Patents by Inventor Sanjeev Sathe
Sanjeev Sathe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 7510324Abstract: A method of inspecting articles using an imaging inspection apparatus which utilizes a plurality of individual imaging devices for directing beams onto the articles having objects therein to detect the objects based on established criteria. The method involves the enhanced cooling of the heat-generating imaging devices in which a fan directs cooling fluid onto a plurality of deflectors which in turn direct said fluid onto selected ones of said imaging devices.Type: GrantFiled: August 2, 2007Date of Patent: March 31, 2009Assignee: Endicott Interconnect Technologies, Inc.Inventors: Ashwinkumar C. Bhatt, Varaprasad V. Calmidi, James J. McNamara, Jr., Sanjeev Sathe
-
Patent number: 7510912Abstract: A method of making a wirebond electronic package which includes a semiconductor chip bonded to the upper surface of an organic laminate substrate, including to a thermal material located on the substrate and comprised of a plurality of thermally conductive concentric lines. These lines form paths of heat escape for the chip during operation thereof and may operate in combination with other elements to extend the heat paths. Concentric lines also assure sufficient bonding area on the substrate so as to prevent delamination of the chip from the substrate as may occur during high temperatures associated with subsequent processing such as solder ball re-flow.Type: GrantFiled: July 9, 2007Date of Patent: March 31, 2009Assignee: Endicott Interconnect Technologies, Inc.Inventors: David V. Caletka, Varaprasad V. Calmidi, Sanjeev Sathe
-
Patent number: 7490984Abstract: A method of making an imaging inspection apparatus which involves positioning a plurality of individual imaging devices (e.g., X-ray Computer Tomography scanning devices) on a frame for directing beams onto articles having objects therein to detect the objects based on established criteria. The method also involves providing a cooling structure in such a manner that it will direct cooling fluid onto the imaging devices to cool these during apparatus operation.Type: GrantFiled: February 22, 2008Date of Patent: February 17, 2009Assignee: Endicott Interconnect Technologies, Inc.Inventors: Ashwinkumar C. Bhatt, Varaprasad V. Calmidi, James J. McNamara, Jr., Sanjeev Sathe
-
Publication number: 20080170670Abstract: A method of inspecting articles using an imaging inspection apparatus which utilizes a plurality of individual imaging devices for directing beams onto the articles having objects therein to detect the objects based on established criteria. The method involves the enhanced cooling of the heat-generating imaging devices in which a fan directs cooling fluid onto a plurality of deflectors which in turn direct said fluid onto selected ones of said imaging devices.Type: ApplicationFiled: August 2, 2007Publication date: July 17, 2008Applicant: Endicott Interconnect Technologies , Inc.Inventors: Ashwinkumar C. Bhatt, Varaprasad V. Calmidi, James J. McNamara, Sanjeev Sathe
-
Publication number: 20080144768Abstract: A method of making an imaging inspection apparatus which involves positioning a plurality of individual imaging devices (e.g., X-ray Computer Tomography scanning devices) on a frame for directing beams onto articles having objects therein to detect the objects based on established criteria. The method also involves providing a cooling structure in such a manner that it will direct cooling fluid onto the imaging devices to cool these during apparatus operation.Type: ApplicationFiled: February 22, 2008Publication date: June 19, 2008Applicant: Endicott Interconnect Technologies, Inc.Inventors: Ashwinkumar C. Bhatt, Varaprasad V. Calmidi, James J. McNamara,, Sanjeev Sathe
-
Patent number: 7354197Abstract: An imaging inspection apparatus which utilizes a plurality of individual imaging devices (e.g., X-ray Computer Tomography scanning devices) positioned on a frame for directing beams onto articles having objects therein to detect the objects based on established criteria. The apparatus utilizes a cooling structure to provide cooling to the imaging devices.Type: GrantFiled: June 1, 2005Date of Patent: April 8, 2008Assignee: Endicott Interconnect Technologies, Inc.Inventors: Ashwinkumar C. Bhatt, Varaprasad V. Calmidi, James J. McNamara, Jr., Sanjeev Sathe
-
Publication number: 20080029888Abstract: A method and article of fabrication is described featuring a solder layer having a serpentine, interrupted, or interdigitated boundary. The non-planar design of the boundary layer increases the fatigue life of the solder joint by limiting the damage caused by micro-cracking. This irregularity of the solder boundary constrains the propagation of cracks by creating obstacles along the crack path, redirecting the crack away from the intermetallic layer, or by increasing the path along which the crack propagates.Type: ApplicationFiled: December 14, 2006Publication date: February 7, 2008Applicant: International Business Machines CorporationInventors: Seungbae Park, Sanjeev Sathe, Aleksander Zubelewicz
-
Publication number: 20070254408Abstract: A method of making a wirebond electronic package which includes a semiconductor chip bonded to the upper surface of an organic laminate substrate, including to a thermal material located on the substrate and comprised of a plurality of thermally conductive concentric lines. These lines form paths of heat escape for the chip during operation thereof and may operate in combination with other elements to extend the heat paths. Concentric lines also assure sufficient bonding area on the substrate so as to prevent delamination of the chip from the substrate as may occur during high temperatures associated with subsequent processing such as solder ball re-flow.Type: ApplicationFiled: July 9, 2007Publication date: November 1, 2007Applicant: Endicott Interconnect Technologies, Inc.Inventors: David Caletka, Varaprasad Calmidi, Sanjeev Sathe
-
Patent number: 7261466Abstract: An imaging inspection apparatus which utilizes a plurality of individual imaging devices (e.g., X-ray Computer Tomography scanning devices) for directing beams onto articles having objects therein to detect the objects based on established criteria. The apparatus utilizes a cooling structure for directing cooling fluid (e.g., air) toward and over the devices, the structure including a fan for directing cooling fluid in a first direction and a plurality of fluid deflectors for deflecting at least part of the fluid toward respective ones of the devices.Type: GrantFiled: June 1, 2005Date of Patent: August 28, 2007Assignee: Endicott Interconnect Technologies, Inc.Inventors: Ashwinkumar C. Bhatt, Varaprasad V. Calmidi, James J. McNamara, Jr., Sanjeev Sathe
-
Patent number: 7253518Abstract: A wirebond electronic package which includes a semiconductor chip bonded to the upper surface of an organic laminate substrate, including to a thermal material located on the substrate and comprised of a plurality of thermally conductive concentric lines. These lines form paths of heat escape for the chip during operation thereof and may operate in combination with other elements to extend the heat paths. Concentric lines also assure sufficient bonding area on the substrate so as to prevent delamination of the chip from the substrate as may occur during high temperatures associated with subsequent processing such as solder ball re-flow. A method of making the package is also provided, as is an information handling system (e.g., computer) adapted for utilizing such packages.Type: GrantFiled: June 15, 2005Date of Patent: August 7, 2007Assignee: Endicott Interconnect Technologies, Inc.Inventors: David V. Caletka, Varaprasad V. Calmidi, Sanjeev Sathe
-
Publication number: 20070009084Abstract: An imaging inspection apparatus which utilizes a plurality of individual imaging devices (e.g., X-ray Computer Tomography scanning devices) for directing beams onto articles having objects therein to detect the objects based on established criteria. The apparatus utilizes a cooling structure for directing cooling fluid (e.g., air) toward and over the devices, the structure including a fan for directing cooling fluid in a first direction and a plurality of fluid deflectors for deflecting at least part of the fluid toward respective ones of the devices.Type: ApplicationFiled: June 1, 2005Publication date: January 11, 2007Applicant: Endicott Interconnect Technologies, Inc.Inventors: Ashwinkumar Bhatt, Varaprasad Calmidi, James McNamara, Sanjeev Sathe
-
Publication number: 20060284304Abstract: A wirebond electronic package which includes a semiconductor chip bonded to the upper surface of an organic laminate substrate, including to a thermal material located on the substrate and comprised of a plurality of thermally conductive concentric lines. These lines form paths of heat escape for the chip during operation thereof and may operate in combination with other elements to extend the heat paths. Concentric lines also assure sufficient bonding area on the substrate so as to prevent delamination of the chip from the substrate as may occur during high temperatures associated with subsequent processing such as solder ball re-flow. A method of making the package is also provided, as is an information handling system (e.g., computer) adapted for utilizing such packages.Type: ApplicationFiled: June 15, 2005Publication date: December 21, 2006Applicant: Endicott Interconnect Technologies, Inc.Inventors: David Caletka, Varaprasad Calmidi, Sanjeev Sathe
-
Publication number: 20060274891Abstract: An imaging inspection apparatus which utilizes a plurality of individual imaging devices (e.g., X-ray Computer Tomography scanning devices) positioned on a frame for directing beams onto articles having objects therein to detect the objects based on established criteria. The apparatus utilizes a cooling structure to provide cooling to the imaging devices.Type: ApplicationFiled: June 1, 2005Publication date: December 7, 2006Applicant: Endicott Interconnect Technologies, Inc.Inventors: Ashwinkumar Bhatt, Varaprasad Calmidi, James McNamara, Sanjeev Sathe
-
Patent number: 6788859Abstract: A method and an article made by a method for embedding optical fibers into an organic laminate structure. The optical fiber cabling, along with its cladding, is placed upon a first laminate layer that includes a composite made of silica fillers and a frictionless material such as polytetrafluoroethylene (PTFE). Then a second layer of PTFE material with silica fillers and copper sheeting is placed on top of the PTFE with silica fillers composite. The PTFE material with silica fillers flows about the optical fibers at a temperature approximately fifty degrees above the PTFE with silica fillers material's melting point. This procedure completely encases the optical fibers within an opaque sheath.Type: GrantFiled: October 31, 2002Date of Patent: September 7, 2004Assignee: International Business Machines CorporationInventors: Voya R. Markovich, Sandeep B. Sane, Sanjeev Sathe
-
Patent number: 6347901Abstract: A method and article of fabrication is described featuring a solder layer having a serpentine, interrupted, or interdigitated boundary. The non-planar design of the boundary layer increases the fatigue life of the solder joint by limiting the damage caused by micro-cracking. This irregularity of the solder boundary constrains the propagation of cracks by creating obstacles along the crack path, redirecting the crack away from the intermetallic layer, or by increasing the path along which the crack propagates.Type: GrantFiled: November 1, 1999Date of Patent: February 19, 2002Assignee: International Business Machines CorporationInventors: Seungbae Park, Sanjeev Sathe, Aleksander Zubelewicz
-
Patent number: 5604445Abstract: An apparatus, and a corresponding method, for stress testing both wire bond-type semiconductor chips and C4-type semiconductor chips is disclosed.Type: GrantFiled: December 21, 1994Date of Patent: February 18, 1997Assignee: International Business Machines CorporationInventors: Kishor V. Desai, Maganlal S. Patel, Sanjeev Sathe