Abstract: An eye imaging system can include a head-wearable eye imager positioning helmet with an outer shell and a conformable liner that can include head location fiducials defining a specified plane. An attached articulating eye imager fixture can include an eye imager positioning indication system to indicate a position of the eye imager with respect to an eye of the patient for acquiring one or more images at the indicated position such that images recorded over a chronic period of time are assessable using the position information. The articulating eye imager fixture can include an articulating arm and an eye imager mount. The system can assist the patient with helmet positioning, and can automatically position a fundus camera or other eye imager for accurate image capture and analysis, such as using a trained machine learning model for patient evaluation, monitoring, or diagnosis.

Abstract: An eye imaging system can include a head-wearable fundus camera positioning helmet with an outer shell and a conformable liner that can include head location fiducials defining a specified plane. An attached articulating fundus camera fixture can include a fundus camera positioning indication system to indicate a position of the fundus camera with respect to an eye of the patient for acquiring one or more fundus camera images at the indicated position such that fundus camera images recorded over a chronic period of time are assessable using the position information from the fundus camera positioning indication system. The articulating fundus camera fixture can include an articulating arm and a fundus camera mount. The system can assist the patient with helmet positioning, and can automatically position the fundus camera for accurate image capture and analysis, such as using a trained machine learning model for patient evaluation, monitoring, or diagnosis.

Abstract: In certain embodiments, chemical sensing may be facilitated. In some embodiments, a fluid sample may be received at a sensing device having one or more chemical sensitivities. A reaction of the sensing device to a chemical in the fluid sample may be detected based on the one or more chemical sensitivities of the sensing device. For example, a sensing unit within the sensing device having a particular chemical sensitivity may react with a chemical in the fluid sample. In some embodiments, the reaction may be a change in resistivity or piezoresistivity. One or more chemicals in the fluid sample associated with the reaction of the sensing device may be identified. In some embodiments, machine learning models or neural networks may facilitate the identification of chemicals associated with the reaction.

Abstract: The present disclosure provides methods and systems for fabricating at least a portion of a three-dimensional (3D) object. In an example, at least one feedstock may be directed from a source of the at least one feedstock towards a base. The at least one feedstock may comprise a polymeric material and a cross-linking agent. The cross-linking agent may be in an inactive state. Next, first layer of the at least one feedstock may be deposited adjacent to a second layer previously deposited adjacent to the base. The first layer may correspond to at least a portion of the 3D object. During or subsequent to deposition adjacent to the second layer, the cross-linking agent in the first layer may be in an active state to induce cross-linking between the polymeric material in the first layer and a polymeric material in the second layer.

Abstract: The present disclosure provides methods and systems for printing a three-dimensional (3D) object. A model of the 3D object, in computer memory, may be received. Next, at least one filament material from a source may be directed towards a build platform configured to support the 3D object, thereby depositing a first layer of a portion of the 3D object. The at least one filament material may be used to deposit a second layer corresponding to at least a portion of the 3D object. The first and second layers may be deposited in accordance with the model of the 3D object. While, the second layer is being deposited, at least one energy beam may selectively heat a first portion of the first layer and a second portion of the at least one filament material.

Abstract: A composite wafer carrier according to an embodiment of the present invention comprises an operative portion formed of a first thermoplastic material and a support portion formed of a second different thermoplastic material. One of the operative portion and support portion is overmolded onto the other to form a gapless hermitic interface that securely bonds the portions together. The operative portion may be a transparent window, a portion of a latching mechanism or a wafer contact portion. Preferred embodiments of the invention include wafer carriers with said features, process carriers with said features and a process for manufacturing wafer carriers with said features.

Abstract: Improved processes for forming shaped articles comprise extruding a composite comprising a polymer and at least one additive, and shaping the composite to form an article having a desired shape. Generally, the extruding and shaping steps are performed on a single process line, which allows the shaped articles to be produced in a continuous process. Due to the continuous process design, shaped articles made by the improved process can be produced in large quantities at a low cost per article. In some embodiments, a shaping station can be employed to shape the extruded composite. The shaping station can comprise a laser machining apparatus, a hot stamping apparatus, rollers having a predetermined pattern, or combinations thereof.

Abstract: Fluorinated polymers of interest have aromatic groups in their repeat units and at least about 25% of available aromatic ring positions fluorinated. The aromatic rings can be along the polymer backbone and/or along the side chains of the polymer. In particular, for polymers with the aromatic groups along the polymer backbone generally at least about 55 percent of the aromatic ring positions are fluorinated. Approaches for the fluorination of aromatic polymers can involve a polymer melt that is contacted with an appropriate fluorination reagent. In other approaches, the fluorination is performed in a polymer solution. The fluorination reactions can be performed in a batch operation or a continuous operation.

Abstract: The present invention relates generally to a system and method for including a thin protective containment thermopolymer film (10), such as PEEK, in the molding process for handlers, transporters, carriers, trays and like devices utilized in the semiconductor processing industry. The thermoplastic film (10) of predetermined size and shape is selectively placed along a shaping surface (26) in a mold cavity (22) for alignment with a desired target surface of a moldable material. The film is permanently adhered to the moldable material. As a result, a compatible polymer film (10) can be selectively bonded only to those target surfaces where performance characteristics such as abrasion resistance, heat resistance, chemical resistance, outgassing containment, rigidity enhancement, hardness, creep reduction, fluid absorption containment, and the like is needed.

Abstract: Improved compositions comprise a polymer and carbon fibers, such as nanotubes. In some embodiments, the carbon fibers, e.g., nanotubes, can be mechanically blended or incorporated into the polymer, while in some embodiments carbon nanotubes also may be covalently bonded to the polymer to form corresponding covalent materials. In particular, the polymer can be covalently bonded to the side walls of the carbon nanotubes to form a composite with particularly desirable mechanical properties. Specifically, the bonding of the polymer to the nanotube sidewall can provide desirable mechanical properties of the composite due to the orientation relative to other types of association between the nanotubes and the polymer. The processing of the nanotubes can be facilitated by the dispersion of the nanotubes in an aqueous solution comprising a hydrophylic polymer, such as ethyl vinyl acetate.

Abstract: A composite wafer carrier according to an embodiment of the present invention comprises an operative portion formed of a first thermoplastic material and a support portion formed of a second different thermoplastic material. One of the operative portion and support portion is overmolded onto the other to form a gapless hermitic interface that securely bonds the portions together. The operative portion may be a transparent window, a portion of a latching mechanism or a wafer contact portion. Preferred embodiments of the invention include wafer carriers with said features, process carriers with said features and a process for manufacturing wafer carriers with said features.

Abstract: The present invention relates generally to a system and method for including a thin protective containment polymer film (100), such as Peek in the molding process for fluid processing devices utilized in the semiconductor processing industry. The thermoplastic film of predetermined size and shape is selectively placed along a shaping surface (110) in a mold cavity (106) for alignment with a desired target surface of a molded material. The molding processes causes a surface of the film (100) to bond to a contact surface of the moldable material such that the film (100) is permanently adhered to the moldable material. As a result, a comparable polymer film can be selectively bonded only to those target surfaces where performance characteristics such as abrasion resistance, heat resistance, chemical resistance, outgassing prevention, rigidity enhancement, fluid absorption prevention, ultraviolet resistance, friction reduction and the like is needed.

Abstract: The present invention relates generally to a system and method for including a thin conductive polymer film, such carbon-filled PEEK, in the molding process for handlers, transporters, carriers, trays and like devices utilized in the semiconductor processing industry. The conductive film of predetermined size and shape is selectively placed along a shaping surface in a mold cavity for alignment with a desired target surface of a moldable material. The molding process causes a surface of the film to bond to a contact surface of the moldable material such that the film is permanently adhered to the moldable material. As a result, a compatible conductive polymer can be selectively bonded only to those target surfaces where ESD is needed.

Abstract: A fire retardant container for semiconductor wafers having an enclosure portion formed from polycarbonate plastic. The enclosure has a top, a bottom, a pair of opposing sides, a back, and an open front. The container includes a door to close the open front having an outer surface portion formed from a plastic material having a flame propagation index of not greater than 9.0 (m/s 1/2)(kW/m)−2/3.