Patents by Inventor Sanjay L. Patil
Sanjay L. Patil has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7189842Abstract: High-density, miniaturized arrays including high surface areas. Arrays described include substrate with a coating of linking agents, as well as arrays with reactants affixed to the substrates. Methods of manufacturing high-density arrays of reactants. The methods include the use of oriented, heat shrink films and elastomeric materials. Methods of functionalizing a substrate with linking agents for subsequent affixation of reactants are also disclosed herein.Type: GrantFiled: June 11, 2002Date of Patent: March 13, 2007Assignee: 3M Innovative Properties CompanyInventors: Kurt J. Halverson, Sanjay L. Patil, Jerald K. Rasmussen
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Patent number: 6881538Abstract: Materials for use in miniaturized arrays, the arrays, and methods of manufacturing. Materials for making arrays described include a substrate with a silicon-containing layer, optionally with linking agents and reactants.Type: GrantFiled: March 5, 2000Date of Patent: April 19, 2005Assignee: 3M Innovative Properties CompanyInventors: Louis C. Haddad, Moses M. David, Kurt J. Halverson, Sanjay L. Patil, Jerald K. Rasmussen, James I. Hembre
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Patent number: 6841258Abstract: High-density, miniaturized arrays including high surface areas. Arrays described include substrate with a coating of linking agents, as well as arrays with reactants affixed to the substrates. Methods of manufacturing high-density arrays of reactants. The methods include the use of oriented, heat shrink films and elastomeric materials. Methods of functionalizing a substrate with linking agents for subsequent affixation of reactants are also disclosed herein.Type: GrantFiled: January 30, 2002Date of Patent: January 11, 2005Assignee: 3M Innovative Properties CompanyInventors: Kurt J. Halverson, Sanjay L. Patil, Jerald K. Rasmussen
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Patent number: 6783838Abstract: A coated laminate having an ionic surface including a shrinkable polymeric film, an ionic coating and, optionally, a hydrogel is disclosed. A method for transferring sample molecules from a matrix to a coated laminate having an ionic surface also is disclosed.Type: GrantFiled: April 30, 2001Date of Patent: August 31, 2004Assignee: 3M Innovative Properties CompanyInventors: Patrick L. Coleman, Kurt J. Halverson, James I. Hembre, Sanjay L. Patil, Anila Prabhu, Raj Rajagopal, Jerald K. Rasmussen, Barbara C. Swenson, Patrick S. Quint
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Patent number: 6664060Abstract: The present invention provides high-density arrays including mask layers and methods of manufacturing the same. The arrays are formed on a polymeric substrate and include a mask layer. Various linking agents, linking agent coatings, and/or reactants may be provided on the mask layer. Where present, the linking agents and reactants preferably operate together to capture a desired analyte which can then be detected based on an electromagnetic signal, e.g., fluorescence, that is emitted by the analyte in response to excitation energy incident on the array. With the mask layer in place, the signal-to-background ratio provided by the arrays can be increased.Type: GrantFiled: July 20, 2001Date of Patent: December 16, 2003Assignee: 3M Innovative Properties CompanyInventors: Sanjay L. Patil, Kurt J. Halverson, Robin E. Wright
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Patent number: 6593089Abstract: The present invention provides high-density arrays including mask layers and methods of manufacturing the same. The arrays are formed on a polymeric substrate and include a mask layer. Various linking agents, linking agent coatings, and/or reactants may be provided on the mask layer. Where present, the linking agents and reactants preferably operate together to capture a desired analyte which can then be detected based on an electromagnetic signal, e.g., fluorescence, that is emitted by the analyte in response to excitation energy incident on the array. With the mask layer in place, the signal-to-background ratio provided by the arrays can be increased.Type: GrantFiled: July 20, 2001Date of Patent: July 15, 2003Assignee: 3M Innovative Properties CompanyInventors: Sanjay L. Patil, Kurt J. Halverson, Robin E. Wright
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Patent number: 6573338Abstract: High-density, miniaturized arrays including high surface areas. Arrays described include substrate with a coating of linking agents, as well as arrays with reactants affixed to the substrates. Methods of manufacturing high-density arrays of reactants. The methods include the use of oriented, heat shrink films and elastomeric materials. Methods of functionalizing a substrate with linking agents for subsequent affixation of reactants are also disclosed herein.Type: GrantFiled: January 30, 2002Date of Patent: June 3, 2003Assignee: 3M Innovative Properties CompanyInventors: Kurt J. Halverson, Sanjay L. Patil, Jerald K. Rasmussen
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Patent number: 6548607Abstract: High-density, miniaturized arrays including high surface areas. Arrays described include substrate with a coating of linking agents, as well as arrays with reactants affixed to the substrates. Methods of manufacturing high-density arrays of reactants. The methods include the use of oriented, heat shrink films and elastomeric materials. Methods of functionalizing a substrate with linking agents for subsequent affixation of reactants are also disclosed herein.Type: GrantFiled: January 30, 2002Date of Patent: April 15, 2003Assignee: 3M Innovative Properties CompanyInventors: Kurt J. Halverson, Sanjay L. Patil, Jerald K. Rasmussen
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Publication number: 20030040125Abstract: Methods for performing immunological assays are provided. The methods allow performing immunological assays with increased sensitivity, increased specificity, or both. Kits for performing immunological assays having increased sensitivity, increased specificity, or both, are also provided.Type: ApplicationFiled: August 21, 2001Publication date: February 27, 2003Applicant: 3M Innovative Properties CompanyInventors: Stephanie F. Bernatchez, Barbara C. Swenson, Kurt J. Halverson, Sanjay L. Patil, Anila Prabhu, Jerald K. Rasmussen
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Publication number: 20030036090Abstract: Articles, such as high density arrays, on heat-relaxable substrates that can be relaxed by exposure to thermal energy are disclosed, along with methods of manufacturing the arrays, and systems/apparatus for relaxing arrays using electromagnetic energy. The arrays may themselves include electromagnetic energy sensitive material in their construction, in which case exposure of the arrays to suitable electromagnetic energy can provide the thermal energy required to cause the arrays to relax. In other embodiments, the arrays may not include an electromagnetic energy sensitive material in their construction, in which case the arrays may be heated indirectly, i.e., by locating the arrays within a system or apparatus that includes an electromagnetic energy sensitive material and transferring the thermal energy from the electromagnetic energy sensitive material to the array by, e.g., conduction.Type: ApplicationFiled: October 3, 2002Publication date: February 20, 2003Applicant: 3M Innovative Properties CompanyInventors: Sanjay L. Patil, Daniel C. Duan, Kurt J. Halverson, Pierre H. LePere
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Patent number: 6482638Abstract: Articles, such as high density arrays, on heat-relaxable substrates that can be relaxed by exposure to thermal energy are disclosed, along with methods of manufacturing the arrays, and systems/apparatus for relaxing arrays using electromagnetic energy. The arrays may themselves include electromagnetic energy sensitive material in their construction, in which case exposure of the arrays to suitable electromagnetic energy can provide the thermal energy required to cause the arrays to relax. In other embodiments, the arrays may not include an electromagnetic energy sensitive material in their construction, in which case the arrays may be heated indirectly, i.e., by locating the arrays within a system or apparatus that includes an electromagnetic energy sensitive material and transferring the thermal energy from the electromagnetic energy sensitive material to the array by, e.g., conduction.Type: GrantFiled: November 8, 2000Date of Patent: November 19, 2002Assignee: 3M Innovative Properties CompanyInventors: Sanjay L. Patil, Daniel C. Duan, Kurt J. Halverson, Pierre H. LePere
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Publication number: 20020160530Abstract: Methods of transferring molecules from a matrix to a coated laminate having an ionic surface are disclosed. Coated laminates having an ionic surface also are disclosed.Type: ApplicationFiled: April 30, 2001Publication date: October 31, 2002Applicant: 3M Innovative Properties CompanyInventors: Patrick L. Coleman, Kurt J. Halverson, James I. Hembre, Sanjay L. Patil, Anila Prabhu, Raj Rajagopal, Jerald K. Rasmussen, Barbara C. Swenson, Patrick S. Quint
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Publication number: 20020160367Abstract: A coated laminate having an ionic surface including a shrinkable polymeric film, an ionic coating and, optionally, a hydrogel is disclosed. A method for transferring sample molecules from a matrix to a coated laminate having an ionic surface also is disclosed.Type: ApplicationFiled: April 30, 2001Publication date: October 31, 2002Applicant: 3M Innovative Properties CompanyInventors: Patrick L. Coleman, Kurt J. Halverson, James I. Hembre, Sanjay L. Patil, Anila Prabhu, Raj Rajagopal, Jerald K. Rasmussen, Barbara C. Swenson, Patrick S. Quint
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Publication number: 20020143110Abstract: High-density, miniaturized arrays including high surface areas. Arrays described include substrate with a coating of linking agents, as well as arrays with reactants affixed to the substrates. Methods of manufacturing high-density arrays of reactants. The methods include the use of oriented, heat shrink films and elastomeric materials. Methods of functionalizing a substrate with linking agents for subsequent affixation of reactants are also disclosed herein.Type: ApplicationFiled: January 30, 2002Publication date: October 3, 2002Applicant: 3M Innovative Properties CompanyInventors: Kurt J. Halverson, Sanjay L. Patil, Jerald K. Rasmussen
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Publication number: 20020143111Abstract: High-density, miniaturized arrays including high surface areas. Arrays described include substrate with a coating of linking agents, as well as arrays with reactants affixed to the substrates. Methods of manufacturing high-density arrays of reactants. The methods include the use of oriented, heat shrink films and elastomeric materials. Methods of functionalizing a substrate with linking agents for subsequent affixation of reactants are also disclosed herein.Type: ApplicationFiled: January 30, 2002Publication date: October 3, 2002Applicant: 3M Innovative Properties CompanyInventors: Kurt J. Halverson, Sanjay L. Patil, Jerald K. Rasmussen
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Publication number: 20020142306Abstract: A method for transferring molecules from a matrix to a laminate comprising a shrinkable polymeric film and a surface coating is disclosed.Type: ApplicationFiled: March 28, 2001Publication date: October 3, 2002Applicant: 3M Innovative Properties CompanyInventors: Patrick L. Coleman, Kurt J. Halverson, James I. Hembre, Sanjay L. Patil, Anila Prabhu, Raj Rajagopal, Jerald K. Rasmussen, Barbara C. Swenson
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Publication number: 20020122917Abstract: High-density, miniaturized arrays including high surface areas. Arrays described include substrate with a coating of linking agents, as well as arrays with reactants affixed to the substrates. Methods of manufacturing high-density arrays of reactants. The methods include the use of oriented, heat shrink films and elastomeric materials. Methods of functionalizing a substrate with linking agents for subsequent affixation of reactants are also disclosed herein.Type: ApplicationFiled: January 30, 2002Publication date: September 5, 2002Applicant: 3M Innovative Properties CompanyInventors: Kurt J. Halverson, Sanjay L. Patil, Jerald K. Rasmussen
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Patent number: 6395483Abstract: The present invention provides high-density arrays including mask layers and methods of manufacturing the same. The arrays are formed on a polymeric substrate and include a mask layer. Various linking agents, linking agent coatings, and/or reactants may be provided on the mask layer. Where present, the linking agents and reactants preferably operate together to capture a desired analyte which can then be detected based on an electromagnetic signal, e.g., fluorescence, that is emitted by the analyte in response to excitation energy incident on the array. With the mask layer in place, the signal-to-background ratio provided by the arrays can be increased.Type: GrantFiled: October 1, 1999Date of Patent: May 28, 2002Assignee: 3M Innovative Properties CompanyInventors: Sanjay L. Patil, Kurt J. Halverson, Robin E. Wright
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Patent number: 6376619Abstract: High-density, miniaturized arrays including high surface areas. Arrays described include substrate with a coating of linking agents, as well as arrays with reactants affixed to the substrates. Methods of manufacturing high-density arrays of reactants. The methods include the use of oriented, heat shrink films and elastomeric materials. Methods of functionalizing a substrate with linking agents for subsequent affixation of reactants are also disclosed herein.Type: GrantFiled: April 7, 1999Date of Patent: April 23, 2002Assignee: 3M Innovative Properties CompanyInventors: Kurt J. Halverson, Sanjay L. Patil, Jerald K. Rasmussen
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Publication number: 20010053527Abstract: The present invention provides high-density arrays including mask layers and methods of manufacturing the same. The arrays are formed on a polymeric substrate and include a mask layer. Various linking agents, linking agent coatings, and/or reactants may be provided on the mask layer. Where present, the linking agents and reactants preferably operate together to capture a desired analyte which can then be detected based on an electromagnetic signal, e.g., fluorescence, that is emitted by the analyte in response to excitation energy incident on the array. With the mask layer in place, the signal-to-background ratio provided by the arrays can be increased.Type: ApplicationFiled: July 20, 2001Publication date: December 20, 2001Applicant: 3M Innovative Properties CompanyInventors: Sanjay L. Patil, Kurt J. Halverson, Robin E. Wright