Patents by Inventor Sanjay Upasani

Sanjay Upasani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240015920
    Abstract: Described herein is a compact combined active and passive cooling system to cool electronic audio-video circuitry, wherein all of the AV circuitry and cooling system fits within an enclosure that can be installed in a standard wall gang-box located in interior walls of structures. The combined active and passive cooling system uses convection, conduction, and radiation in active and passive cooling modes to dissipate heat generated by the AV circuitry into the room in which the gang box is located, and further uses the wall plate surface to dissipate heat into the room.
    Type: Application
    Filed: July 6, 2022
    Publication date: January 11, 2024
    Applicant: Crestron Electronics Inc.
    Inventors: Mark LaBosco, Sanjay Upasani, Edward Joy, Dario Pagano, Alec Magrini
  • Publication number: 20230301015
    Abstract: An apparatus cools electronic circuitry. An enclosure surrounds the circuitry. Air intake holes are in an upper portion of a first panel that faces a first direction. Air exhaust holes are in an upper portion of a second panel that faces a second direction opposite the first. Air plenum piece is disposed within the enclosure, and a substantially planar portion extends from a first panel inner wall and ends a distance from a second panel inner wall. At least one tab extends from the substantially planar portion to an upper panel inner wall. The air plenum piece divides an enclosure interior into a first volume, enclosed by the first panel inner wall, substantially planar portion, at least one tab, and upper panel inner wall, into which the air intake holes open and a second volume into which the air exhaust holes open. The second volume is a remaining interior volume.
    Type: Application
    Filed: May 25, 2023
    Publication date: September 21, 2023
    Applicant: Crestron Electronics, Inc.
    Inventors: William P. Rehak, Albert Pedoeem, Alec J. Magrini, Sanjay Upasani
  • Patent number: 11711904
    Abstract: Apparatus cools electronic circuitry. An enclosure surrounds the circuitry. Air intake holes are only in a portion of a first panel that faces a first direction. Air exhaust holes are only in a portion of a second panel that faces a second direction opposite the first. Air plenum piece is disposed within the enclosure, and a substantially planar portion extends from a first panel inner wall and ends a distance from a second panel inner wall. At least one tab extends from the substantially planar portion to an upper panel inner wall. The air plenum piece divides an enclosure interior into a first volume, enclosed by the first panel inner wall, substantially planar portion, at least one tab, and upper panel inner wall, into which the air intake holes open and a second volume into which the air exhaust holes open. The second volume is a remaining interior volume.
    Type: Grant
    Filed: October 8, 2021
    Date of Patent: July 25, 2023
    Assignee: Crestron Electronics, Inc.
    Inventors: William P Rehak, Albert Pedoeem, Alec J Magrini, Sanjay Upasani
  • Patent number: 11683907
    Abstract: An apparatus cools electronic circuitry. An enclosure surrounds the electronic circuitry and has plural surfaces. Air intake holes are disposed in at least one surface and face at least one first direction. Air exhaust holes are disposed in at least another surface and face at least one second direction different than the first direction. A heat sink is in thermal contact with the circuitry and conducts heat generated by the circuitry. When a fan operates, air is drawn from an exterior of the enclosure through the air intake holes, absorbs heat from the heat sink, and then is directed through the air exhaust holes into the exterior of the enclosure. The heat sink is further in thermal contact with the enclosure so that when the fan does not operate, heat is drawn from the circuitry to the enclosure via the heat sink and is dissipated from the exterior.
    Type: Grant
    Filed: July 14, 2021
    Date of Patent: June 20, 2023
    Assignee: Crestron Electronics, Inc.
    Inventors: Albert Pedoeem, Kriss Replogle, Sanjay Upasani, Don Florczak
  • Publication number: 20220030742
    Abstract: Apparatus cools electronic circuitry. An enclosure surrounds the circuitry. Air intake holes are only in a portion of a first panel that faces a first direction. Air exhaust holes are only in a portion of a second panel that faces a second direction opposite the first. Air plenum piece is disposed within the enclosure, and a substantially planar portion extends from a first panel inner wall and ends a distance from a second panel inner wall. At least one tab extends from the substantially planar portion to an upper panel inner wall. The air plenum piece divides an enclosure interior into a first volume, enclosed by the first panel inner wall, substantially planar portion, at least one tab, and upper panel inner wall, into which the air intake holes open and a second volume into which the air exhaust holes open. The second volume is a remaining interior volume.
    Type: Application
    Filed: October 8, 2021
    Publication date: January 27, 2022
    Applicant: Crestron Electronics, Inc.
    Inventors: William P Rehak, Albert Pedoeem, Alec J Magrini, Sanjay Upasani
  • Publication number: 20210345521
    Abstract: An apparatus cools electronic circuitry. An enclosure surrounds the electronic circuitry and has plural surfaces. Air intake holes are disposed in at least one surface and face at least one first direction. Air exhaust holes are disposed in at least another surface and face at least one second direction different than the first direction. A heat sink is in thermal contact with the circuitry and conducts heat generated by the circuitry. When a fan operates, air is drawn from an exterior of the enclosure through the air intake holes, absorbs heat from the heat sink, and then is directed through the air exhaust holes into the exterior of the enclosure. The heat sink is further in thermal contact with the enclosure so that when the fan does not operate, heat is drawn from the circuitry to the enclosure via the heat sink and is dissipated from the exterior.
    Type: Application
    Filed: July 14, 2021
    Publication date: November 4, 2021
    Applicant: Crestron Electronics, Inc.
    Inventors: Albert Pedoeem, Kriss Replogle, Sanjay Upasani, Don Florczak
  • Patent number: 11076501
    Abstract: An apparatus cools electronic circuitry. An enclosure surrounds the electronic circuitry and has plural surfaces. Air intake holes are disposed in at least one surface and face at least one first direction. Air exhaust holes are disposed in at least another surface and face at least one second direction different than the first direction. A heat sink is in thermal contact with the circuitry and conducts heat generated by the circuitry. When a fan operates, air is drawn from an exterior of the enclosure through the air intake holes, absorbs heat from the heat sink, and then is directed through the air exhaust holes into the exterior of the enclosure. The heat sink is further in thermal contact with the enclosure so that when the fan does not operate, heat is drawn from the circuitry to the enclosure via the heat sink and is dissipated from the exterior.
    Type: Grant
    Filed: August 7, 2019
    Date of Patent: July 27, 2021
    Assignee: Crestron Electronics, Inc.
    Inventors: Albert Pedoeem, Kriss Replogle, Sanjay Upasani, Don Florczak
  • Publication number: 20200008317
    Abstract: An apparatus cools electronic circuitry. An enclosure surrounds the electronic circuitry and has plural surfaces. Air intake holes are disposed in at least one surface and face at least one first direction. Air exhaust holes are disposed in at least another surface and face at least one second direction different than the first direction. A heat sink is in thermal contact with the circuitry and conducts heat generated by the circuitry. When a fan operates, air is drawn from an exterior of the enclosure through the air intake holes, absorbs heat from the heat sink, and then is directed through the air exhaust holes into the exterior of the enclosure. The heat sink is further in thermal contact with the enclosure so that when the fan does not operate, heat is drawn from the circuitry to the enclosure via the heat sink and is dissipated from the exterior.
    Type: Application
    Filed: August 7, 2019
    Publication date: January 2, 2020
    Applicant: Crestron Electronics, Inc.
    Inventors: Albert Pedoeem, Kriss Replogle, Sanjay Upasani, Don Florczak
  • Patent number: 9407033
    Abstract: A touch screen device includes an electric power receptacle configured for being spill resistant. The electric power receptacle provides a fluidly isolated environment for each contact thereby allowing the electric power receptacle to pass a dielectric withstand test.
    Type: Grant
    Filed: January 20, 2015
    Date of Patent: August 2, 2016
    Assignee: Crestron Electronics Inc.
    Inventors: Kian-Mun Kong, George Feldstein, Wendy Feldstein, Dhirendra Patel, Sanjay Upasani
  • Publication number: 20150255914
    Abstract: A touch screen device includes an electric power receptacle configured for being spill resistant. The electric power receptacle provides a fluidly isolated environment for each contact thereby allowing the electric power receptacle to pass a dielectric withstand test.
    Type: Application
    Filed: January 20, 2015
    Publication date: September 10, 2015
    Inventors: Kian-Mun Kong, George Feldstein, Wendy Feldstein, Dhirendra Patel, Sanjay Upasani
  • Patent number: 6246762
    Abstract: Microphone sub-assemblies for direct mounting on a telephone handset inner substrate comprise a tubular housing containing a microphone having terminal pins electrically connected within the tubular housing to leads extending through the housing tubular wall. The leads provide contact springs for spring biased contact with conductive lands on the substrate. In one embodiment, the contact springs comprise coiled springs and, in another embodiment, the contact springs comprise leaf springs terminating in arcuate cam surfaces.
    Type: Grant
    Filed: May 11, 1998
    Date of Patent: June 12, 2001
    Assignee: Lucent Technologies, Inc.
    Inventors: Suresh Goyal, Pratod V. Kasbekar, Harish S. Mangrulkar, Sanjay Upasani
  • Patent number: 6128385
    Abstract: Acoustic component sub-assemblies for direct mounting on a telephone handset inner substrate comprise a tubular housing containing a component having terminal pins electrically connected within the tubular housing to coil springs extending outwardly through an open end of the tubular housing. The coil springs serve as component terminals for spring biased contact with conductive lands on the substrate. The tubular housing is press fitted within a seat on the substrate and contacted by the handset outer housing for being tightly clamped within the substrate seat.
    Type: Grant
    Filed: June 12, 1998
    Date of Patent: October 3, 2000
    Assignee: Lucent Technologies, Inc.
    Inventors: Suresh Goyal, Pratod V. Kasbekar, Harish S. Mangrulkar, Sanjay Upasani
  • Patent number: D389141
    Type: Grant
    Filed: December 30, 1994
    Date of Patent: January 13, 1998
    Assignee: Lucent Technologies Inc.
    Inventors: Mark Biasotti, John Edward Clarke, Michael L. Moroze, Michael John Nuttall, Dhirendra M. Patel, John Henry Schaffeld, Susan L. Tuttle, Sanjay Upasani
  • Patent number: D729179
    Type: Grant
    Filed: January 24, 2014
    Date of Patent: May 12, 2015
    Assignee: Crestron Electronics Inc.
    Inventors: King Woo Cheung, Wendy Feldstein, Dhirendra Patel, Sanjay Upasani, George Feldstein, William Cowles