Abstract: Disclosed herein are devices, methods, and systems for cooling an electronic component. The cooling device includes a liquid cooling loop with a heat exchanger, wherein the liquid cooling loop thermally conductively connects to the electronic component. The cooling device also includes a vapor compression cooling loop with a compressor and an expansion nozzle. The cooling device also includes an intermediate heat exchanger between the liquid cooling loop and the vapor compression cooling loop for exchanging heat between the liquid cooling loop and the vapor compression cooling loop. The cooling device also includes a controller configured to selectively activate the vapor compression cooling loop based on a power consumption of the electronic component.

Abstract: Disclosed herein are devices, methods, and systems for cooling an electronic component. The cooling device includes a liquid cooling loop with a heat exchanger, wherein the liquid cooling loop thermally conductively connects to the electronic component. The cooling device also includes a vapor compression cooling loop with a compressor and an expansion nozzle. The cooling device also includes an intermediate heat exchanger between the liquid cooling loop and the vapor compression cooling loop for exchanging heat between the liquid cooling loop and the vapor compression cooling loop. The cooling device also includes a controller configured to selectively activate the vapor compression cooling loop based on a power consumption of the electronic component.

Abstract: The present disclosure is directed to monitoring the integrity of the thermal interface material (TIM) of a semiconductor device directly by a monitoring component of a motherboard, a system on chip (SOC), or a remote device to measure either the electrical resistivity or capacitive property of the TIM, depending on the type of TIM being used, as a means to directly assess the thermal properties (conductivity, resistance, and/or impedance) of the TIM as it ages. In an aspect, the electrical resistivity or capacitive property of the TIM may be initially measured and charted, and thereafter, the changes in the electrical resistivity or capacitive property may be sensed by the monitoring component and, based on the delta of those changes, there may be remedial actions taken to mitigate impacts to the overall system performance and/or to prevent irreparable damage to the semiconductor device/system.

Abstract: A mobile device may include circuitry, a thermally-conductive panel in thermal communication with the circuitry, and a housing with a user-operable thermal access cover that has a closed position to cover the thermally-conductive panel and an open position to expose the thermally-conductive panel. Embodiments may include a dock with which the mobile device may be engaged, wherein the dock may include a thermal transfer device to engage the thermally-conductive panel of the mobile device.

Abstract: A mobile device may include circuitry, a thermally-conductive panel in thermal communication with the circuitry, and a housing with a user-operable thermal access cover that has a closed position to cover the thermally-conductive panel and an open position to expose the thermally-conductive panel. Embodiments may include a dock with which the mobile device may be engaged, wherein the dock may include a thermal transfer device to engage the thermally-conductive panel of the mobile device.