: ApplicationFiled: December 14, 2018Publication date: June 18, 2020Inventors: Chien-Teh KAO, Tae Kyung WON, Carl A. SORENSEN, Sanjay D. YADAV, Young Dong LEE, Shinichi KURITA, Soo Young CHOI
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Publication number: 20200047222Abstract: The present disclosure relates to a chemical vapor deposition system for processing large area substrates. The chemical vapor deposition system includes a chemical vapor deposition chamber comprising a chamber body having a plurality of sidewalls, a lid assembly, and a bottom. A substrate support extends upward from the bottom within the chamber body. A gas distribution plate is located within the lid assembly. One or more cleaning gas injector ports coupled to corresponding one or more inlets in the plurality of sidewalls. Each of the one or more cleaning gas injector ports has a substantially oval-shaped or circular-shaped cleaning gas nozzle configured to provide reactive species from a remote plasma source to clean an underside of the gas distribution plate.Type: ApplicationFiled: August 13, 2018Publication date: February 13, 2020Inventors: Tae Kyung WON, Young Dong LEE, Chien-Teh KAO, Soo Young CHOI, Sanjay D. YADAV
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Patent number: 10312475Abstract: Embodiments of the present disclosure generally describe a method for depositing a barrier layer of SiN using a high density plasma chemical vapor deposition (HDP-CVD) process, and in particular, controlling a film stress of the deposited SiN layer by biasing the substrate during the deposition process.Type: GrantFiled: June 5, 2017Date of Patent: June 4, 2019Assignee: APPLIED MATERIALS, INC.Inventors: Tae Kyung Won, Soo Young Choi, Sanjay D. Yadav, Carl A. Sorensen, Chien-Teh Kao, Suhail Anwar, Young Dong Lee
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Publication number: 20190153603Abstract: Embodiments disclosed herein generally relate to a substrate temperature monitoring system in a substrate support assembly. In one embodiment, the substrate support assembly includes a lift pin. The lift pin has a body. The body has an interior passage and a rounded top surface configured for contacting a substrate when in use. A substrate temperature sensor disposed in the interior passage.Type: ApplicationFiled: January 22, 2019Publication date: May 23, 2019Inventor: Sanjay D. YADAV
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Publication number: 20190036085Abstract: A method of encapsulating an organic light emitting diode (OLED) is provided. The method includes generating a first plasma in a process chamber, the first plasma having an electron density of at least 1011 cm?3 when an OLED device is positioned within the process chamber. The OLED device includes a substrate and an OLED formed on the substrate. The method further includes pretreating one or more surfaces of the OLED and substrate with the first plasma; depositing a first barrier layer comprising silicon and nitrogen over the OLED by generating a second plasma comprising silicon and nitrogen in the process chamber, the second plasma having an electron density of at least 1011 cm?3, and depositing a buffer layer over the first barrier layer; and depositing a second barrier layer comprising silicon and nitrogen over the buffer layer by generating a third plasma comprising silicon and nitrogen in the process chamber.Type: ApplicationFiled: July 23, 2018Publication date: January 31, 2019Inventors: Tae Kyung WON, Soo Young CHOI, Sanjay D. YADAV
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Publication number: 20180340257Abstract: Embodiments described herein relate to a plasma enhanced chemical vapor deposition (PECVD) chamber and diffuser assembly for processing large area flat panel display substrates. The diffuser includes a first plate having a plurality of first bores formed therein, a second plate having a second plurality of bores formed therein, and a third plate having a third plurality of bores formed therein. The second plate is disposed between the first plate and the second plate. The first plate, second plate, and third plate are brazed to form a diffuser having a unitary body.Type: ApplicationFiled: July 7, 2017Publication date: November 29, 2018Inventors: Umesha ACHARY, Sanjay D. YADAV, Lai ZHAO, Gaku FURUTA, Ko-Ta SHIH, Soo Young CHOI