Patents by Inventor Sanjay Rajaram
Sanjay Rajaram has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11728191Abstract: A system includes a substrate support on which to receive a transparent substrate, a non-contact sensor adapted to detect and image a dot pattern etched on a front surface of the transparent substrate, and a processing device attached to the non-contact sensor. The processing device may determine, using imaging data from the non-contact sensor, an orientation of a right-angled edge of the dot pattern. The processing device may determine, based on the orientation of the right-angled edge, whether a front surface of the transparent substrate is facing up or facing down. The processing device may also direct a robot to transfer the transparent substrate to a processing chamber dependent on whether the front surface of the transparent substrate is facing up or facing down.Type: GrantFiled: May 5, 2020Date of Patent: August 15, 2023Assignee: Applied Materials, Inc.Inventors: Michelle Alejandra Wong, Sanjay Rajaram
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Publication number: 20220392789Abstract: An electronic device processing system includes a factory interface (FI), substrate carrier(s), a humidity sensor, an oxygen sensor, and an environmental control system coupled to the FI. A processor of the environmental control system is to cause inert gas to be provided to an FI chamber and inert gas exhausted from the FI chamber to be circulated back into the FI chamber. The processor is also to identify conditions to be satisfied before opening a door of the substrate carriers. The processor is to control the humidity level based on detection by the humidity sensor or the oxygen level based on detection by the oxygen sensor. If the one or more conditions are satisfied, the processor is to open the carrier door to enable passing of substrates between the FI chamber and the substrate carriers.Type: ApplicationFiled: August 19, 2022Publication date: December 8, 2022Inventors: Sushant S. Koshti, Dean C. Hruzek, Ayan Majumdar, John C. Menk, Helder T. Lee, Sangram Patil, Sanjay Rajaram, Douglas Baumgarten, Nir Merry
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Patent number: 11450539Abstract: Electronic device processing systems including environmental control of the factory interface are described. One electronic device processing system has a factory interface having a factory interface chamber, a load lock apparatus coupled to the factory interface, one or more substrate carriers coupled to the factory interface, and an environmental control system coupled to the factory interface and operational to monitor or control one of: relative humidity, temperature, an amount of oxygen, or an amount of inert gas within the factory interface chamber. In another aspect, purge of a carrier purge chamber within the factory interface chamber is provided. Methods for processing substrates are described, as are numerous other aspects.Type: GrantFiled: August 24, 2018Date of Patent: September 20, 2022Assignee: Applied Materials, Inc.Inventors: Sushant S. Koshti, Dean C. Hruzek, Ayan Majumdar, John C. Menk, Helder T. Lee, Sangram Patil, Sanjay Rajaram, Douglas B. Baumgarten, Nir Merry
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Patent number: 11282724Abstract: A factory interface for an electronic device processing system includes a factory interface chamber, an inert gas supply conduit, an exhaust conduit and an inert gas recirculation system. The inert gas supply conduit supplies an inert gas into the factory interface chamber. The exhaust conduit exhausts the inert gas from the factory interface chamber. The inert gas recirculation system recirculates the inert gas exhausted from the factory interface chamber back into the factory interface chamber.Type: GrantFiled: August 7, 2019Date of Patent: March 22, 2022Assignee: Applied Materials, Inc.Inventors: Sushant S. Koshti, Dean C. Hruzek, Ayan Majumdar, John C. Menk, Helder T. Lee, Sangram Patil, Sanjay Rajaram, Douglas Baumgarten, Nir Merry
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Publication number: 20210351050Abstract: A system includes a substrate support on which to receive a transparent substrate, a non-contact sensor adapted to detect and image a dot pattern etched on a front surface of the transparent substrate, and a processing device attached to the non-contact sensor. The processing device may determine, using imaging data from the non-contact sensor, an orientation of a right-angled edge of the dot pattern. The processing device may determine, based on the orientation of the right-angled edge, whether a front surface of the transparent substrate is facing up or facing down. The processing device may also direct a robot to transfer the transparent substrate to a processing chamber dependent on whether the front surface of the transparent substrate is facing up or facing down.Type: ApplicationFiled: May 5, 2020Publication date: November 11, 2021Inventors: Michelle Alejandra Wong, Sanjay Rajaram
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Publication number: 20190362997Abstract: A factory interface for an electronic device processing system includes a factory interface chamber, an inert gas supply conduit, an exhaust conduit and an inert gas recirculation system. The inert gas supply conduit supplies an inert gas into the factory interface chamber. The exhaust conduit exhausts the inert gas from the factory interface chamber. The inert gas recirculation system recirculates the inert gas exhausted from the factory interface chamber back into the factory interface chamber.Type: ApplicationFiled: August 7, 2019Publication date: November 28, 2019Inventors: Sushant S. Koshti, Dean C. Hruzek, Ayan Majumdar, John C. Menk, Helder T. Lee, Sangram Patil, Sanjay Rajaram, Douglas Baumgarten, Nir Merry
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Patent number: 10192765Abstract: Electronic device processing systems including environmental control of the factory interface are described. One electronic device processing system has a factory interface having a factory interface chamber, a load lock apparatus coupled to the factory interface, one or more substrate carriers coupled to the factory interface, and an environmental control system coupled to the factory interface and operational to monitor or control one of: relative humidity, temperature, an amount of oxygen, or an amount of inert gas within the factory interface chamber. In another aspect, purge of a carrier purge chamber within the factory interface chamber is provided. Methods for processing substrates are described, as are numerous other aspects.Type: GrantFiled: August 11, 2014Date of Patent: January 29, 2019Assignee: Applied Materials, Inc.Inventors: Sushant S. Koshti, Dean C. Hruzek, Ayan Majumdar, John C. Menk, Helder T. Lee, Sangram Patil, Sanjay Rajaram, Douglas Baumgarten, Nir Merry
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Publication number: 20180366355Abstract: Electronic device processing systems including environmental control of the factory interface are described. One electronic device processing system has a factory interface having a factory interface chamber, a load lock apparatus coupled to the factory interface, one or more substrate carriers coupled to the factory interface, and an environmental control system coupled to the factory interface and operational to monitor or control one of: relative humidity, temperature, an amount of oxygen, or an amount of inert gas within the factory interface chamber. In another aspect, purge of a carrier purge chamber within the factory interface chamber is provided. Methods for processing substrates are described, as are numerous other aspects.Type: ApplicationFiled: August 24, 2018Publication date: December 20, 2018Inventors: Sushant S. Koshti, Dean C. Hruzek, Ayan Majumdar, John C. Menk, Helder T. Lee, Sangram Patil, Sanjay Rajaram, Douglas B. Baumgarten, Nir Merry
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Publication number: 20150045961Abstract: Electronic device processing systems including environmental control of the factory interface are described. One electronic device processing system has a factory interface having a factory interface chamber, a load lock apparatus coupled to the factory interface, one or more substrate carriers coupled to the factory interface, and an environmental control system coupled to the factory interface and operational to monitor or control one of: relative humidity, temperature, an amount of oxygen, or an amount of inert gas within the factory interface chamber. In another aspect, purge of a carrier purge chamber within the factory interface chamber is provided. Methods for processing substrates are described, as are numerous other aspects.Type: ApplicationFiled: August 11, 2014Publication date: February 12, 2015Inventors: Sushant S. Koshti, Dean C. Hruzek, Ayan Majumdar, John C. Menk, Helder T. Lee, Sangram Patil, Sanjay Rajaram, Douglas Baumgarten
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Patent number: 8460057Abstract: A computer-implemented method for process control in chemical mechanical polishing in which an initial pre-polishing thickness of a substrate is measured at a metrology station, a parameter of an endpoint algorithm is determined from the initial thickness of the substrate, a substrates is polished at a polishing station, and polishing stops when an endpoint criterion is detected using the endpoint algorithm.Type: GrantFiled: April 18, 2011Date of Patent: June 11, 2013Assignee: Applied Materials, Inc.Inventors: Boguslaw A. Swedek, Bret W. Adams, Sanjay Rajaram, David A. Chan, Manoocher Birang
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Publication number: 20110195528Abstract: A computer-implemented method for process control in chemical mechanical polishing in which an initial pre-polishing thickness of a substrate is measured at a metrology station, a parameter of an endpoint algorithm is determined from the initial thickness of the substrate, a substrates is polished at a polishing station, and polishing stops when an endpoint criterion is detected using the endpoint algorithm.Type: ApplicationFiled: April 18, 2011Publication date: August 11, 2011Inventors: Boguslaw A. Swedek, Bret W. Adams, Sanjay Rajaram, David A. Chan, Manoocher Birang
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Patent number: 7927182Abstract: A computer-implemented method for process control in chemical mechanical polishing in which an initial pre-polishing thickness of a substrate is measured at a metrology station, a parameter of an endpoint algorithm is determined from the initial thickness of the substrate, a substrates is polished at a polishing station, and polishing stops when an endpoint criterion is detected using the endpoint algorithm.Type: GrantFiled: September 4, 2009Date of Patent: April 19, 2011Assignee: Applied Materials, Inc.Inventors: Boguslaw A. Swedek, Bret W. Adams, Sanjay Rajaram, David A. Chan, Manoocher Birang
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Publication number: 20100062684Abstract: A computer-implemented method for process control in chemical mechanical polishing in which an initial pre-polishing thickness of a substrate is measured at a metrology station, a parameter of an endpoint algorithm is determined from the initial thickness of the substrate, a substrates is polished at a polishing station, and polishing stops when an endpoint criterion is detected using the endpoint algorithm.Type: ApplicationFiled: September 4, 2009Publication date: March 11, 2010Applicant: APPLIED MATERIALS, INC.Inventors: Boguslaw A. Swedek, Bret W. Adams, Sanjay Rajaram, David A. Chan, Manoocher Birang
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Patent number: 7585202Abstract: A computer-implemented method for process control in chemical mechanical polishing in which an initial pre-polishing thickness of a substrate is measured at a metrology station, a parameter of an endpoint algorithm is determined from the initial thickness of the substrate, a substrates is polished at a polishing station, and polishing stops when an endpoint criterion is detected using the endpoint algorithm.Type: GrantFiled: October 24, 2007Date of Patent: September 8, 2009Assignee: Applied Materials, Inc.Inventors: Boguslaw A. Swedek, Bret W. Adams, Sanjay Rajaram, David A. Chan, Manoocher Birang
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Publication number: 20080064300Abstract: A computer-implemented method for process control in chemical mechanical polishing in which an initial pre-polishing thickness of a substrate is measured at a metrology station, a parameter of an endpoint algorithm is determined from the initial thickness of the substrate, a substrates is polished at a polishing station, and polishing stops when an endpoint criterion is detected using the endpoint algorithm.Type: ApplicationFiled: October 24, 2007Publication date: March 13, 2008Applicant: APPLIED MATERIALS, INC.Inventors: Boguslaw Swedek, Bret Adams, Sanjay Rajaram, David Chan, Manoocher Birang
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Patent number: 7294039Abstract: A computer-implemented method for process control in chemical mechanical polishing in which an initial pre-polishing thickness of a substrate is measured at a metrology station, a parameter of an endpoint algorithm is determined from the initial thickness of the substrate, a substrates is polished at a polishing station, and polishing stops when an endpoint criterion is detected using the endpoint algorithm.Type: GrantFiled: August 24, 2006Date of Patent: November 13, 2007Assignee: Applied Materials, Inc.Inventors: Boguslaw A. Swedek, Bret W. Adams, Sanjay Rajaram, David A. Chan, Manoocher Birang
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Publication number: 20060286904Abstract: A computer-implemented method for process control in chemical mechanical polishing in which an initial pre-polishing thickness of a substrate is measured at a metrology station, a parameter of an endpoint algorithm is determined from the initial thickness of the substrate, a substrates is polished at a polishing station, and polishing stops when an endpoint criterion is detected using the endpoint algorithm.Type: ApplicationFiled: August 24, 2006Publication date: December 21, 2006Applicant: Applied Materials, Inc.Inventors: Boguslaw Swedek, Bret Adams, Sanjay Rajaram, David Chan, Manoocher Birang
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Patent number: 7101251Abstract: A computer program product for process control in chemical mechanical polishing is described. The product includes instructions to cause a processor to receive a measurement of an initial pre-polishing thickness of a layer of a substrate from a metrology station, determine a value for a parameter of an endpoint algorithm from the initial thickness of the substrate, receive a monitoring signal generated from monitoring in-situ polishing of the substrate, process the monitoring signal to detect a signal feature indicating a final or intermediate endpoint and send instructions to stop polishing when an endpoint criterion is detected using the endpoint algorithm with the determined value for the parameter.Type: GrantFiled: June 23, 2005Date of Patent: September 5, 2006Assignee: Applied Materials, Inc.Inventors: Boguslaw A. Swedek, Bret W. Adams, Sanjay Rajaram, David A. Chan, Manoocher Birang
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Publication number: 20050245170Abstract: A computer-implemented method for process control in chemical mechanical polishing in which an initial pre-polishing thickness of a substrate is measured at a metrology station, a parameter of an endpoint algorithm is determined from the initial thickness of the substrate, a substrates is polished at a polishing station, and polishing stops when an endpoint criterion is detected using the endpoint algorithm.Type: ApplicationFiled: June 23, 2005Publication date: November 3, 2005Inventors: Boguslaw Swedek, Bret Adams, Sanjay Rajaram, David Chan, Manoocher Birang
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Patent number: 6939198Abstract: A computer-implemented method for process control in chemical mechanical polishing in which an initial pre-polishing thickness of a substrate is measured at a metrology station, a parameter of an endpoint algorithm is determined from the initial thickness of the substrate, a substrates is polished at a polishing station, and polishing stops when an endpoint criterion is detected using the endpoint algorithm.Type: GrantFiled: December 27, 2002Date of Patent: September 6, 2005Assignee: Applied Materials, Inc.Inventors: Boguslaw A. Swedek, Bret W. Adams, Sanjay Rajaram, David A. Chan, Manoocher Birang