Abstract: A particle portal imaging (PPI) system and method are provided that can be used to provide a “beam’s eye view” of a patient’s anatomy as a charged particle beam is delivered to a target region of the patient’s body. The PPI system is capable of performing real-time image acquisition and in-situ dose monitoring using at least exit neutrons generated within the patient. The PPI system can perform charged particle treatment (PT) monitoring to monitor the particle beam being used for PT.

Abstract: A particle portal imaging (PPI) system and method are provided that can be used to provide a “beam's eye view” of a patient's anatomy as a charged particle beam is delivered to a target region of the patient's body. The PPI system is capable of performing real-time image acquisition and in-situ dose monitoring using at least exit neutrons generated within the patient. The PPI system can perform charged particle treatment (PT) monitoring to monitor the particle beam being used for PT.

Abstract: X-ray backscatter imaging (XBI) methods and systems are provided that enable depth-sensitive information to be obtained from images acquired during a single scan from a single side of an object being imaged. The depth-sensitive information is used in combination with other image information acquired during the scan to produce high-resolution 2-D or 3-D images, where at least one of the dimensions of the 2-D or 3-D image corresponds to depth in the object.

Abstract: A particle portal imaging (PPI) system and method are provided that can be used to provide a “beam's eye view” of a patient's anatomy as a charged particle beam is delivered to a target region of the patient's body. The PPI system is capable of performing real-time image acquisition and in-situ dose monitoring using at least exit neutrons generated within the patient. The PPI system can perform charged particle treatment (PT) monitoring to monitor the particle beam being used for PT.

Abstract: X-ray backscatter imaging (XBI) methods and systems are provided that enable depth-sensitive information to be obtained from images acquired during a single scan from a single side of an object being imaged. The depth-sensitive information is used in combination with other image information acquired during the scan to produce high-resolution 2-D or 3-D images, where at least one of the dimensions of the 2-D or 3-D image corresponds to depth in the object.

Abstract: Embodiments of the invention relate to a method for x-ray radiography and apparatus for use in x-ray radiography. Specific embodiments can utilize a grid having a plurality of apertures therethrough with optical waveguides positioned in the apertures. The optical waveguides can incorporate a scintillating material, preferably throughout, that absorbs incident x-ray radiation and emits light that is then guided by the optical waveguide. In a specific embodiment, x-ray radiation incident on a first end of the aperture is absorbed by the scintillating material in the optical waveguide and light is emitted by the same scintillating material, a portion of which is guided by the optical waveguide to a second end of the aperture. In addition, secondary electrons created by absorption of the x-ray radiation by the scintillating material can be absorbed by the scintillating material to create more light such that a magnification effect can occur. The light exiting the second end of the aperture can then be detected.

Abstract: Embodiments of the invention relate to a method for x-ray radiography and apparatus for use in x-ray radiography. Specific embodiments can utilize a grid having a plurality of apertures therethrough with optical waveguides positioned in the apertures. The optical waveguides can incorporate a scintillating material, preferably throughout, that absorbs incident x-ray radiation and emits light that is then guided by the optical waveguide. In a specific embodiment, x-ray radiation incident on a first end of the aperture is absorbed by the scintillating material in the optical waveguide and light is emitted by the same scintillating material, a portion of which is guided by the optical waveguide to a second end of the aperture. In addition, secondary electrons created by absorption of the x-ray radiation by the scintillating material can be absorbed by the scintillating material to create more light such that a magnification effect can occur. The light exiting the second end of the aperture can then be detected.

Abstract: An easier and cheaper way to obtain multilayer circuit board is by using a flexible circuit board and folding it in an organized pattern. Flexible circuit has the unique property of being a three-dimensional circuit that can be shaped in multiplanar configurations, rigidized in specific areas, and molded to backer boards for specific applications. The folded circuit is fabricated from a series of foldable circuit board strips and rigid circuit board strips which are interconnected, folded, and bonded into a composite structure. The foldable strips may have prefolds arranged so that a group of upper foldable strips and lower foldable strips are folded in opposite directions. A plurality of intermediate portions are stacked on each other by the folding the foldable strips in opposite directions. The folded circuit, can be bonded after a first fold, or folded further to achieve a greater reduction in area and subsequently be bonded as a composite multilayer structure.

Abstract: An easier and cheaper way to obtain multilayer circuit board is by using a flexible circuit board and folding it in an organized pattern. Flexible circuit has the unique property of being a three-dimensional circuit that can be shaped in multiplanar configurations, rigidized in specific areas, and molded to backer boards for specific applications. The folded circuit is fabricated from a series of foldable circuit board strips and rigid circuit board strips which are interconnected, folded, and bonded into a composite structure. The foldable strips may have prefolds arranged so that a group of upper foldable strips and lower foldable strips are folded in opposite directions. A plurality of intermediate portions are stacked on each other by the folding the foldable strips in opposite directions. The folded circuit, can be bonded after a first fold, or folded further to achieve a greater reduction in area and subsequently be bonded as a composite multilayer structure.

Abstract: An easier and cheaper way to obtain multilayer circuit board is by using a flexible circuit board and folding it in an organized pattern. Flexible circuit has the unique property of being a three-dimensional circuit that can be shaped in multiplanar configurations, rigidized in specific areas, and molded to backer boards for specific applications. The folded circuit is fabricated from a series of foldable circuit board strips and rigid circuit board strips which are interconnected, folded, and bonded into a composite structure. The foldable strips may have prefolds arranged so that a group of upper foldable strips and lower foldable strips are folded in opposite directions. A plurality of intermediate portions are stacked on each other by the folding the foldable strips in opposite directions. The folded circuit, can be bonded after a first fold, or folded further to achieve a greater reduction in area and subsequently be bonded as a composite multilayer structure.

Abstract: An easier and cheaper way to obtain multilayer circuit board is by using a flexible circuit board and folding it in an organized pattern. Flexible circuit has the unique property of being a three-dimensional circuit that can be shaped in multiplanar configurations, rigidized in specific areas, and molded to backer boards for specific applications. The folded circuit is fabricated from a series of foldable circuit board strips and rigid circuit board strips which are interconnected, folded, and bonded into a composite structure. The foldable strips may have prefolds arranged so that a group of upper foldable strips and lower foldable strips are folded in opposite directions. A plurality of intermediate portions are stacked on each other by the folding the foldable strips in opposite directions. The folded circuit, can be bonded after a first fold, or folded further to achieve a greater reduction in area and subsequently be bonded as a composite multilayer structure.