Patents by Inventor Santiago Fernandez

Santiago Fernandez has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11991277
    Abstract: Aspects include a cryptographic hardware security module having a secure embedded heat pipe and methods for assembling the same. The cryptographic hardware security module can include a printed circuit board having one or more components. The cryptographic hardware security module can further include an encapsulation structure having a top can and a bottom can. The top can is fixed to a first surface of the printed circuit board and the bottom can is fixed to second surface of the printed circuit board opposite the first surface. A heat pipe is positioned between the top can and the component. The heat pipe includes two or more 180-degree bends. A portion of the heat pipe extends beyond a secure region of the encapsulation structure.
    Type: Grant
    Filed: August 17, 2021
    Date of Patent: May 21, 2024
    Assignee: International Business Machines Corporation
    Inventors: Arthur J. Higby, David Clifford Long, Edward N. Cohen, John R. Dangler, Matthew Doyle, Philipp K. Buchling Rego, William Santiago-Fernandez, Levi Campbell, James Busby
  • Patent number: 11965688
    Abstract: There is disclosed a transport refrigeration unit comprising an enclosed cargo space, an outer refrigeration cycle configured to transfer heat from the cargo space exteriorly of the cargo space, to cool the cargo space; a container installed within the cargo space; and an inner refrigeration cycle configured to transfer heat from an interior of the container, to cool the interior of the container. There is also disclosed a portable refrigeration device for use in such nested cooling arrangements, methods of adapting a transport refrigeration unit and/or portable refrigeration device for such use, a refrigeration module for such use, and an associated method of operating a transport refrigeration unit.
    Type: Grant
    Filed: January 4, 2022
    Date of Patent: April 23, 2024
    Assignee: THEMRO KING LLC
    Inventors: Inaki Fernandez Blanco, Santiago Martinez Ballester, Joan Vila Soler
  • Publication number: 20240121890
    Abstract: A structure of a circuitry substrate for securing an area from tampering is disclosed. The structure includes a circuitry substrate with at least one of a top tamper enclosure and a bottom tamper enclosure covering a component in a protected area of the circuitry substrate. The top and bottom tamper enclosures are adhesively bonded to a surface of the circuitry substrate, and a tear initiation site is added to a side of the perimeter of circuitry substrate bordering the protected area that includes at least one tamper enclosure, such that the tear initiation site is located and configured to enable propagation of a delamination of at least one internal layer of the circuitry substrate and a severing of a security circuit when a removal force is applied to the at least one of the top tamper enclosure and the bottom tamper enclosure.
    Type: Application
    Filed: October 10, 2022
    Publication date: April 11, 2024
    Inventors: Arthur J. Higby, DAVID CLIFFORD LONG, James Busby, William Santiago-Fernandez, John R. Dangler, Russell A. Budd, Philipp K Buchling Rego, Hannah Wendling, Lauren Boston
  • Patent number: 11882645
    Abstract: A laminate carrier-like module lid including multiple laminate layers of non-conductive materials stacked one atop another, sensor circuitry embedded within the laminate carrier-like module lid, the sensor circuitry providing a continuous electrical circuit surrounding the electronic components of the multi-chip module package, and thermal circuitry embedded within the laminate carrier-like module lid, the thermal circuitry comprising solid copper traces to thermally conduct heat from the electronic components of the multi-chip module package.
    Type: Grant
    Filed: October 22, 2021
    Date of Patent: January 23, 2024
    Assignee: International Business Machines Corporation
    Inventors: Sushumna Iruvanti, James Busby, Philipp K Buchling Rego, Steven Paul Ostrander, Thomas Anthony Wassick, William Santiago-Fernandez, Nihad Hadzic
  • Patent number: 11822707
    Abstract: A tamper detection system may include organic material and a tamper detection circuit embedded in the organic material. A portion of the organic material is ablated away to form an incision in the organic material. A portion of the tamper detection circuit obstructs a fragment of the ablation path. The tamper detection circuit remains intact. The incision enables a gas flow between a first side of the organic material and a second side of the organic material.
    Type: Grant
    Filed: June 1, 2021
    Date of Patent: November 21, 2023
    Assignee: International Business Machines Corporation
    Inventors: William Santiago-Fernandez, Russell A. Budd, James Busby, Arthur J Higby, Michael Fisher, Silvio Dragone, Stefano Sergio Oggioni, David Clifford Long
  • Publication number: 20230296556
    Abstract: Techniques described herein can apply AC signals with different phases to different groups of nanopore cells in a nanopore sensor chip. When a first group of nanopore cells is in a dark period and is not sampled or minimally sampled by an analog-to-digital converter (ADC) to capture useful data, a second group of nanopore cells is in a bright period during which output signals from the second group of nanopore cells are sampled by the analog-to-digital converter. The reference level setting of the ADC is dynamically changed based on the applied AC signals to fully utilize the dynamic range of the ADC.
    Type: Application
    Filed: January 30, 2023
    Publication date: September 21, 2023
    Inventors: J. William MANEY, Jr., Santiago FERNANDEZ-GOMEZ
  • Publication number: 20230130104
    Abstract: A laminate carrier-like module lid including multiple laminate layers of non-conductive materials stacked one atop another, sensor circuitry embedded within the laminate carrier-like module lid, the sensor circuitry providing a continuous electrical circuit surrounding the electronic components of the multi-chip module package, and thermal circuitry embedded within the laminate carrier-like module lid, the thermal circuitry comprising solid copper traces to thermally conduct heat from the electronic components of the multi-chip module package.
    Type: Application
    Filed: October 22, 2021
    Publication date: April 27, 2023
    Inventors: Sushumna Iruvanti, James Busby, Philipp K. Buchling Rego, Steven Paul Ostrander, Thomas Anthony Wassick, William Santiago-Fernandez, Nihad Hadzic
  • Publication number: 20230066911
    Abstract: The present invention is related to a method for reconstructing at least one trace in a seismic image of a common receiver and time domain, the image comprising traces in time domain with seismic data and one or more traces to be reconstructed. A first aspect of the invention is a method that is characterized by a specific use of a convolutional neural network trained under an unsupervised learning approach with a modified receptive field. A second aspect of the invention is a deblending method based on the use of a reconstructing method according to the first aspect of the invention applied to a denoising step of a deblending process allowing a very effective data acquisition while keeping a high quality output data sets after being processed according to the first and/or second aspects of the invention.
    Type: Application
    Filed: July 25, 2022
    Publication date: March 2, 2023
    Inventors: Prashanth NADUKANDI, Pablo Enrique VARGAS MENDOZA, Santiago FERNÁNDEZ PRIETO, German OCAMPO BOTERO, Wenyi HU, Shirui WANG, Pengyu YUAN
  • Publication number: 20230054606
    Abstract: Aspects include a cryptographic hardware security module having a secure embedded heat pipe and methods for assembling the same. The cryptographic hardware security module can include a printed circuit board having one or more components. The cryptographic hardware security module can further include an encapsulation structure having a top can and a bottom can. The top can is fixed to a first surface of the printed circuit board and the bottom can is fixed to second surface of the printed circuit board opposite the first surface. A heat pipe is positioned between the top can and the component. The heat pipe includes two or more 180-degree bends. A portion of the heat pipe extends beyond a secure region of the encapsulation structure.
    Type: Application
    Filed: August 17, 2021
    Publication date: February 23, 2023
    Inventors: Arthur J. Higby, DAVID CLIFFORD LONG, Edward N. Cohen, John R. Dangler, Matthew Doyle, Philipp K. Buchling Rego, William Santiago-Fernandez, Levi CAMPBELL, James Busby
  • Patent number: 11585784
    Abstract: Techniques described herein can apply AC signals with different phases to different groups of nanopore cells in a nanopore sensor chip. When a first group of nanopore cells is in a dark period and is not sampled or minimally sampled by an analog-to-digital converter (ADC) to capture useful data, a second group of nanopore cells is in a bright period during which output signals from the second group of nanopore cells are sampled by the analog-to-digital converter. The reference level setting of the ADC is dynamically changed based on the applied AC signals to fully utilize the dynamic range of the ADC.
    Type: Grant
    Filed: February 8, 2021
    Date of Patent: February 21, 2023
    Assignee: Roche Sequencing Solutions, Inc.
    Inventors: J. William Maney, Jr., Santiago Fernandez-Gomez
  • Patent number: 11549935
    Abstract: A method of exporting measurements of a nanopore sensor on a nanopore based sequencing chip is disclosed. An electrical characteristic associated with the nanopore sensor is measured. The electrical characteristic associated with the nanopore sensor is processed. A summary for the electrical characteristic and one or more previous electrical characteristics is determined. The summary for the electrical characteristic and the one or more previous electrical characteristics are exported. Determining the summary includes determining that the electrical characteristic and at least a portion of the one or more previous electrical characteristics correspond to a base call event at the nanopore sensor. The summary represents the electrical characteristic and the at least a portion of the one or more previous electrical characteristics.
    Type: Grant
    Filed: June 3, 2020
    Date of Patent: January 10, 2023
    Assignee: Roche Sequencing Solutions, Inc.
    Inventors: Roger J. A. Chen, Santiago Fernandez-Gomez, Hui Tian
  • Publication number: 20220382921
    Abstract: A tamper detection system may include organic material and a tamper detection circuit embedded in the organic material. A portion of the organic material is ablated away to form an incision in the organic material. A portion of the tamper detection circuit obstructs a fragment of the ablation path. The tamper detection circuit remains intact. The incision enables a gas flow between a first side of the organic material and a second side of the organic material.
    Type: Application
    Filed: June 1, 2021
    Publication date: December 1, 2022
    Inventors: William Santiago-Fernandez, Russell A. Budd, James Busby, Arthur J Higby, MICHAEL FISHER, Silvio Dragone, Stefano Sergio Oggioni, DAVID CLIFFORD LONG
  • Publication number: 20220310205
    Abstract: A system includes a plurality of nanopore cells. Data corresponding to nanopore states of the plurality of nanopore cells is received. The data is analyzed to determine a compressed output size of the data given at least one compression technique. It is determined whether the compressed output size exceeds a data budget. In the event it is determined that the compressed output size exceeds the data budget, the data is modified. The modified data is outputted.
    Type: Application
    Filed: June 14, 2022
    Publication date: September 29, 2022
    Inventors: Santiago Fernandez-Gomez, Hui Tian, J. William Maney, JR., Jayalakshmi Rajaraman
  • Publication number: 20220244211
    Abstract: A nanopore measurement circuit includes a first analog memory configured to store a first electrical value corresponding to a first measurement sample of a nanopore and a second analog memory configured to store a second electrical value corresponding to a second measurement sample of the nanopore. The nanopore measurement circuit also includes a measurement circuitry configured to provide an output indicating a difference between the first electrical value of the first analog memory and the second electrical value of the second analog memory.
    Type: Application
    Filed: April 20, 2022
    Publication date: August 4, 2022
    Inventors: Santiago Fernandez-Gomez, Bill Maney, Hui Tian
  • Patent number: 11382210
    Abstract: A uniform thickness flex circuit is taught that uses more than one dielectric layer. A first dielectric layer is more flexible and capable of reliably bending at a radius of curvature at which a second dielectric layer cannot be reliably bent. The second dielectric layer has at least one more desirable electrical characteristic than the first dielectric area, for example leakage. Use of the uniform thickness flex circuit to protect sensitive material in an electronic enclosure is also described.
    Type: Grant
    Filed: December 17, 2020
    Date of Patent: July 5, 2022
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: John R. Dangler, Arthur J Higby, Philipp K Buchling Rego, David Clifford Long, James Busby, Matthew Doyle, Edward N. Cohen, Michael Fisher, William Santiago-Fernandez
  • Publication number: 20220201839
    Abstract: A uniform thickness flex circuit is taught that uses more than one dielectric layer. A first dielectric layer is more flexible and capable of reliably bending at a radius of curvature at which a second dielectric layer cannot be reliably bent. The second dielectric layer has at least one more desirable electrical characteristic than the first dielectric area, for example leakage. Use of the uniform thickness flex circuit to protect sensitive material in an electronic enclosure is also described.
    Type: Application
    Filed: December 17, 2020
    Publication date: June 23, 2022
    Inventors: John R. Dangler, Arthur J. Higby, Philipp K. Buchling Rego, DAVID CLIFFORD LONG, James Busby, MATTHEW DOYLE, Edward N. Cohen, MICHAEL FISHER, William Santiago-Fernandez
  • Patent number: 11361843
    Abstract: A system includes a plurality of nanopore cells. Data corresponding to nanopore states of the plurality of nanopore cells is received. The data is analyzed to determine a compressed output size of the data given at least one compression technique. It is determined whether the compressed output size exceeds a data budget. In the event it is determined that the compressed output size exceeds the data budget, the data is modified. The modified data is outputted.
    Type: Grant
    Filed: August 30, 2018
    Date of Patent: June 14, 2022
    Assignee: Genia Technologies, Inc.
    Inventors: Santiago Fernandez-Gomez, Hui Tian, J. William Maney, Jayalakshmi Rajaraman
  • Patent number: 11320390
    Abstract: A nanopore measurement circuit includes a first analog memory configured to store a first electrical value corresponding to a first measurement sample of a nanopore and a second analog memory configured to store a second electrical value corresponding to a second measurement sample of the nanopore. The nanopore measurement circuit also includes a measurement circuitry configured to provide an output indicating a difference between the first electrical value of the first analog memory and the second electrical value of the second analog memory.
    Type: Grant
    Filed: April 28, 2020
    Date of Patent: May 3, 2022
    Inventors: Santiago Fernandez-Gomez, Bill Maney, Hui Tian
  • Patent number: 11244079
    Abstract: Provided is a method for masking a sensitive signal by injecting noise into planes of a printed circuit board (PCB). The method comprises detecting, by a secondary integrated circuit (IC), a noise signal on a shared plane of a PCB that includes the secondary IC. The noise signal may be analyzed to determine the characteristics of the noise signal. A masking signal may be generated based on the characteristics. The masking signal may then be injected onto the shared plane.
    Type: Grant
    Filed: September 18, 2019
    Date of Patent: February 8, 2022
    Assignee: International Business Machines Corporation
    Inventors: Matteo Cocchini, Silvio Dragone, Stefano Sergio Oggioni, James Busby, William Santiago-Fernandez
  • Patent number: 11228457
    Abstract: The present invention discloses a method for managing priority-arbitrated access to a set of one or more computational engines of a physical computing device. The method includes providing a multiplexer module and a network bus in the physical computing device, wherein the multiplexer module is connected to the network bus. The method further includes receiving, by the multiplexer module, a first data processing request from a driver and inferring, by the multiplexer module, a first priority class from the first data processing request according to at least one property of the first data processing request. The method further includes manipulating, by the multiplexer module, a priority according to which the physical computing device handles data associated with the first data processing request in relation to data associated with other data processing requests, wherein the priority is determined by the first priority class.
    Type: Grant
    Filed: April 7, 2020
    Date of Patent: January 18, 2022
    Assignee: International Business Machines Corporation
    Inventors: Silvio Dragone, Tamas Visegrady, Michael Charles Osborne, William Santiago-Fernandez