Patents by Inventor Santoru Yamada

Santoru Yamada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor devices including first and second silicon interconnection regions
    Patent number: 8169074
    Abstract: Provided are a semiconductor device and a method of fabricating the same. The semiconductor device includes a first interconnection disposed on a substrate. The interconnection includes a first silicon interconnection region and a first metal interconnection region sequentially stacked on the substrate. A second interconnection includes a second silicon interconnection region and a second metal interconnection region that are stacked sequentially. The second silicon interconnection region has a lower resistivity than the first silicon interconnection region.
    Type: Grant
    Filed: June 30, 2010
    Date of Patent: May 1, 2012
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jong-Man Park, Santoru Yamada
  • Semiconductor Device and Method of Fabricating the Same
    Publication number: 20110020993
    Abstract: Provided are a semiconductor device and a method of fabricating the same. The semiconductor device includes a first interconnection disposed on a substrate. The interconnection includes a first silicon interconnection region and a first metal interconnection region sequentially stacked on the substrate. A second interconnection includes a second silicon interconnection region and a second metal interconnection region that are stacked sequentially. The second silicon interconnection region has a lower resistivity than the first silicon interconnection region.
    Type: Application
    Filed: June 30, 2010
    Publication date: January 27, 2011
    Inventors: Jong-Man Park, Santoru Yamada