Abstract: In one example an apparatus comprises a memory and a processor to create, from a first deep neural network (DNN) model, a first plurality of DNN models, generate a first set of adversarial examples that are misclassified by the first plurality of deep neural network (DNN) models, determine a first set of activation path differentials between the first plurality of adversarial examples, generate, from the first set of activation path differentials, at least one composite adversarial example which incorporates at least one intersecting critical path that is shared between at least two adversarial examples in the first set of adversarial examples, and use the at least one composite adversarial example to generate a set of inputs for a subsequent training iteration of the DNN model. Other examples may be described.

Abstract: Apparatus and methods for real time calibration of qubits in a quantum processor. For example, one embodiment of an apparatus comprises: a quantum processor comprising a plurality of qubits, each of the qubits having a state; a quantum controller to generate sequences of electromagnetic (EM) pulses to manipulate the states of the plurality of qubits based on a set of control parameters; a qubit measurement unit to measure one or more sensors associated with a corresponding one or more of the qubits of the plurality of qubits to produce one or more corresponding measured values; and a machine-learning engine to evaluate the one or more measured values in accordance with a machine-learning process to generate updated control parameters, wherein the quantum controller is to use the updated control parameters to generate subsequent sequences of EM pulses to manipulate the states of the plurality of qubits.

Abstract: A circuit subassembly, comprising a conductive layer, a dielectric layer is formed from a thermosetting composition, wherein the thermosetting composition comprises, based on the total weight of the thermosetting composition, a low polarity resin, a oxaphosphorinoxide-containing aromatic compound, and an protective adhesive layer disposed between the conductive layer and the dielectric layer, wherein the circuit subassembly has a UL-94 rating of at least V-0. Also disclosed is a composition for a bond ply and a circuit subassembly that further comprises such bond ply.

Abstract: A circuit subassembly, comprising a dielectric layer formed from a dielectric composition comprising, based on the total volume of the composition: about 15 to about 65 volume percent of a dielectric filler; and about 35 to about 85 volume percent of a thermosetting composition comprising: a poly(arylene ether), and a carboxy-functionalized polybutadiene or polyisoprene polymer.

Abstract: A circuit subassembly, comprising a conductive layer, a dielectric layer is formed from a thermosetting composition, wherein the thermosetting composition comprises, based on the total weight of the thermosetting composition, a low polarity resin, a oxaphosphorinoxide-containing aromatic compound, and an protective adhesive layer disposed between the conductive layer and the dielectric layer, wherein the circuit subassembly has a UL-94 rating of at least V-0. Also disclosed is a composition for a bond ply and a circuit subassembly that further comprises such bond ply.

Abstract: A circuit subassembly, comprising a dielectric layer formed from a dielectric composition comprising, based on the total volume of the composition: about 15 to about 65 volume percent of a dielectric filler; and about 35 to about 85 volume percent of a thermosetting composition comprising: a poly(arylene ether), and a carboxy-functionalized polybutadiene or polyisoprene polymer.

Abstract: A circuit subassembly, comprising a dielectric layer formed from a dielectric composition comprising, based on the total volume of the composition: about 15 to about 65 volume percent of a dielectric filler; and about 35 to about 85 volume percent of a thermosetting composition comprising: a poly(arylene ether), and a carboxy-functionalized polybutadiene or polyisoprene polymer.

Abstract: A circuit subassembly, comprising: a conductive layer, a dielectric layer formed from a thermosetting composition, wherein the thermosetting composition comprises, based on the total weight of the thermosetting composition a polybutadiene or polyisoprene resin, about 30 to about 70 percent by weight of a magnesium hydroxide having less than about 1000 ppm of ionic contaminants, and about 5 to about 15 percent by weight of a nitrogen-containing compound, wherein the nitrogen-containing compound comprises at least about 15 weight percent of nitrogen; and an adhesive layer disposed between and in intimate contact with the conductive layer and the dielectric layer, wherein the adhesive comprises a poly(arylene ether), wherein the circuit subassembly has a UL-94 rating of at least V-1.

Abstract: A circuit subassembly, comprising: a conductive layer, a dielectric layer formed from a thermosetting composition, wherein the thermosetting composition comprises, based on the total weight of the thermosetting composition a polybutadiene or polyisoprene resin, about 30 to about 70 percent by weight of a magnesium hydroxide having less than about 1000 ppm of ionic contaminants, and about 5 to about 15 percent by weight of a nitrogen-containing compound, wherein the nitrogen-containing compound comprises at least about 15 weight percent of nitrogen; and an adhesive layer disposed between and in intimate contact with the conductive layer and the dielectric layer, wherein the adhesive comprises a poly(arylene ether), wherein the circuit subassembly has a UL-94 rating of at least V-1.

Abstract: A circuit subassembly, comprising: a conductive layer, a dielectric layer formed from a thermosetting composition, wherein the thermosetting composition comprises, based on the total weight of the thermosetting composition a polybutadiene or polyisoprene resin, about 30 to about 70 percent by weight of a magnesium hydroxide having less than about 1000 ppm of ionic contaminants, and about 5 to about 15 percent by weight of a nitrogen-containing compound, wherein the nitrogen-containing compound comprises at least about 15 weight percent of nitrogen; and an adhesive layer disposed between and in intimate contact with the conductive layer and the dielectric layer, wherein the adhesive comprises a poly(arylene ether), wherein the circuit subassembly has a UL-94 rating of at least V-1.

Abstract: A circuit subassembly, comprising a dielectric layer formed from a dielectric composition comprising, based on the total volume of the composition: about 15 to about 65 volume percent of a dielectric filler; and about 35 to about 85 volume percent of a thermosetting composition comprising: a poly(arylene ether), and a carboxy-functionalized polybutadiene or polyisoprene polymer.

Abstract: A circuit subassembly, comprising: a conductive layer, a dielectric layer formed from a thermosetting composition, wherein the thermosetting composition comprises, based on the total weight of the thermosetting composition a polybutadiene or polyisoprene resin, about 30 to about 70 percent by weight of a magnesium hydroxide having less than about 1000 ppm of ionic contaminants, and about 5 to about 15 percent by weight of a nitrogen-containing compound, wherein the nitrogen-containing compound comprises at least about 15 weight percent of nitrogen; and an adhesive layer disposed between and in intimate contact with the conductive layer and the dielectric layer, wherein the adhesive comprises a poly(arylene ether), wherein the circuit subassembly has a UL-94 rating of at least V-1.

Abstract: Use of a roughened dielectric layer between a dielectric substrate and a conductive layer, which allows increased adhesion between layers without the conductor loss associated with roughened conductor layers, as well as improved accuracy in etching. The method is widely applicable to a variety of dielectric substrate and conductive layer constructions, and can be readily tuned to provide the desired level of adhesion and other advantageous properties.

Abstract: An adhesive, comprising a pressure-sensitive adhesive composition; and carbon nanotubes in an amount effective to render the pressure-sensitive adhesive composition electrically conductive. Such adhesives are of particular use with gasketing materials.

Abstract: A conductive, flame retardant composition is formed from a particulate flame retardant coated with a conductive metal. The composition can provide both conductivity and flame retardance to polymeric compositions such as adhesives, foams, and elastomers.