Abstract: A system for inspecting components is provided. The system includes an image data system that generates image data of the component, such as from a position overlooking the top of a bumped wafer. An interferometry inspection system is connected to the image data system and receives the image data, and analyzes the image data to locate interference fringing that is used to determine the surface coordinates of the bump contacts.

Abstract: A system for inspecting components is provided. The system includes an axial lighting system that illuminates the component with axial lighting to allow one or more features of the component to be located, such as by causing protruding features to be brighter than the background and recessed features to be darker than the background. An off-axis lighting system illuminates the component with off-axis lighting in the absence of the axial lighting to allow the component to be inspected to locate one or more features, such as a bump contact.

Abstract: A system for inspecting a component is provided. The system includes an interferometer having a coated mirror, such as a coating that allows only a fraction of light to pass, where the coating has a predetermined thickness. An interference inspection system receives reflected light from the component through the interferometer and determines whether interference is occurring at each of two or more predetermined areas, such as at point corresponding to a bump contact and at a second point corresponding to a substrate. The thickness of the coating is related to a height difference between two or more of the predetermined areas, such as by creating interference at both areas by changing the reflection path length by an amount required to cause simultaneous interference fringing for a designed height difference.

Abstract: A system for inspecting a component is provided. The system includes an interferometer having a coated mirror, such as a coating that allows only a fraction of light to pass, where the coating has a predetermined thickness. An interference inspection system receives reflected light from the component through the interferometer and determines whether interference is occurring at each of two or more predetermined areas, such as at point corresponding to a bump contact and at a second point corresponding to a substrate. The thickness of the coating is related to a height difference between two or more of the predetermined areas, such as by creating interference at both areas by changing the reflection path length by an amount required to cause simultaneous interference fringing for a designed height difference.

Abstract: A system for inspecting components is provided. The system includes an image data system that generates image data of the component, such as from a position overlooking the top of a bumped wafer. An interferometry inspection system is connected to the image data system and receives the image data, and analyzes the image data to locate interference fringing that is used to determine the surface coordinates of the bump contacts.