Abstract: A microwave module is described. The microwave module includes a base bracket, a window plate and a lid. The base bracket is configured to contain a photoconductive switch, a radio-frequency transformer and dielectric oil. The window plate, which is transparent to optical light, covers a first portion of the base bracket in which the photoconductive switch is located. The window plate is sealed to the base bracket. The lid, which includes a cutout to allow the radio-frequency transformer to pass through the lid, covers a second portion of the base bracket in which the radio-frequency transformer is located. The window plate is sealed to the base bracket, and the lid is sealed to the window plate, the base bracket and the radio-frequency transformer to contain the dielectric oil within the microwave module.

Abstract: A microwave module is described. The microwave module includes a base bracket, a window plate and a lid. The base bracket is configured to contain a photoconductive switch, a radio-frequency transformer and dielectric oil. The window plate, which is transparent to optical light, covers a first portion of the base bracket in which the photoconductive switch is located. The window plate is sealed to the base bracket. The lid, which includes a cutout to allow the radio-frequency transformer to pass through the lid, covers a second portion of the base bracket in which the radio-frequency transformer is located. The window plate is sealed to the base bracket, and the lid is sealed to the window plate, the base bracket and the radio-frequency transformer to contain the dielectric oil within the microwave module.

Abstract: An electronic device package includes a substrate and wire columns arranged in groups about a neutral stress point of the substrate. The height of the wire columns is substantially uniform for the plural groups of wire columns, and a length of at least one of the wire columns is greater than the uniform height. A method of fabricating an electronic device package having a column grid array includes applying two templates on wire columns of the column grid array and bending at least one wire column to increase its length while maintaining a uniform height for the column grid array. In another aspect, an electronic device package substrate includes wire columns having at least one non-uniformity in lengths of the columns, and the length of a wire column corresponds to a distance of that wire column from the neutral stress point of the substrate.

Abstract: An electronic device package includes a substrate and wire columns arranged in groups about a neutral stress point of the substrate. The height of the wire columns is substantially uniform for the plural groups of wire columns, and a length of at least one of the wire columns is greater than the uniform height. A method of fabricating an electronic device package having a column grid array includes applying two templates on wire columns of the column grid array and bending at least one wire column to increase its length while maintaining a uniform height for the column grid array. In another aspect, an electronic device package substrate includes wire columns having at least one non-uniformity in lengths of the columns, and the length of a wire column corresponds to a distance of that wire column from the neutral stress point of the substrate.

Abstract: An electronic device package includes a substrate and wire columns arranged in groups about a neutral stress point of the substrate. The height of the wire columns is substantially uniform for the plural groups of wire columns, and a length of at least one of the wire columns is greater than the uniform height. A method of fabricating an electronic device package having a column grid array includes applying two templates on wire columns of the column grid array and bending at least one wire column to increase its length while maintaining a uniform height for the column grid array. In another aspect, an electronic device package substrate includes wire columns having at least one non-uniformity in lengths of the columns, and the length of a wire column corresponds to a distance of that wire column from the neutral stress point of the substrate.

Abstract: An electronic device package includes a substrate and wire columns arranged in groups about a neutral stress point of the substrate. The height of the wire columns is substantially uniform for the plural groups of wire columns, and a length of at least one of the wire columns is greater than the uniform height. A method of fabricating an electronic device package having a column grid array includes applying two templates on wire columns of the column grid array and bending at least one wire column to increase its length while maintaining a uniform height for the column grid array. In another aspect, an electronic device package substrate includes wire columns having at least one non-uniformity in lengths of the columns, and the length of a wire column corresponds to a distance of that wire column from the neutral stress point of the substrate.

Abstract: A method for stacking chips within a multichip module package is disclosed. A first chip is bonded to a substrate. A passivation layer is then deposited on a top surface of the first chip. After a first adhesive layer has been deposited on top of the passivation layer, an interposer is placed on the adhesive layer. Next, a second adhesive layer is deposited on the interposer. Finally, a second chip is bonded to the interposer via the second adhesive layer.

Abstract: A method for stacking chips within a multichip module package is disclosed. A first chip is bonded to a substrate. A passivation layer is then deposited on a top surface of the first chip. After a first adhesive layer has been deposited on top of the passivation layer, an interposer is placed on the adhesive layer. Next, a second adhesive layer is deposited on the interposer. Finally, a second chip is bonded to the interposer via the second adhesive layer.