Abstract: Methods for making layered materials and layered materials including high atomic number metals and metal alloys adhered to surfaces are provided. Such surfaces may be oxygen or hydroxyl rich surfaces. Certain methods include depositing a tie down layer of a first metal or metal alloy particles onto a first surface of base material and depositing a high atomic number metal or metal alloy layer onto the first surface after depositing the tie down layer, wherein particles comprising the high atomic number metal or metal alloy layer have a higher atomic number than the first metal or metal alloy particles.

Abstract: Methods for making layered materials and layered materials including high atomic number metals and metal alloys adhered to surfaces are provided. Such surfaces may be oxygen or hydroxyl rich surfaces. Certain methods include depositing a tie down layer of a first metal or metal alloy particles onto a first surface of base material and depositing a high atomic number metal or metal alloy layer onto the first surface after depositing the tie down layer, wherein particles comprising the high atomic number metal or metal alloy layer have a higher atomic number than the first metal or metal alloy particles.

Abstract: In some aspects, this disclosure relates to improved Z-grade materials, such as those used for shielding, systems incorporating such materials, and processes for making such Z-grade materials. In some examples, the Z-grade material includes a diffusion zone including mixed metallic alloy material with both a high atomic number material and a lower atomic number material. In certain examples, a process for making Z-grade material includes combining a high atomic number material and a low atomic number material, and bonding the high atomic number material and the low atomic number together using diffusion bonding. The processes may include vacuum pressing material at an elevated temperature, such as a temperature near a softening or melting point of the low atomic number material. In another aspect, systems such as a vault or an electronic enclosure are disclosed, where one or more surfaces of Z-grade material make up part or all of the vault/enclosure.

Abstract: In some aspects, this disclosure relates to improved Z-grade materials, such as those used for shielding, systems incorporating such materials, and processes for making such Z-grade materials. In some examples, the Z-grade material includes a diffusion zone including mixed metallic alloy material with both a high atomic number material and a lower atomic number material. In certain examples, a process for making Z-grade material includes combining a high atomic number material and a low atomic number material, and bonding the high atomic number material and the low atomic number together using diffusion bonding. The processes may include vacuum pressing material at an elevated temperature, such as a temperature near a softening or melting point of the low atomic number material. In another aspect, systems such as a vault or an electronic enclosure are disclosed, where one or more surfaces of Z-grade material make up part or all of the vault/enclosure.

Abstract: In some aspects, this disclosure relates to improved Z-grade materials, such as those used for shielding, systems incorporating such materials, and processes for making such Z-grade materials. In some examples, the Z-grade material includes a diffusion zone including mixed metallic alloy material with both a high atomic number material and a lower atomic number material. In certain examples, a process for making Z-grade material includes combining a high atomic number material and a low atomic number material, and bonding the high atomic number material and the low atomic number together using diffusion bonding. The processes may include vacuum pressing material at an elevated temperature, such as a temperature near a softening or melting point of the low atomic number material. In another aspect, systems such as a vault or an electronic enclosure are disclosed, where one or more surfaces of Z-grade material make up part or all of the vault/enclosure.

Abstract: Methods for making layered materials and layered materials including high atomic number metals and metal alloys adhered to surfaces are provided. Such surfaces may be oxygen or hydroxyl rich surfaces. Certain methods include depositing a tie down layer of a first metal or metal alloy particles onto a first surface of base material and depositing a high atomic number metal or metal alloy layer onto the first surface after depositing the tie down layer, wherein particles comprising the high atomic number metal or metal alloy layer have a higher atomic number than the first metal or metal alloy particles.

Abstract: In some aspects, this disclosure relates to improved Z-grade materials, such as those used for shielding, systems incorporating such materials, and processes for making such Z-grade materials. In some examples, the Z-grade material includes a diffusion zone including mixed metallic alloy material with both a high atomic number material and a lower atomic number material. In certain examples, a process for making Z-grade material includes combining a high atomic number material and a low atomic number material, and bonding the high atomic number material and the low atomic number together using diffusion bonding. The processes may include vacuum pressing material at an elevated temperature, such as a temperature near a softening or melting point of the low atomic number material. In another aspect, systems such as a vault or an electronic enclosure are disclosed, where one or more surfaces of Z-grade material make up part or all of the vault/enclosure.

Abstract: In some aspects, this disclosure relates to improved Z-grade materials, such as those used for shielding, systems incorporating such materials, and processes for making such Z-grade materials. In some examples, the Z-grade material includes a diffusion zone including mixed metallic alloy material with both a high atomic number material and a lower atomic number material. In certain examples, a process for making Z-grade material includes combining a high atomic number material and a low atomic number material, and bonding the high atomic number material and the low atomic number together using diffusion bonding. The processes may include vacuum pressing material at an elevated temperature, such as a temperature near a softening or melting point of the low atomic number material. In another aspect, systems such as a vault or an electronic enclosure are disclosed, where one or more surfaces of Z-grade material make up part or all of the vault/enclosure.