Patents by Inventor Sanjay Vijayaraghavan

Sanjay Vijayaraghavan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230389241
    Abstract: A power converter assembly includes a housing, a cold plate in the housing, and a set of power converter components on the cold plate. The cold plate is configured to receive a coolant. A first medium in the housing surrounds the cold plate and components. An expandable heat transfer structure is attached to one of the cold plate and the housing.
    Type: Application
    Filed: December 15, 2022
    Publication date: November 30, 2023
    Inventors: Sanjay Vijayaraghavan, Libing Wang, Han Xiong, Kum Kang Huh, Di Pan, Mark Edward Dame, Rajib Datta, Alankrita Singh
  • Patent number: 11739744
    Abstract: A fluid mover and method of operating includes a pair of spaced electrodes, a power supply electrically coupled to the pair of spaced electrodes, and at least one environment sensor. The fluid mover also includes a controller configured to controllably operate at least one of the power supply or the pair of spaced electrodes.
    Type: Grant
    Filed: June 29, 2021
    Date of Patent: August 29, 2023
    Assignee: GE Aviation Systems Limited
    Inventors: Sanjay Vijayaraghavan, Krishnendu Saha, John Oliver Collins
  • Publication number: 20230233191
    Abstract: Systems and methods are provided for thermally conductive shock absorbers for medical imaging probes. An example medical imaging probe may have, at least, a transducer disposed underneath a contact surface of the medical imaging probe, with the transducer configured to transmit and receive signals based on a medical imaging technique; a support structure disposed underneath the transducer; and a thermally conductive shock absorber (TCSA) layer disposed between the transducer and the support structure, with the thermally conductive shock absorber (TCSA) layer is configured to facilitate both of thermal transfer in a direction from the contact surface into the support structure, and absorbing at least a portion of impact force applied to at least the contact surface. The support structure may include a heat sink.
    Type: Application
    Filed: January 25, 2022
    Publication date: July 27, 2023
    Inventors: Sanjay Vijayaraghavan, Steffen Fleischer, Warren Lee, Ashif Iqbal
  • Publication number: 20220003227
    Abstract: A fluid mover and method of operating includes a pair of spaced electrodes, a power supply electrically coupled to the pair of spaced electrodes, and at least one environment sensor. The fluid mover also includes a controller configured to controllably operate at least one of the power supply or the pair of spaced electrodes.
    Type: Application
    Filed: June 29, 2021
    Publication date: January 6, 2022
    Inventors: Sanjay Vijayaraghavan, Krishnendu Saha, John Oliver Collins
  • Publication number: 20200360635
    Abstract: A ventilator system is presented. The ventilator system includes a controller configured to generate a first control signal for a first time-period and a second control signal for a second time-period during an inspiration time. Also, the ventilator system includes a rotary pump configured to change one of a pressure and a flow rate of the drive gas to a first value if the first control signal is received and change the one of the pressure and the flow rate of the drive gas to a second value if the second control signal is received. Further, the rotary pump is configured to deliver the drive gas to cause supply of a medical gas during the inspiration time, wherein the medical gas is supplied based on the one of the pressure and the flow rate of the drive gas delivered from the rotary pump.
    Type: Application
    Filed: November 8, 2018
    Publication date: November 19, 2020
    Inventors: Gunaranjan CHAUDHRY, Sanjay VIJAYARAGHAVAN, Arun GIRIMAJI, Prakash SR
  • Patent number: 10079485
    Abstract: A power generation system is provided. The system includes a prime mover for transforming a first energy to a second energy. The system also includes an induction generator operatively coupled to the prime mover and configured to generate electrical power using the second energy. The system further includes an inverter electrically coupled to the induction generator for controlling a terminal voltage of the induction generator during a grid-loss condition. The system also includes a power dissipating device operatively coupled to the inverter for dissipating power generated by the induction generator during the grid-loss condition.
    Type: Grant
    Filed: October 21, 2015
    Date of Patent: September 18, 2018
    Assignee: General Electric Company
    Inventors: Amol Rajaram Kolwalkar, Arvind Kumar Tiwari, Rajendra Naik, Sanjay Vijayaraghavan
  • Publication number: 20160111872
    Abstract: A power generation system is provided. The system includes a prime mover for transforming a first energy to a second energy. The system also includes an induction generator operatively coupled to the prime mover and configured to generate electrical power using the second energy. The system further includes an inverter electrically coupled to the induction generator for controlling a terminal voltage of the induction generator during a grid-loss condition. The system also includes a power dissipating device operatively coupled to the inverter for dissipating power generated by the induction generator during the grid-loss condition.
    Type: Application
    Filed: October 21, 2015
    Publication date: April 21, 2016
    Inventors: Amol Rajaram KOLWALKAR, Arvind Kumar TIWARI, Rajendra NAIK, Sanjay VIJAYARAGHAVAN
  • Patent number: 8451604
    Abstract: A mechanism is described for chimney-based cooling of computer components. A method of embodiments of the invention includes determining heat-emitting components of a computing device. The method further includes coupling a chimney to one or more of the heat-emitting components such that chimney effect of the chimney is used to guide air associated with a component in and out of the chimney.
    Type: Grant
    Filed: December 22, 2010
    Date of Patent: May 28, 2013
    Assignee: Intel Corporation
    Inventors: Anandaroop Bhattacharya, Mark MacDonald, Sanjay Vijayaraghavan
  • Publication number: 20120073789
    Abstract: A mechanism is described for chimney-based cooling of computer components. A method of embodiments of the invention includes determining heat-emitting components of a computing device. The method further includes coupling a chimney to one or more of the heat-emitting components such that chimney effect of the chimney is used to guide air associated with a component in and out of the chimney.
    Type: Application
    Filed: December 22, 2010
    Publication date: March 29, 2012
    Applicant: Intel Corporation, Inc.
    Inventors: Anandaroop Bhattacharya, Mark MacDonald, Sanjay Vijayaraghavan