Patents by Inventor Sankaran M. Menon
Sankaran M. Menon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11709202Abstract: Existing multi-wire debugging protocols, such as 4-wire JTAG, 2-wire cJTAG, or ARM SWD, are run through a serial wireless link by providing the debugger and the target device with hardware interfaces that include UARTs and conversion bridges. The debugger interface serializes outgoing control signals and de-serializes returning data. The target interface de-serializes incoming control signals and serializes outgoing data. The actions of the interfaces are transparent to the inner workings of the devices, allowing re-use of existing debugging software. Compression, signal combining, and other optional enhancements increase debugging speed and flexibility while wirelessly accessing target devices that may be too small, too difficult to reach, or too seal-dependent for a wired connection.Type: GrantFiled: October 30, 2020Date of Patent: July 25, 2023Assignee: Intel CorporationInventors: Sankaran M. Menon, Bradley H. Smith, Jinshi Huang, Rolf H. Kuehnis
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Patent number: 11698412Abstract: Techniques and mechanisms to exchange test, debug or trace (TDT) information via a general purpose input/output (I/O) interface. In an embodiment, an I/O interface of a device is coupled to an external TDT unit, wherein the I/O interface is compatible with an interconnect standard that supports communication of data other than any test information, debug information or trace information. One or more circuit components reside on the device or are otherwise coupled to the external TDT unit via the I/O interface. Information exchanged via the I/O interface is generated by, or results in, the performance of one or more TDT operations to evaluate the one or more circuit components. In another embodiment, the glue logic of the device interfaces the I/O interface with a test access point that is coupled between the one or more circuit components and the I/O interface.Type: GrantFiled: November 30, 2021Date of Patent: July 11, 2023Assignee: Intel CorporationInventors: Rolf H. Kuehnis, Sankaran M. Menon, Patrik Eder
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Patent number: 11686780Abstract: Described is an apparatus which comprises: a first voltage regulator (VR) having a reference input node; and a first multiplexer to provide a reference voltage to the reference input node and operable to select one of at least two different reference voltages as the reference voltage.Type: GrantFiled: April 15, 2021Date of Patent: June 27, 2023Assignee: Intel CorporationInventors: Sankaran M. Menon, Vasudev Bibikar, P. Reddy Sahajananda, Sunghyun Koh, Naveendran Balasingam
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Publication number: 20220082617Abstract: Techniques and mechanisms to exchange test, debug or trace (TDT) information via a general purpose input/output (I/O) interface. In an embodiment, an I/O interface of a device is coupled to an external TDT unit, wherein the I/O interface is compatible with an interconnect standard that supports communication of data other than any test information, debug information or trace information. One or more circuit components reside on the device or are otherwise coupled to the external TDT unit via the I/O interface. Information exchanged via the I/O interface is generated by, or results in, the performance of one or more TDT operations to evaluate the one or more circuit components. In another embodiment, the glue logic of the device interfaces the I/O interface with a test access point that is coupled between the one or more circuit components and the I/O interface.Type: ApplicationFiled: November 30, 2021Publication date: March 17, 2022Applicant: Intel CorporationInventors: Rolf H. Kuehnis, Sankaran M. Menon, Patrik Eder
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Patent number: 11193973Abstract: Techniques and mechanisms to exchange test, debug or trace (TDT) information via a general purpose input/output (I/O) interface. In an embodiment, an I/O interface of a device is coupled to an external TDT unit, wherein the I/O interface is compatible with an interconnect standard that supports communication of data other than any test information, debug information or trace information. One or more circuit components reside on the device or are otherwise coupled to the external TDT unit via the I/O interface. Information exchanged via the I/O interface is generated by, or results in, the performance of one or more TDT operations to evaluate the one or more circuit components. In another embodiment, the glue logic of the device interfaces the I/O interface with a test access point that is coupled between the one or more circuit components and the I/O interface.Type: GrantFiled: July 17, 2020Date of Patent: December 7, 2021Assignee: Intel CorporationInventors: Rolf H. Kuehnis, Sankaran M. Menon, Patrik Eder
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Patent number: 11157374Abstract: Technologies for efficiently providing reliable compute operations for mission critical applications include a reliability management system. The reliability management system includes circuitry configured to obtain conclusion data indicative of a conclusion made by each of two or fewer compute devices of a host system. The conclusion data from each compute device pertains to the same operation. Additionally, the circuitry is configured to identify whether an error has occurred in the operation of each compute device, determine, in response to a determination that an error has occurred, a severity of the error, and cause the host system to perform a responsive action as a function of the determined severity of the error.Type: GrantFiled: December 28, 2018Date of Patent: October 26, 2021Assignee: Intel CorporationInventors: Sankaran M. Menon, Rolf Kuehnis
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Publication number: 20210231746Abstract: Described is an apparatus which comprises: a first voltage regulator (VR) having a reference input node; and a first multiplexer to provide a reference voltage to the reference input node and operable to select one of at least two different reference voltages as the reference voltage.Type: ApplicationFiled: April 15, 2021Publication date: July 29, 2021Applicant: Intel CorporationInventors: Sankaran M. Menon, Vasudev Bibikar, P. Reddy Sahajananda, Sunghyun Koh, Naveendran Balasingam
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Patent number: 10996283Abstract: Described is an apparatus which comprises: a first voltage regulator (VR) having a reference input node; and a first multiplexer to provide a reference voltage to the reference input node and operable to select one of at least two different reference voltages as the reference voltage.Type: GrantFiled: October 9, 2017Date of Patent: May 4, 2021Assignee: Intel CorporationInventors: Sankaran M. Menon, Vasudev Bibikar, P. Reddy Sahajananda, Sunghyun Koh, Naveendran Balasingam
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Publication number: 20210048476Abstract: Existing multi-wire debugging protocols, such as 4-wire JTAG, 2-wire cJTAG, or ARM SWD, are run through a serial wireless link by providing the debugger and the target device with hardware interfaces that include UARTs and conversion bridges. The debugger interface serializes outgoing control signals and de-serializes returning data. The target interface de-serializes incoming control signals and serializes outgoing data. The actions of the interfaces are transparent to the inner workings of the devices, allowing re-use of existing debugging software. Compression, signal combining, and other optional enhancements increase debugging speed and flexibility while wirelessly accessing target devices that may be too small, too difficult to reach, or too seal-dependent for a wired connection.Type: ApplicationFiled: October 30, 2020Publication date: February 18, 2021Applicant: Intel IP CorporationInventors: Sankaran M. Menon, Bradley H. Smith, Jinshi Huang, Rolf H. Kuehnis
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Publication number: 20210012855Abstract: An integrated circuit (IC) device configured for multiple return material authorizations (RMAs) is provided. The IC device includes an asset and a return material authorization (RMA) counter fuse including a first fuse, a second fuse, and a third fuse. The IC device enters an RMA state in response to blowing the first fuse, a second state in response to blowing the second fuse, and the RMA state in response to blowing the third fuse.Type: ApplicationFiled: September 25, 2020Publication date: January 14, 2021Inventors: Sankaran M. Menon, Andrew Martyn Draper, Ting Lu, Kenneth Chen, Wei Chun Lau
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Patent number: 10845413Abstract: Existing multi-wire debugging protocols, such as 4-wire JTAG, 2-wire cJTAG, or ARM SWD, are run through a serial wireless link by providing the debugger and the target device with hardware interfaces that include UARTs and conversion bridges. The debugger interface serializes outgoing control signals and de-serializes returning data. The target interface de-serializes incoming control signals and serializes outgoing data. The actions of the interfaces are transparent to the inner workings of the devices, allowing re-use of existing debugging software. Compression, signal combining, and other optional enhancements increase debugging speed and flexibility while wirelessly accessing target devices that may be too small, too difficult to reach, or too seal-dependent for a wired connection.Type: GrantFiled: May 15, 2018Date of Patent: November 24, 2020Assignee: Intel IP CorporationInventors: Sankaran M. Menon, Bradley H. Smith, Jinshi Huang, Rolf H. Kuehnis
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Publication number: 20200348360Abstract: Techniques and mechanisms to exchange test, debug or trace (TDT) information via a general purpose input/output (I/O) interface. In an embodiment, an I/O interface of a device is coupled to an external TDT unit, wherein the I/O interface is compatible with an interconnect standard that supports communication of data other than any test information, debug information or trace information. One or more circuit components reside on the device or are otherwise coupled to the external TDT unit via the I/O interface. Information exchanged via the I/O interface is generated by, or results in, the performance of one or more TDT operations to evaluate the one or more circuit components. In another embodiment, the glue logic of the device interfaces the I/O interface with a test access point that is coupled between the one or more circuit components and the I/O interface.Type: ApplicationFiled: July 17, 2020Publication date: November 5, 2020Applicant: Intel IP CorporationInventors: Rolf H. Kuehnis, Sankaran M. Menon, Patrik Eder
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Patent number: 10824530Abstract: In one embodiment, an apparatus includes a controller to couple between a system on chip (SoC) and an external connector of a platform. The controller may include: a digitizer to digitize platform telemetry information of the platform; and a control circuit to receive a command from a debug test system and direct the platform telemetry information to a destination in response to the command. Other embodiments are described and claimed.Type: GrantFiled: June 21, 2017Date of Patent: November 3, 2020Assignee: Intel CorporationInventors: Rolf H. Kuehnis, Sankaran M. Menon, Rob W. Sims
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Patent number: 10718812Abstract: Techniques and mechanisms to exchange test, debug or trace (TDT) information via a general purpose input/output (I/O) interface. In an embodiment, an I/O interface of a device is coupled to an external TDT unit, wherein the I/O interface is compatible with an interconnect standard that supports communication of data other than any test information, debug information or trace information. One or more circuit components reside on the device or are otherwise coupled to the external TDT unit via the I/O interface. Information exchanged via the I/O interface is generated by, or results in, the performance of one or more TDT operations to evaluate the one or more circuit components. In another embodiment, the glue logic of the device interfaces the I/O interface with a test access point that is coupled between the one or more circuit components and the I/O interface.Type: GrantFiled: August 20, 2018Date of Patent: July 21, 2020Assignee: Intel IP CorporationInventors: Rolf H. Kuehnis, Sankaran M. Menon, Patrik Eder
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Publication number: 20190219634Abstract: Techniques and mechanisms to exchange test, debug or trace (TDT) information via a general purpose input/output (I/O) interface. In an embodiment, an I/O interface of a device is coupled to an external TDT unit, wherein the I/O interface is compatible with an interconnect standard that supports communication of data other than any test information, debug information or trace information. One or more circuit components reside on the device or are otherwise coupled to the external TDT unit via the I/O interface. Information exchanged via the I/O interface is generated by, or results in, the performance of one or more TDT operations to evaluate the one or more circuit components. In another embodiment, the glue logic of the device interfaces the I/O interface with a test access point that is coupled between the one or more circuit components and the I/O interface.Type: ApplicationFiled: August 20, 2018Publication date: July 18, 2019Applicant: Intel IP CorporationInventors: Rolf H. KUEHNIS, Sankaran M. MENON, Patrik EDER
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Publication number: 20190138408Abstract: Technologies for efficiently providing reliable compute operations for mission critical applications include a reliability management system. The reliability management system includes circuitry configured to obtain conclusion data indicative of a conclusion made by each of two or fewer compute devices of a host system. The conclusion data from each compute device pertains to the same operation. Additionally, the circuitry is configured to identify whether an error has occurred in the operation of each compute device, determine, in response to a determination that an error has occurred, a severity of the error, and cause the host system to perform a responsive action as a function of the determined severity of the error.Type: ApplicationFiled: December 28, 2018Publication date: May 9, 2019Inventors: Sankaran M. Menon, Rolf Kuehnis
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Patent number: 10247773Abstract: The disclosed systems, devices, and methods may provide for wireless testing of devices and, in particular, wireless testing of semiconductor devices comprising integrated circuits, memory, and logic circuitry that can be present on a wafer. The semiconductor devices can be tested for functional defects by applying one or more test patterns to the semiconductor devices. Further, for devices under test that do not have built-in wireless connectivity (for example, those that do not have a built-in Bluetooth low-energy engine), the disclosure describes systems and methods that the devices under test can use for external wireless connectivity (e.g., an external board having Bluetooth low-energy) on the low-bandwidth interface. In one example embodiment, for high-bandwidth scan testing, wireless connectivity modules (such as those implementing WiFi or WiGig) are described, which can be used to meet the bandwidth requirements of the one or more tests.Type: GrantFiled: July 1, 2016Date of Patent: April 2, 2019Assignee: Intel CorporationInventors: Sankaran M. Menon, Rehan M. Sheikh, Rolf H. Kuehnis, John Michael Peterson, Asifur Rahman, Abram M. Detofsky, Mohsen Fazlian
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Publication number: 20180373607Abstract: In one embodiment, an apparatus includes a controller to couple between a system on chip (SoC) and an external connector of a platform. The controller may include: a digitizer to digitize platform telemetry information of the platform; and a control circuit to receive a command from a debug test system and direct the platform telemetry information to a destination in response to the command. Other embodiments are described and claimed.Type: ApplicationFiled: June 21, 2017Publication date: December 27, 2018Inventors: Rolf H. Kuehnis, Sankaran M. Menon, Rob W. Sims
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Publication number: 20180328987Abstract: Existing multi-wire debugging protocols, such as 4-wire JTAG, 2-wire cJTAG, or ARM SWD, are run through a serial wireless link by providing the debugger and the target device with hardware interfaces that include UARTs and conversion bridges. The debugger interface serializes outgoing control signals and de-serializes returning data. The target interface de-serializes incoming control signals and serializes outgoing data. The actions of the interfaces are transparent to the inner workings of the devices, allowing re-use of existing debugging software. Compression, signal combining, and other optional enhancements increase debugging speed and flexibility while wirelessly accessing target devices that may be too small, too difficult to reach, or too seal-dependent for a wired connection.Type: ApplicationFiled: May 15, 2018Publication date: November 15, 2018Inventors: Sankaran M. Menon, Bradley H. Smith, Jinshi Huang, Rolf H. Kuehnis
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Patent number: 10060966Abstract: A method and apparatus (e.g., semiconductor device) for setting voltages (e.g., guardbands) using “in situ,” or on-die, silicon measurements are described. In one embodiment the semiconductor device comprises: a process monitor to measure silicon parameters of the semiconductor device; and a controller coupled to the process monitor to set a voltage for use on at least a portion of the semiconductor device based on silicon process monitor measurements.Type: GrantFiled: March 24, 2015Date of Patent: August 28, 2018Assignee: INTEL CORPORATIONInventors: Sankaran M. Menon, Vasudev Bibikar