Patents by Inventor Sanjiv Lakhanpal

Sanjiv Lakhanpal has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Mid-bus connection to traces on a printed circuit board
    Patent number: 7889512
    Abstract: A technique for observing signaling on the traces between ICs on a PC board without introducing significant signal degradation is provided. A route-through connector footprint allows the use of a standard connector without the use of stub traces. The route-through connector footprint allows a standard connector to be introduced directly into the line traces routed between ICs. Because stub traces are not used, this technique for mechanical interconnection into the line traces on a PC board allows for a single board layout to be used for both test and production. Additionally, because stub traces are not used, signal quality is minimally impacted and testing can be performed at operational speeds improving the reliability of the test function. The use of a route-through connector footprint additionally saves PC board space and cost.
    Type: Grant
    Filed: October 11, 2002
    Date of Patent: February 15, 2011
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Michael J. Borsch, Steven R. Klassen, Sanjiv Lakhanpal