Patents by Inventor Santosh Gangal

Santosh Gangal has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240175640
    Abstract: A heat pipe, including: a variable dimension heat pipe exoskeleton formed of a heat-conductive material by blow molding or additive manufacturing, wherein the variable dimension heat pipe exoskeleton including: a first heat pipe exoskeleton portion with a dimension having a first value; and a second heat pipe exoskeleton portion with the dimension having a second value different from the first value. Further, a method of manufacturing a heat pipe, including: providing a heat-conductive material; and performing blow molding or additive manufacturing to form a variable dimension heat pipe exoskeleton of the heat-conductive material, wherein the heat pipe exoskeleton has a first heat pipe exoskeleton portion with a dimension having a first value, and a second heat pipe exoskeleton portion with the dimension having a second value different from the first value.
    Type: Application
    Filed: December 26, 2023
    Publication date: May 30, 2024
    Inventors: Santosh Gangal, Akarsha Kadadevaramath, Raghavendra S. Kanivihalli, Prakash Kurma Raju, Navneet Singh, Sarma Vmk Vedhanabhatla
  • Publication number: 20230087586
    Abstract: Keyboards that are selectably configurable between a standard interface and a braille interface. In embodiments, the keyboard is equipped with six keys corresponding to six dots of a braille matrix, each of the keys equipped with a shape memory alloy spring or other mechanism to cause each of the keys to selectably extend above the keyboard plane. On activation, the six keys are extended and the remaining keys deactivated, to provide an easy to locate braille interface. On subsequent activation, the six keys are retracted and the keyboard is reverted to a standard interface. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: November 30, 2022
    Publication date: March 23, 2023
    Inventors: Smit KAPILA, Prakash KURMA RAJU, Naveen KUMAR, Santosh GANGAL
  • Publication number: 20220407557
    Abstract: A wireless computing device may include an internal antenna, a radio frequency (RF) transmission path that is switchably connectable to the internal antenna, a Universal Serial Bus (USB) connector configured to connect to an external antenna, a detector configured to detect if an external antenna is connected to the USB connector, and an antenna selector configured to (1) connect the internal antenna into the RF transmission path if the detector detects that no external antenna is connected to the USB connector and (2) disconnect the internal antenna from the RF transmission path and connect the external antenna into the RF transmission path if the detector detects that the external antenna is connected to the USB connector, thereby improving the wireless transmission/reception performance of the internal wireless module of the wireless computing device.
    Type: Application
    Filed: June 16, 2021
    Publication date: December 22, 2022
    Inventors: Smit KAPILA, Jayprakash THAKUR, Santosh GANGAL
  • Publication number: 20220302006
    Abstract: Disclosed herein are via plug resistors for incorporation into electronic substrates, and related methods and devices. Exemplary via plug resistor structures include a resistive element within and on a surface of a via extending at least partially through an electronic substrate and first and second electrodes coupled to the resistive element.
    Type: Application
    Filed: March 17, 2021
    Publication date: September 22, 2022
    Applicant: Intel Corporation
    Inventors: Santosh Gangal, Tin Poay Chuah
  • Publication number: 20220302007
    Abstract: Disclosed herein are via plug capacitors for incorporation into electronic substrates, and related methods and devices. Exemplary via plug capacitor structures include a capacitive element within a via extending at least partially through an electronic substrate and first and second electrodes coupled to the capacitive element.
    Type: Application
    Filed: March 17, 2021
    Publication date: September 22, 2022
    Applicant: Intel Corporation
    Inventors: Santosh Gangal, Tin Poay Chuah