Patents by Inventor Sanjiv Sinha

Sanjiv Sinha has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11872772
    Abstract: An apparatus for fabricating a hybrid tube includes a rotatable mandrel and a first housing configured to translate alongside the rotatable mandrel while dispensing a first strip to be helically wound about the mandrel. The first housing includes an angle adjustment mechanism to control a dispensation angle of the first strip. The apparatus also includes least one energy or adhesive source for bonding overlapping strip portions on the rotatable mandrel and forming the hybrid tube. The at least one energy or adhesive source is configured for translation alongside the rotatable mandrel.
    Type: Grant
    Filed: July 19, 2021
    Date of Patent: January 16, 2024
    Assignee: THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
    Inventors: Sanjiv Sinha, Placid M. Ferreira, Nenad Miljkovic, Manjunath C. Rajagopal, Gowtham Kuntumalla, Akhilesh Sanjay Somani
  • Patent number: 11797466
    Abstract: Methods and systems for managing power distribution and/or mechanical load in data processing systems is provided. The power distribution may be managed using multifunction power buses that may relieve a motherboard of a data processing system from distributing power. The mechanical load may be managed using an adapter plate that may relieve the motherboard of the data processing system from providing for attachment of devices based on the location of the mechanical mounting hardware on the devices. By doing so, motherboards may be standardized and customized for use with various devices.
    Type: Grant
    Filed: April 14, 2022
    Date of Patent: October 24, 2023
    Assignee: Dell Products L.P.
    Inventors: Corey Dean Hartman, Sanjiv Sinha
  • Publication number: 20230333609
    Abstract: Methods and systems for managing power distribution and/or mechanical load in data processing systems is provided. The power distribution may be managed using multifunction power buses that may relieve a motherboard of a data processing system from distributing power. The mechanical load may be managed using an adapter plate that may relieve the motherboard of the data processing system from providing for attachment of devices based on the location of the mechanical mounting hardware on the devices. By doing so, motherboards may be standardized and customized for use with various devices.
    Type: Application
    Filed: April 14, 2022
    Publication date: October 19, 2023
    Inventors: COREY DEAN HARTMAN, SANJIV SINHA
  • Publication number: 20230334001
    Abstract: Methods and systems for managing power distribution and/or mechanical load in data processing systems is provided. The power distribution may be managed using multifunction power buses that may relieve a motherboard of a data processing system from distributing power. The mechanical load may be managed using an adapter plate that may relieve the motherboard of the data processing system from providing for attachment of devices based on the location of the mechanical mounting hardware on the devices. By doing so, motherboards may be standardized and customized for use with various devices.
    Type: Application
    Filed: April 14, 2022
    Publication date: October 19, 2023
    Inventors: COREY DEAN HARTMAN, SANJIV SINHA
  • Patent number: 11480479
    Abstract: A microscale thermocouple probe for intracellular temperature measurements comprises a cantilever structure including a suspended portion extending from a support, where the suspended portion includes first and second conductive lines on a surface thereof. The first and second conductive lines extend along the surface and meet at a tip of the suspended portion to define a thermocouple junction.
    Type: Grant
    Filed: January 29, 2020
    Date of Patent: October 25, 2022
    Assignee: THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
    Inventors: Sanjiv Sinha, Manjunath C. Rajagopal
  • Patent number: 11436177
    Abstract: A floating device location identification system includes a chassis defining floating device housings and including respective chassis location identification features adjacent each floating device housing that identify the relative location of that floating device housing. A floating device may be positioned in a first floating device housing and adjacent a first chassis location identification feature. The first floating device includes floating device cabling connector(s) that are connected via a cabling subsystem to a device location identification subsystem, and chassis engagement elements that are coupled to the floating device cabling connector(s) and that engage the first chassis location identification feature.
    Type: Grant
    Filed: July 24, 2020
    Date of Patent: September 6, 2022
    Assignee: Dell Products L.P.
    Inventors: William Andrew Smith, Robert G. Bassman, Salvador Jimenez, III, Sanjiv Sinha, Noman Mithani
  • Publication number: 20220027302
    Abstract: A floating device location identification system includes a chassis defining floating device housings and including respective chassis location identification features adjacent each floating device housing that identify the relative location of that floating device housing. A floating device may be positioned in a first floating device housing and adjacent a first chassis location identification feature. The first floating device includes floating device cabling connector(s) that are connected via a cabling subsystem to a device location identification subsystem, and chassis engagement elements that are coupled to the floating device cabling connector(s) and that engage the first chassis location identification feature.
    Type: Application
    Filed: July 24, 2020
    Publication date: January 27, 2022
    Inventors: William Andrew Smith, Robert G. Bassman, Salvador Jimenez, III, Sanjiv Sinha, Noman Mithani
  • Publication number: 20220024154
    Abstract: An apparatus for fabricating a hybrid tube includes a rotatable mandrel and a first housing configured to translate alongside the rotatable mandrel while dispensing a first strip to be helically wound about the mandrel. The first housing includes an angle adjustment mechanism to control a dispensation angle of the first strip. The apparatus also includes least one energy or adhesive source for bonding overlapping strip portions on the rotatable mandrel and forming the hybrid tube. The at least one energy or adhesive source is configured for translation alongside the rotatable mandrel.
    Type: Application
    Filed: July 19, 2021
    Publication date: January 27, 2022
    Inventors: Sanjiv Sinha, Placid M. Ferreira, Nenad Miljkovic, Manjunath C. Rajagopal, Gowtham Kuntumalla, Akhilesh Sanjay Somani
  • Publication number: 20200249103
    Abstract: A microscale thermocouple probe for intracellular temperature measurements comprises a cantilever structure including a suspended portion extending from a support, where the suspended portion includes first and second conductive lines on a surface thereof. The first and second conductive lines extend along the surface and meet at a tip of the suspended portion to define a thermocouple junction.
    Type: Application
    Filed: January 29, 2020
    Publication date: August 6, 2020
    Inventors: Sanjiv Sinha, Manjunath C. Rajagopal
  • Patent number: 10310575
    Abstract: A method and an information handling system (IHS) provides a virtual alternating current (vAC) reset of the IHS. A vAC reset module (vACRM), in response to receiving a request for the vAC reset, sets a bit within an auxiliary (AUX) based register to invoke the vAC reset when a system restart command is issued. The vACRM changes/configures a vAC recovery policy to enable main rail power to be turned on and a system start-up procedure to be initiated when a restored vAC is detected. The vACRM uses a system restart command to shutdown the main rail power and to remove power from system components powered by the main rail. The vACRM switches off AUX power to AUX powered components, based on the previously set bit, and reapplies the AUX power, following a preset interval. The vACRM turns on main rail power and initiates a system start-up procedure, according to the vAC recovery policy.
    Type: Grant
    Filed: August 23, 2016
    Date of Patent: June 4, 2019
    Assignee: Dell Products, L.P.
    Inventors: Mukund Khatri, Sanjiv Sinha
  • Publication number: 20180059752
    Abstract: A method and an information handling system (IHS) provides a virtual alternating current (vAC) reset of the IHS. A vAC reset module (vACRM), in response to receiving a request for the vAC reset, sets a bit within an auxiliary (AUX) based register to invoke the vAC reset when a system restart command is issued. The vACRM changes/configures a vAC recovery policy to enable main rail power to be turned on and a system start-up procedure to be initiated when a restored vAC is detected. The vACRM uses a system restart command to shutdown the main rail power and to remove power from system components powered by the main rail. The vACRM switches off AUX power to AUX powered components, based on the previously set bit, and reapplies the AUX power, following a preset interval. The vACRM turns on main rail power and initiates a system start-up procedure, according to the vAC recovery policy.
    Type: Application
    Filed: August 23, 2016
    Publication date: March 1, 2018
    Inventors: MUKUND KHATRI, SANJIV SINHA
  • Publication number: 20070235847
    Abstract: Embodiments of a method of fabricating a substrate including thermally conductive structures, as well as devices made from such a substrate, are disclosed. Each thermally conductive structure includes a via and a number of carbon nanotubes formed within the via. An active circuit element disposed on the substrate may at least partially overlie (or underlie) a location of one of the vias. The substrate may be cut into a number of separate die, each die including some of the thermally conductive structures. Other embodiments are described and claimed.
    Type: Application
    Filed: September 19, 2005
    Publication date: October 11, 2007
    Inventors: Shriram Ramanathan, Sanjiv Sinha, Patrick Morrow, Mark Trautman