Patents by Inventor Sanjiv Chhahira

Sanjiv Chhahira has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7855490
    Abstract: There is disclosed for use with a piezoelectric stack, first and second side electrodes, each side electrode having two serpentine shape members positioned in a common plane, where the two serpentine shape members of an electrode have alternately spaced conductive fingers which project outward toward each other. The conductive fingers are adapted to be electrically coupled to the ends of alternate ones of internal electrode layers of the piezoelectric stack. The undersides of the conductive fingers which contact the ends of the internal electrodes are provided with a solder material to provide good electrical contact by applying the soldered finger to the internal electrode and applying heat to reflow the solder. The serpentine shape of the side electrodes here disclosed provides high flexibility which can absorb displacement of the internal electrodes as they move up, down, in and out as the piezoelectric layers of the stack expand and contract.
    Type: Grant
    Filed: November 14, 2008
    Date of Patent: December 21, 2010
    Assignee: Interplex Nas, Inc.
    Inventors: Joseph Praino, Sanjiv Chhahira
  • Publication number: 20090127982
    Abstract: There is disclosed for use with a piezoelectric stack, first and second side electrodes, each side electrode having two serpentine shape members positioned in a common plane, where the two serpentine shape members of an electrode have alternately spaced conductive fingers which project outward toward each other. The conductive fingers are adapted to be electrically coupled to the ends of alternate ones of internal electrode layers of the piezoelectric stack. The undersides of the conductive fingers which contact the ends of the internal electrodes are provided with a solder material to provide good electrical contact by applying the soldered finger to the internal electrode and applying heat to reflow the solder. The serpentine shape of the side electrodes here disclosed provides high flexibility which can absorb displacement of the internal electrodes as they move up, down, in and out as the piezoelectric layers of the stack expand and contract.
    Type: Application
    Filed: November 14, 2008
    Publication date: May 21, 2009
    Applicant: Interplex NAS, Inc.
    Inventors: Joseph Praino, Sanjiv Chhahira