Patents by Inventor Sankaran M. Menon

Sankaran M. Menon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11709202
    Abstract: Existing multi-wire debugging protocols, such as 4-wire JTAG, 2-wire cJTAG, or ARM SWD, are run through a serial wireless link by providing the debugger and the target device with hardware interfaces that include UARTs and conversion bridges. The debugger interface serializes outgoing control signals and de-serializes returning data. The target interface de-serializes incoming control signals and serializes outgoing data. The actions of the interfaces are transparent to the inner workings of the devices, allowing re-use of existing debugging software. Compression, signal combining, and other optional enhancements increase debugging speed and flexibility while wirelessly accessing target devices that may be too small, too difficult to reach, or too seal-dependent for a wired connection.
    Type: Grant
    Filed: October 30, 2020
    Date of Patent: July 25, 2023
    Assignee: Intel Corporation
    Inventors: Sankaran M. Menon, Bradley H. Smith, Jinshi Huang, Rolf H. Kuehnis
  • Patent number: 11698412
    Abstract: Techniques and mechanisms to exchange test, debug or trace (TDT) information via a general purpose input/output (I/O) interface. In an embodiment, an I/O interface of a device is coupled to an external TDT unit, wherein the I/O interface is compatible with an interconnect standard that supports communication of data other than any test information, debug information or trace information. One or more circuit components reside on the device or are otherwise coupled to the external TDT unit via the I/O interface. Information exchanged via the I/O interface is generated by, or results in, the performance of one or more TDT operations to evaluate the one or more circuit components. In another embodiment, the glue logic of the device interfaces the I/O interface with a test access point that is coupled between the one or more circuit components and the I/O interface.
    Type: Grant
    Filed: November 30, 2021
    Date of Patent: July 11, 2023
    Assignee: Intel Corporation
    Inventors: Rolf H. Kuehnis, Sankaran M. Menon, Patrik Eder
  • Patent number: 11686780
    Abstract: Described is an apparatus which comprises: a first voltage regulator (VR) having a reference input node; and a first multiplexer to provide a reference voltage to the reference input node and operable to select one of at least two different reference voltages as the reference voltage.
    Type: Grant
    Filed: April 15, 2021
    Date of Patent: June 27, 2023
    Assignee: Intel Corporation
    Inventors: Sankaran M. Menon, Vasudev Bibikar, P. Reddy Sahajananda, Sunghyun Koh, Naveendran Balasingam
  • Publication number: 20220082617
    Abstract: Techniques and mechanisms to exchange test, debug or trace (TDT) information via a general purpose input/output (I/O) interface. In an embodiment, an I/O interface of a device is coupled to an external TDT unit, wherein the I/O interface is compatible with an interconnect standard that supports communication of data other than any test information, debug information or trace information. One or more circuit components reside on the device or are otherwise coupled to the external TDT unit via the I/O interface. Information exchanged via the I/O interface is generated by, or results in, the performance of one or more TDT operations to evaluate the one or more circuit components. In another embodiment, the glue logic of the device interfaces the I/O interface with a test access point that is coupled between the one or more circuit components and the I/O interface.
    Type: Application
    Filed: November 30, 2021
    Publication date: March 17, 2022
    Applicant: Intel Corporation
    Inventors: Rolf H. Kuehnis, Sankaran M. Menon, Patrik Eder
  • Patent number: 11193973
    Abstract: Techniques and mechanisms to exchange test, debug or trace (TDT) information via a general purpose input/output (I/O) interface. In an embodiment, an I/O interface of a device is coupled to an external TDT unit, wherein the I/O interface is compatible with an interconnect standard that supports communication of data other than any test information, debug information or trace information. One or more circuit components reside on the device or are otherwise coupled to the external TDT unit via the I/O interface. Information exchanged via the I/O interface is generated by, or results in, the performance of one or more TDT operations to evaluate the one or more circuit components. In another embodiment, the glue logic of the device interfaces the I/O interface with a test access point that is coupled between the one or more circuit components and the I/O interface.
    Type: Grant
    Filed: July 17, 2020
    Date of Patent: December 7, 2021
    Assignee: Intel Corporation
    Inventors: Rolf H. Kuehnis, Sankaran M. Menon, Patrik Eder
  • Patent number: 11157374
    Abstract: Technologies for efficiently providing reliable compute operations for mission critical applications include a reliability management system. The reliability management system includes circuitry configured to obtain conclusion data indicative of a conclusion made by each of two or fewer compute devices of a host system. The conclusion data from each compute device pertains to the same operation. Additionally, the circuitry is configured to identify whether an error has occurred in the operation of each compute device, determine, in response to a determination that an error has occurred, a severity of the error, and cause the host system to perform a responsive action as a function of the determined severity of the error.
    Type: Grant
    Filed: December 28, 2018
    Date of Patent: October 26, 2021
    Assignee: Intel Corporation
    Inventors: Sankaran M. Menon, Rolf Kuehnis
  • Publication number: 20210231746
    Abstract: Described is an apparatus which comprises: a first voltage regulator (VR) having a reference input node; and a first multiplexer to provide a reference voltage to the reference input node and operable to select one of at least two different reference voltages as the reference voltage.
    Type: Application
    Filed: April 15, 2021
    Publication date: July 29, 2021
    Applicant: Intel Corporation
    Inventors: Sankaran M. Menon, Vasudev Bibikar, P. Reddy Sahajananda, Sunghyun Koh, Naveendran Balasingam
  • Patent number: 10996283
    Abstract: Described is an apparatus which comprises: a first voltage regulator (VR) having a reference input node; and a first multiplexer to provide a reference voltage to the reference input node and operable to select one of at least two different reference voltages as the reference voltage.
    Type: Grant
    Filed: October 9, 2017
    Date of Patent: May 4, 2021
    Assignee: Intel Corporation
    Inventors: Sankaran M. Menon, Vasudev Bibikar, P. Reddy Sahajananda, Sunghyun Koh, Naveendran Balasingam
  • Publication number: 20210048476
    Abstract: Existing multi-wire debugging protocols, such as 4-wire JTAG, 2-wire cJTAG, or ARM SWD, are run through a serial wireless link by providing the debugger and the target device with hardware interfaces that include UARTs and conversion bridges. The debugger interface serializes outgoing control signals and de-serializes returning data. The target interface de-serializes incoming control signals and serializes outgoing data. The actions of the interfaces are transparent to the inner workings of the devices, allowing re-use of existing debugging software. Compression, signal combining, and other optional enhancements increase debugging speed and flexibility while wirelessly accessing target devices that may be too small, too difficult to reach, or too seal-dependent for a wired connection.
    Type: Application
    Filed: October 30, 2020
    Publication date: February 18, 2021
    Applicant: Intel IP Corporation
    Inventors: Sankaran M. Menon, Bradley H. Smith, Jinshi Huang, Rolf H. Kuehnis
  • Publication number: 20210012855
    Abstract: An integrated circuit (IC) device configured for multiple return material authorizations (RMAs) is provided. The IC device includes an asset and a return material authorization (RMA) counter fuse including a first fuse, a second fuse, and a third fuse. The IC device enters an RMA state in response to blowing the first fuse, a second state in response to blowing the second fuse, and the RMA state in response to blowing the third fuse.
    Type: Application
    Filed: September 25, 2020
    Publication date: January 14, 2021
    Inventors: Sankaran M. Menon, Andrew Martyn Draper, Ting Lu, Kenneth Chen, Wei Chun Lau
  • Patent number: 10845413
    Abstract: Existing multi-wire debugging protocols, such as 4-wire JTAG, 2-wire cJTAG, or ARM SWD, are run through a serial wireless link by providing the debugger and the target device with hardware interfaces that include UARTs and conversion bridges. The debugger interface serializes outgoing control signals and de-serializes returning data. The target interface de-serializes incoming control signals and serializes outgoing data. The actions of the interfaces are transparent to the inner workings of the devices, allowing re-use of existing debugging software. Compression, signal combining, and other optional enhancements increase debugging speed and flexibility while wirelessly accessing target devices that may be too small, too difficult to reach, or too seal-dependent for a wired connection.
    Type: Grant
    Filed: May 15, 2018
    Date of Patent: November 24, 2020
    Assignee: Intel IP Corporation
    Inventors: Sankaran M. Menon, Bradley H. Smith, Jinshi Huang, Rolf H. Kuehnis
  • Publication number: 20200348360
    Abstract: Techniques and mechanisms to exchange test, debug or trace (TDT) information via a general purpose input/output (I/O) interface. In an embodiment, an I/O interface of a device is coupled to an external TDT unit, wherein the I/O interface is compatible with an interconnect standard that supports communication of data other than any test information, debug information or trace information. One or more circuit components reside on the device or are otherwise coupled to the external TDT unit via the I/O interface. Information exchanged via the I/O interface is generated by, or results in, the performance of one or more TDT operations to evaluate the one or more circuit components. In another embodiment, the glue logic of the device interfaces the I/O interface with a test access point that is coupled between the one or more circuit components and the I/O interface.
    Type: Application
    Filed: July 17, 2020
    Publication date: November 5, 2020
    Applicant: Intel IP Corporation
    Inventors: Rolf H. Kuehnis, Sankaran M. Menon, Patrik Eder
  • Patent number: 10824530
    Abstract: In one embodiment, an apparatus includes a controller to couple between a system on chip (SoC) and an external connector of a platform. The controller may include: a digitizer to digitize platform telemetry information of the platform; and a control circuit to receive a command from a debug test system and direct the platform telemetry information to a destination in response to the command. Other embodiments are described and claimed.
    Type: Grant
    Filed: June 21, 2017
    Date of Patent: November 3, 2020
    Assignee: Intel Corporation
    Inventors: Rolf H. Kuehnis, Sankaran M. Menon, Rob W. Sims
  • Patent number: 10718812
    Abstract: Techniques and mechanisms to exchange test, debug or trace (TDT) information via a general purpose input/output (I/O) interface. In an embodiment, an I/O interface of a device is coupled to an external TDT unit, wherein the I/O interface is compatible with an interconnect standard that supports communication of data other than any test information, debug information or trace information. One or more circuit components reside on the device or are otherwise coupled to the external TDT unit via the I/O interface. Information exchanged via the I/O interface is generated by, or results in, the performance of one or more TDT operations to evaluate the one or more circuit components. In another embodiment, the glue logic of the device interfaces the I/O interface with a test access point that is coupled between the one or more circuit components and the I/O interface.
    Type: Grant
    Filed: August 20, 2018
    Date of Patent: July 21, 2020
    Assignee: Intel IP Corporation
    Inventors: Rolf H. Kuehnis, Sankaran M. Menon, Patrik Eder
  • Publication number: 20190219634
    Abstract: Techniques and mechanisms to exchange test, debug or trace (TDT) information via a general purpose input/output (I/O) interface. In an embodiment, an I/O interface of a device is coupled to an external TDT unit, wherein the I/O interface is compatible with an interconnect standard that supports communication of data other than any test information, debug information or trace information. One or more circuit components reside on the device or are otherwise coupled to the external TDT unit via the I/O interface. Information exchanged via the I/O interface is generated by, or results in, the performance of one or more TDT operations to evaluate the one or more circuit components. In another embodiment, the glue logic of the device interfaces the I/O interface with a test access point that is coupled between the one or more circuit components and the I/O interface.
    Type: Application
    Filed: August 20, 2018
    Publication date: July 18, 2019
    Applicant: Intel IP Corporation
    Inventors: Rolf H. KUEHNIS, Sankaran M. MENON, Patrik EDER
  • Publication number: 20190138408
    Abstract: Technologies for efficiently providing reliable compute operations for mission critical applications include a reliability management system. The reliability management system includes circuitry configured to obtain conclusion data indicative of a conclusion made by each of two or fewer compute devices of a host system. The conclusion data from each compute device pertains to the same operation. Additionally, the circuitry is configured to identify whether an error has occurred in the operation of each compute device, determine, in response to a determination that an error has occurred, a severity of the error, and cause the host system to perform a responsive action as a function of the determined severity of the error.
    Type: Application
    Filed: December 28, 2018
    Publication date: May 9, 2019
    Inventors: Sankaran M. Menon, Rolf Kuehnis
  • Patent number: 10247773
    Abstract: The disclosed systems, devices, and methods may provide for wireless testing of devices and, in particular, wireless testing of semiconductor devices comprising integrated circuits, memory, and logic circuitry that can be present on a wafer. The semiconductor devices can be tested for functional defects by applying one or more test patterns to the semiconductor devices. Further, for devices under test that do not have built-in wireless connectivity (for example, those that do not have a built-in Bluetooth low-energy engine), the disclosure describes systems and methods that the devices under test can use for external wireless connectivity (e.g., an external board having Bluetooth low-energy) on the low-bandwidth interface. In one example embodiment, for high-bandwidth scan testing, wireless connectivity modules (such as those implementing WiFi or WiGig) are described, which can be used to meet the bandwidth requirements of the one or more tests.
    Type: Grant
    Filed: July 1, 2016
    Date of Patent: April 2, 2019
    Assignee: Intel Corporation
    Inventors: Sankaran M. Menon, Rehan M. Sheikh, Rolf H. Kuehnis, John Michael Peterson, Asifur Rahman, Abram M. Detofsky, Mohsen Fazlian
  • Publication number: 20180373607
    Abstract: In one embodiment, an apparatus includes a controller to couple between a system on chip (SoC) and an external connector of a platform. The controller may include: a digitizer to digitize platform telemetry information of the platform; and a control circuit to receive a command from a debug test system and direct the platform telemetry information to a destination in response to the command. Other embodiments are described and claimed.
    Type: Application
    Filed: June 21, 2017
    Publication date: December 27, 2018
    Inventors: Rolf H. Kuehnis, Sankaran M. Menon, Rob W. Sims
  • Publication number: 20180328987
    Abstract: Existing multi-wire debugging protocols, such as 4-wire JTAG, 2-wire cJTAG, or ARM SWD, are run through a serial wireless link by providing the debugger and the target device with hardware interfaces that include UARTs and conversion bridges. The debugger interface serializes outgoing control signals and de-serializes returning data. The target interface de-serializes incoming control signals and serializes outgoing data. The actions of the interfaces are transparent to the inner workings of the devices, allowing re-use of existing debugging software. Compression, signal combining, and other optional enhancements increase debugging speed and flexibility while wirelessly accessing target devices that may be too small, too difficult to reach, or too seal-dependent for a wired connection.
    Type: Application
    Filed: May 15, 2018
    Publication date: November 15, 2018
    Inventors: Sankaran M. Menon, Bradley H. Smith, Jinshi Huang, Rolf H. Kuehnis
  • Patent number: 10060966
    Abstract: A method and apparatus (e.g., semiconductor device) for setting voltages (e.g., guardbands) using “in situ,” or on-die, silicon measurements are described. In one embodiment the semiconductor device comprises: a process monitor to measure silicon parameters of the semiconductor device; and a controller coupled to the process monitor to set a voltage for use on at least a portion of the semiconductor device based on silicon process monitor measurements.
    Type: Grant
    Filed: March 24, 2015
    Date of Patent: August 28, 2018
    Assignee: INTEL CORPORATION
    Inventors: Sankaran M. Menon, Vasudev Bibikar