Patents by Inventor Sanjiv Sinha
Sanjiv Sinha has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12235690Abstract: Methods and systems for managing power distribution and/or mechanical load in data processing systems is provided. The power distribution may be managed using multifunction power buses that may relieve a motherboard of a data processing system from distributing power. The mechanical load may be managed using an adapter plate that may relieve the motherboard of the data processing system from providing for attachment of devices based on the location of the mechanical mounting hardware on the devices. By doing so, motherboards may be standardized and customized for use with various devices.Type: GrantFiled: April 14, 2022Date of Patent: February 25, 2025Assignee: Dell Products L.P.Inventors: Corey Dean Hartman, Sanjiv Sinha
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Patent number: 12119702Abstract: Methods and systems for providing computer implemented services using configurable hardware components are disclosed. To update operation of a configurable hardware component, a large amount of data may be provided to a single input/output pin of the configurable hardware component. The large amount of data may be encoded in a complex waveform corresponding with at least eleven bits of digital data. The complex waveform may be interpreted by the configurable hardware component to obtain the large amount of data. Using the large amount of data, the configurable hardware component may update its operation to be in condition for providing the computer implemented services.Type: GrantFiled: March 29, 2023Date of Patent: October 15, 2024Assignee: Dell Products L.P.Inventors: Michael J. Stumpf, Sandor Tibor Farkas, Sanjiv Sinha
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Publication number: 20240333016Abstract: Methods and systems for providing computer implemented services using configurable hardware components are disclosed. To update operation of a configurable hardware component, a large amount of data may be provided to a single input/output pin of the configurable hardware component. The large amount of data may be encoded in a complex waveform corresponding with at least eleven bits of digital data. The complex waveform may be interpreted by the configurable hardware component to obtain the large amount of data. Using the large amount of data, the configurable hardware component may update its operation to be in condition for providing the computer implemented services.Type: ApplicationFiled: March 29, 2023Publication date: October 3, 2024Inventors: MICHAEL J. STUMPF, SANDOR TIBOR FARKAS, SANJIV SINHA
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Patent number: 11872772Abstract: An apparatus for fabricating a hybrid tube includes a rotatable mandrel and a first housing configured to translate alongside the rotatable mandrel while dispensing a first strip to be helically wound about the mandrel. The first housing includes an angle adjustment mechanism to control a dispensation angle of the first strip. The apparatus also includes least one energy or adhesive source for bonding overlapping strip portions on the rotatable mandrel and forming the hybrid tube. The at least one energy or adhesive source is configured for translation alongside the rotatable mandrel.Type: GrantFiled: July 19, 2021Date of Patent: January 16, 2024Assignee: THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOISInventors: Sanjiv Sinha, Placid M. Ferreira, Nenad Miljkovic, Manjunath C. Rajagopal, Gowtham Kuntumalla, Akhilesh Sanjay Somani
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Patent number: 11797466Abstract: Methods and systems for managing power distribution and/or mechanical load in data processing systems is provided. The power distribution may be managed using multifunction power buses that may relieve a motherboard of a data processing system from distributing power. The mechanical load may be managed using an adapter plate that may relieve the motherboard of the data processing system from providing for attachment of devices based on the location of the mechanical mounting hardware on the devices. By doing so, motherboards may be standardized and customized for use with various devices.Type: GrantFiled: April 14, 2022Date of Patent: October 24, 2023Assignee: Dell Products L.P.Inventors: Corey Dean Hartman, Sanjiv Sinha
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Publication number: 20230334001Abstract: Methods and systems for managing power distribution and/or mechanical load in data processing systems is provided. The power distribution may be managed using multifunction power buses that may relieve a motherboard of a data processing system from distributing power. The mechanical load may be managed using an adapter plate that may relieve the motherboard of the data processing system from providing for attachment of devices based on the location of the mechanical mounting hardware on the devices. By doing so, motherboards may be standardized and customized for use with various devices.Type: ApplicationFiled: April 14, 2022Publication date: October 19, 2023Inventors: COREY DEAN HARTMAN, SANJIV SINHA
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Publication number: 20230333609Abstract: Methods and systems for managing power distribution and/or mechanical load in data processing systems is provided. The power distribution may be managed using multifunction power buses that may relieve a motherboard of a data processing system from distributing power. The mechanical load may be managed using an adapter plate that may relieve the motherboard of the data processing system from providing for attachment of devices based on the location of the mechanical mounting hardware on the devices. By doing so, motherboards may be standardized and customized for use with various devices.Type: ApplicationFiled: April 14, 2022Publication date: October 19, 2023Inventors: COREY DEAN HARTMAN, SANJIV SINHA
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Patent number: 11480479Abstract: A microscale thermocouple probe for intracellular temperature measurements comprises a cantilever structure including a suspended portion extending from a support, where the suspended portion includes first and second conductive lines on a surface thereof. The first and second conductive lines extend along the surface and meet at a tip of the suspended portion to define a thermocouple junction.Type: GrantFiled: January 29, 2020Date of Patent: October 25, 2022Assignee: THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOISInventors: Sanjiv Sinha, Manjunath C. Rajagopal
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Patent number: 11436177Abstract: A floating device location identification system includes a chassis defining floating device housings and including respective chassis location identification features adjacent each floating device housing that identify the relative location of that floating device housing. A floating device may be positioned in a first floating device housing and adjacent a first chassis location identification feature. The first floating device includes floating device cabling connector(s) that are connected via a cabling subsystem to a device location identification subsystem, and chassis engagement elements that are coupled to the floating device cabling connector(s) and that engage the first chassis location identification feature.Type: GrantFiled: July 24, 2020Date of Patent: September 6, 2022Assignee: Dell Products L.P.Inventors: William Andrew Smith, Robert G. Bassman, Salvador Jimenez, III, Sanjiv Sinha, Noman Mithani
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Publication number: 20220024154Abstract: An apparatus for fabricating a hybrid tube includes a rotatable mandrel and a first housing configured to translate alongside the rotatable mandrel while dispensing a first strip to be helically wound about the mandrel. The first housing includes an angle adjustment mechanism to control a dispensation angle of the first strip. The apparatus also includes least one energy or adhesive source for bonding overlapping strip portions on the rotatable mandrel and forming the hybrid tube. The at least one energy or adhesive source is configured for translation alongside the rotatable mandrel.Type: ApplicationFiled: July 19, 2021Publication date: January 27, 2022Inventors: Sanjiv Sinha, Placid M. Ferreira, Nenad Miljkovic, Manjunath C. Rajagopal, Gowtham Kuntumalla, Akhilesh Sanjay Somani
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Publication number: 20220027302Abstract: A floating device location identification system includes a chassis defining floating device housings and including respective chassis location identification features adjacent each floating device housing that identify the relative location of that floating device housing. A floating device may be positioned in a first floating device housing and adjacent a first chassis location identification feature. The first floating device includes floating device cabling connector(s) that are connected via a cabling subsystem to a device location identification subsystem, and chassis engagement elements that are coupled to the floating device cabling connector(s) and that engage the first chassis location identification feature.Type: ApplicationFiled: July 24, 2020Publication date: January 27, 2022Inventors: William Andrew Smith, Robert G. Bassman, Salvador Jimenez, III, Sanjiv Sinha, Noman Mithani
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Publication number: 20200249103Abstract: A microscale thermocouple probe for intracellular temperature measurements comprises a cantilever structure including a suspended portion extending from a support, where the suspended portion includes first and second conductive lines on a surface thereof. The first and second conductive lines extend along the surface and meet at a tip of the suspended portion to define a thermocouple junction.Type: ApplicationFiled: January 29, 2020Publication date: August 6, 2020Inventors: Sanjiv Sinha, Manjunath C. Rajagopal
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Patent number: 10310575Abstract: A method and an information handling system (IHS) provides a virtual alternating current (vAC) reset of the IHS. A vAC reset module (vACRM), in response to receiving a request for the vAC reset, sets a bit within an auxiliary (AUX) based register to invoke the vAC reset when a system restart command is issued. The vACRM changes/configures a vAC recovery policy to enable main rail power to be turned on and a system start-up procedure to be initiated when a restored vAC is detected. The vACRM uses a system restart command to shutdown the main rail power and to remove power from system components powered by the main rail. The vACRM switches off AUX power to AUX powered components, based on the previously set bit, and reapplies the AUX power, following a preset interval. The vACRM turns on main rail power and initiates a system start-up procedure, according to the vAC recovery policy.Type: GrantFiled: August 23, 2016Date of Patent: June 4, 2019Assignee: Dell Products, L.P.Inventors: Mukund Khatri, Sanjiv Sinha
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Publication number: 20180059752Abstract: A method and an information handling system (IHS) provides a virtual alternating current (vAC) reset of the IHS. A vAC reset module (vACRM), in response to receiving a request for the vAC reset, sets a bit within an auxiliary (AUX) based register to invoke the vAC reset when a system restart command is issued. The vACRM changes/configures a vAC recovery policy to enable main rail power to be turned on and a system start-up procedure to be initiated when a restored vAC is detected. The vACRM uses a system restart command to shutdown the main rail power and to remove power from system components powered by the main rail. The vACRM switches off AUX power to AUX powered components, based on the previously set bit, and reapplies the AUX power, following a preset interval. The vACRM turns on main rail power and initiates a system start-up procedure, according to the vAC recovery policy.Type: ApplicationFiled: August 23, 2016Publication date: March 1, 2018Inventors: MUKUND KHATRI, SANJIV SINHA
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Publication number: 20070235847Abstract: Embodiments of a method of fabricating a substrate including thermally conductive structures, as well as devices made from such a substrate, are disclosed. Each thermally conductive structure includes a via and a number of carbon nanotubes formed within the via. An active circuit element disposed on the substrate may at least partially overlie (or underlie) a location of one of the vias. The substrate may be cut into a number of separate die, each die including some of the thermally conductive structures. Other embodiments are described and claimed.Type: ApplicationFiled: September 19, 2005Publication date: October 11, 2007Inventors: Shriram Ramanathan, Sanjiv Sinha, Patrick Morrow, Mark Trautman