Patents by Inventor Santosh Bhattacharyya
Santosh Bhattacharyya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11922159Abstract: An information handling system may include a processor and a management controller communicatively coupled to the processor and configured to perform out-of-band management of the information handling system, the management controller further configured to, in response to a request from a management utility remote from the information handling system to create a firmware image for an item of firmware for a cluster comprising the information handling system retrieve a firmware update package, store the firmware update package in a repository integral to the management controller, and communicate a uniform resource locator to the management utility setting forth a path of the firmware update package within the repository, such that the management utility may later use the uniform resource locator to perform a firmware update for another information handling system of the cluster.Type: GrantFiled: January 14, 2022Date of Patent: March 5, 2024Assignee: Dell Products L.P.Inventors: Santosh Gore, Karthik Sethuramalingam, Riddhiman Bhattacharyya
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Patent number: 11450012Abstract: A rendered image is aligned with a scanning electron microscope (SEM) image to produce an aligned rendered image. A reference image is aligned with the SEM image to produce an aligned reference image. A threshold probability map also is generated. Dynamic compensation of the SEM image and aligned reference image can produce a corrected SEM image and corrected reference image. A thresholded defect map can be generated and the defects of the thresholded probability map and the signal-to-noise-ratio defects of the thresholded defect map are filtered using a broadband-plasma-based property to produce defect-of-interest clusters.Type: GrantFiled: April 17, 2020Date of Patent: September 20, 2022Assignee: KLA CorporationInventors: Santosh Bhattacharyya, Ge Cong, Sanbong Park, Boshi Huang
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Publication number: 20220059316Abstract: A scanning electron microscope receives a results file for a wafer from an optical inspection system. The results file includes an anchor point on the wafer. A defect review image at the anchor point on the wafer is generated using the scanning electron microscope. A design clip is aligned to the defect review image at the anchor point thereby generating an aligned defect review image. The aligned defect review image is used for defect detection.Type: ApplicationFiled: February 22, 2021Publication date: February 24, 2022Inventors: Santosh Bhattacharyya, Steve Esbenshade
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Patent number: 11151707Abstract: A system for defect review and classification is disclosed. The system may include a controller, wherein the controller may be configured to receive one or more training images of a specimen. The one or more training images including a plurality of training defects. The controller may be further configured to apply a plurality of difference filters to the one or more training images, and receive a signal indicative of a classification of a difference filter effectiveness metric for at least a portion of the plurality of difference filters. The controller may be further configured to generate a deep learning network classifier based on the received classification and the attributes of the plurality of training defects. The controller may be further configured to extract convolution layer filters of the deep learning network classifier, and generate one or more difference filter recipes based on the extracted convolution layer filters.Type: GrantFiled: February 15, 2019Date of Patent: October 19, 2021Assignee: KLA CorporationInventors: Santosh Bhattacharyya, Jacob George, Saravanan Paramasivam, Martin Plihal
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Patent number: 11049745Abstract: A method of semiconductor-wafer image alignment is performed at a semiconductor-wafer defect-inspection system. In the method, a semiconductor wafer is loaded into the semiconductor-wafer defect-inspection system. Pre-inspection alignment is performed for the semiconductor wafer. After performing the pre-inspection alignment, a first swath is executed to generate a first image of a first region on the semiconductor wafer. An offset of a target structure in the first image with respect to a known point is determined. Defect identification is performed for the first image, using the offset. After executing the first swath and determining the offset, a second swath is executed to generate a second image of a second region on the semiconductor wafer. While executing the second swath, run-time alignment of the semiconductor wafer is performed using the offset.Type: GrantFiled: May 21, 2019Date of Patent: June 29, 2021Assignee: KLA CorporationInventors: David Dowling, Tarunark Singh, Bjorn Brauer, Santosh Bhattacharyya, Bryant Mantiply, Hucheng Lee, Xiaochun Li, Sangbong Park
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Patent number: 11047806Abstract: Methods and systems for discovery of defects of interest (DOI) buried within three dimensional semiconductor structures and recipe optimization are described herein. The volume of a semiconductor wafer subject to defect discovery and verification is reduced by storing images associated with a subset of the total depth of the semiconductor structures under measurement. Image patches associated with defect locations at one or more focus planes or focus ranges are recorded. The number of optical modes under consideration is reduced based on any of a comparison of one or more measured wafer level defect signatures and one or more expected wafer level defect signatures, measured defect signal to noise ratio, and defects verified without de-processing. Furthermore, verified defects and recorded images are employed to train a nuisance filter and optimize the measurement recipe. The trained nuisance filter is applied to defect images to select the optimal optical mode for production.Type: GrantFiled: November 29, 2017Date of Patent: June 29, 2021Assignee: KLA-Tencor CorporationInventors: Santosh Bhattacharyya, Devashish Sharma, Christopher Maher, Bo Hua, Philip Measor, Robert M. Danen
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Publication number: 20210133989Abstract: A rendered image is aligned with a scanning electron microscope (SEM) image to produce an aligned rendered image. A reference image is aligned with the SEM image to produce an aligned reference image. A threshold probability map also is generated. Dynamic compensation of the SEM image and aligned reference image can produce a corrected SEM image and corrected reference image. A thresholded defect map can be generated and the defects of the thresholded probability map and the signal-to-noise-ratio defects of the thresholded defect map are filtered using a broadband-plasma-based property to produce defect-of-interest clusters.Type: ApplicationFiled: April 17, 2020Publication date: May 6, 2021Inventors: Santosh Bhattacharyya, Ge Cong, Sanbong Park, Boshi Huang
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Patent number: 10832396Abstract: Methods and systems for setting up inspection of a specimen with design and noise based care areas are provided. One system includes one or more computer subsystems configured for generating a design-based care area for a specimen. The computer subsystem(s) are also configured for determining one or more output attributes for multiple instances of the care area on the specimen, and the one or more output attributes are determined from output generated by an output acquisition subsystem for the multiple instances. The computer subsystem(s) are further configured for separating the multiple instances of the care area on the specimen into different care area sub-groups such that the different care area sub-groups have statistically different values of the output attribute(s) and selecting a parameter of an inspection recipe for the specimen based on the different care area sub-groups.Type: GrantFiled: March 25, 2019Date of Patent: November 10, 2020Assignee: KLA-Tencor Corp.Inventors: Brian Duffy, Martin Plihal, Santosh Bhattacharyya, Gordon Rouse, Chris Maher, Erfan Soltanmohammadi
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Publication number: 20200184628Abstract: A system for defect review and classification is disclosed. The system may include a controller, wherein the controller may be configured to receive one or more training images of a specimen. The one or more training images including a plurality of training defects. The controller may be further configured to apply a plurality of difference filters to the one or more training images, and receive a signal indicative of a classification of a difference filter effectiveness metric for at least a portion of the plurality of difference filters. The controller may be further configured to generate a deep learning network classifier based on the received classification and the attributes of the plurality of training defects. The controller may be further configured to extract convolution layer filters of the deep learning network classifier, and generate one or more difference filter recipes based on the extracted convolution layer filters.Type: ApplicationFiled: February 15, 2019Publication date: June 11, 2020Inventors: Santosh Bhattacharyya, Jacob George, Saravanan Paramasivam, Martin Plihal
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Publication number: 20200126212Abstract: Methods and systems for setting up inspection of a specimen with design and noise based care areas are provided. One system includes one or more computer subsystems configured for generating a design-based care area for a specimen. The computer subsystem(s) are also configured for determining one or more output attributes for multiple instances of the care area on the specimen, and the one or more output attributes are determined from output generated by an output acquisition subsystem for the multiple instances. The computer subsystem(s) are further configured for separating the multiple instances of the care area on the specimen into different care area sub-groups such that the different care area sub-groups have statistically different values of the output attribute(s) and selecting a parameter of an inspection recipe for the specimen based on the different care area sub-groups.Type: ApplicationFiled: March 25, 2019Publication date: April 23, 2020Inventors: Brian Duffy, Martin Plihal, Santosh Bhattacharyya, Gordon Rouse, Chris Maher, Erfan Soltanmohammadi
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Publication number: 20200126830Abstract: A method of semiconductor-wafer image alignment is performed at a semiconductor-wafer defect-inspection system. In the method, a semiconductor wafer is loaded into the semiconductor-wafer defect-inspection system. Pre-inspection alignment is performed for the semiconductor wafer. After performing the pre-inspection alignment, a first swath is executed to generate a first image of a first region on the semiconductor wafer. An offset of a target structure in the first image with respect to a known point is determined. Defect identification is performed for the first image, using the offset. After executing the first swath and determining the offset, a second swath is executed to generate a second image of a second region on the semiconductor wafer. While executing the second swath, run-time alignment of the semiconductor wafer is performed using the offset.Type: ApplicationFiled: May 21, 2019Publication date: April 23, 2020Inventors: David Dowling, Tarunark Singh, Bjorn Brauer, Santosh Bhattacharyya, Bryant Mantiply, Hucheng Lee, Xiaochun Li, Sangbong Park
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Patent number: 10395358Abstract: Systems and methods for detecting defects on a reticle are provided. One system includes computer subsystem(s) that include one or more image processing components that acquire images generated by an inspection subsystem for a wafer, a main user interface component that provides information generated for the wafer and the reticle to a user and receives instructions from the user, and an interface component that provides an interface between the one or more image processing components and the main user interface. Unlike currently used systems, the one or more image processing components are configured for performing repeater defect detection by applying a repeater defect detection algorithm to the images acquired by the one or more image processing components, and the repeater defect detection algorithm is configured to detect defects on the wafer using a hot threshold and to identify the defects that are repeater defects.Type: GrantFiled: November 6, 2017Date of Patent: August 27, 2019Assignee: KLA-Tencor Corp.Inventors: Bjorn Brauer, Eugene Shifrin, Ashok Mathew, Chetana Bhaskar, Lisheng Gao, Santosh Bhattacharyya, Hucheng Lee, Benjamin Murray
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Patent number: 10325361Abstract: A system, method, and computer program product are provided for automatically generating a wafer image to design coordinate mapping. In use, a design of a wafer is received by a computer processor. In addition, an image of a wafer fabricated from the design is received by the computer processor. Further, a coordinate mapping between the design and the image is automatically generated by the computer processor.Type: GrantFiled: December 1, 2016Date of Patent: June 18, 2019Assignee: KLA-Tencor CorporationInventor: Santosh Bhattacharyya
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Patent number: 10192302Abstract: Defect detection is performed by comparing a test image and a reference image with a rendered design image, which may be generated from a design file. This may occur because a comparison of the test image and another reference image was inconclusive due to noise. The results of the two comparisons with the rendered design image can indicate whether a defect is present in the test image.Type: GrantFiled: November 21, 2016Date of Patent: January 29, 2019Assignee: KLA-Tencor CorporationInventors: Bjorn Brauer, Santosh Bhattacharyya
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Patent number: 10151706Abstract: Methods and systems for detecting defects on a specimen are provided. One method includes identifying first and second portions of dies on a specimen as edge dies and center dies, respectively. The method also includes determining first and second inspection methods for the first and second portions, respectively. Parameter(s) of comparisons performed in the first and second inspection methods are different. The method further includes detecting defects in at least one of the edge dies using the first inspection method and detecting defects in at least one of the center dies using the second inspection method.Type: GrantFiled: April 6, 2017Date of Patent: December 11, 2018Assignee: KLA-Tencor Corp.Inventors: Santosh Bhattacharyya, Hucheng Lee, Bjorn Brauer
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Patent number: 10127651Abstract: Criticality of a detected defect can be determined based on context codes. The context codes can be generated for a region, each of which may be part of a die. Noise levels can be used to group context codes. The context codes can be used to automatically classify a range of design contexts present on a die without needing certain information a priori.Type: GrantFiled: November 21, 2016Date of Patent: November 13, 2018Assignee: KLA-Tencor CorporationInventors: Ashok Kulkarni, Saibal Banerjee, Santosh Bhattacharyya, Bjorn Brauer
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Patent number: 9996942Abstract: Methods and systems for determining a position of output generated by an inspection subsystem in design data space are provided. In general, some embodiments described herein are configured for substantially accurately aligning inspection subsystem output generated for a specimen to a design for the specimen despite deformation of the design in the inspection subsystem output. In addition, some embodiments are configured for generating and/or using alignment targets that can be shared across multiple specimens of the same layer and design rule for alignment of inspection subsystem output generated for a specimen to a design for the specimen.Type: GrantFiled: March 17, 2016Date of Patent: June 12, 2018Assignee: KLA-Tencor Corp.Inventors: Santosh Bhattacharyya, Pavan Kumar, Lisheng Gao, Thirupurasundari Jayaraman, Raghav Babulnath, Srikanth Kandukuri, Gangadharan Sivaraman, Karthikeyan Subramanian, Raghavan Konuru, Rahul Lakhawat
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Publication number: 20180149603Abstract: Methods and systems for discovery of defects of interest (DOI) buried within three dimensional semiconductor structures and recipe optimization are described herein. The volume of a semiconductor wafer subject to defect discovery and verification is reduced by storing images associated with a subset of the total depth of the semiconductor structures under measurement. Image patches associated with defect locations at one or more focus planes or focus ranges are recorded. The number of optical modes under consideration is reduced based on any of a comparison of one or more measured wafer level defect signatures and one or more expected wafer level defect signatures, measured defect signal to noise ratio, and defects verified without de-processing. Furthermore, verified defects and recorded images are employed to train a nuisance filter and optimize the measurement recipe. The trained nuisance filter is applied to defect images to select the optimal optical mode for production.Type: ApplicationFiled: November 29, 2017Publication date: May 31, 2018Inventors: Santosh Bhattacharyya, Devashish Sharma, Christopher Maher, Bo Hua, Philip Measor, Robert M. Danen
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Publication number: 20180130199Abstract: Systems and methods for detecting defects on a reticle are provided. One system includes computer subsystem(s) that include one or more image processing components that acquire images generated by an inspection subsystem for a wafer, a main user interface component that provides information generated for the wafer and the reticle to a user and receives instructions from the user, and an interface component that provides an interface between the one or more image processing components and the main user interface. Unlike currently used systems, the one or more image processing components are configured for performing repeater defect detection by applying a repeater defect detection algorithm to the images acquired by the one or more image processing components, and the repeater defect detection algorithm is configured to detect defects on the wafer using a hot threshold and to identify the defects that are repeater defects.Type: ApplicationFiled: November 6, 2017Publication date: May 10, 2018Inventors: Bjorn Brauer, Eugene Shifrin, Ashok Mathew, Chetana Bhaskar, Lisheng Gao, Santosh Bhattacharyya, Hucheng Lee, Benjamin Murray
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Patent number: 9965848Abstract: Shape primitives are used for inspection of a semiconductor wafer or other workpiece. The shape primitives can define local topological and geometric properties of a design. One or more rules are applied to the shape primitives. The rules can indicate presence of a defect or the likelihood of a defect being present. A rule execution engine can search for an occurrence of the shape primitives covered by the at least one rule.Type: GrantFiled: November 18, 2016Date of Patent: May 8, 2018Assignee: KLA-Tencor CorporationInventors: Saibal Banerjee, Ashok Kulkarni, Jagdish Saraswatula, Santosh Bhattacharyya