Patents by Inventor Sanjit Kumar Das

Sanjit Kumar Das has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low-k interlevel dielectric layer (ILD)
    Patent number: 7009280
    Abstract: An interlevel dielectric layer (ILD) comprises a low-k dielectric layer; and a low-k dielectric film, deposited under compressive stress, atop the dielectric layer. The dielectric layer comprises a low-k material, such as an organosilicon glass (OSG) or a SiCOH material. The dielectric film has a thickness, which is 2%–10% of the thickness of the dielectric layer, has a similar chemical composition to the dielectric layer, but has a different morphology than the dielectric layer. The dielectric film is deposited under compressive stress, in situ, at or near the end of the dielectric layer deposition by altering a process that was used to deposit the low-k dielectric layer.
    Type: Grant
    Filed: April 28, 2004
    Date of Patent: March 7, 2006
    Assignee: International Business Machines Corporation
    Inventors: Matthew Angyal, Edward Paul Barth, Sanjit Kumar Das, Charles Robert Davis, Habib Hichri, William Francis Landers, Jia Lee