Patents by Inventor Santosh Kumar Pappu

Santosh Kumar Pappu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10474785
    Abstract: A device receives void configuration information that identifies a set of rules for generating void information based on printed circuit board (PCB) design information, and receives, based on receiving the void configuration information, the PCB design information that identifies via information of a PCB. The device compares, based on receiving the PCB design information, the set of rules, associated with the void configuration information, and the via information associated with the PCB design information, and generates the void information based on comparing the set of rules, associated with the void configuration information, and the via information associated with the PCB design information. The void information includes a set of parameters associated with a set of voids to be included in the PCB. The device performs an action based on generating the void information.
    Type: Grant
    Filed: December 18, 2017
    Date of Patent: November 12, 2019
    Assignee: Juniper Networks, Inc.
    Inventors: Venkata G Ramanan, John P. Nguyen, Santosh Kumar Pappu
  • Patent number: 10383213
    Abstract: In some examples, an electronic device includes a printed circuit board (PCB) device that includes a first trace electrically connected to a first pad of a first trace via on a first layer and a second trace electrically connected to a second pad of a second trace via on a second layer. In some examples, the PCB device also includes four ground pads on the first layer and an antipad surrounding the two trace vias, where a first ground pad is positioned between the first trace and the second trace, where the first ground pad and the second ground pad are approximately symmetrically positioned about a perpendicular bisector of a line from the first pad to the second pad, and wherein the third ground pad and the fourth ground pad are approximately symmetrically positioned about the perpendicular bisector of the line from the first pad to the second pad.
    Type: Grant
    Filed: February 22, 2019
    Date of Patent: August 13, 2019
    Assignee: Juniper Networks, Inc.
    Inventors: David P. Chengson, Edward C. Chang, Ranjeeth Doppalapudi, Santosh Kumar Pappu
  • Publication number: 20190188355
    Abstract: A device receives void configuration information that identifies a set of rules for generating void information based on printed circuit board (PCB) design information, and receives, based on receiving the void configuration information, the PCB design information that identifies via information of a PCB. The device compares, based on receiving the PCB design information, the set of rules, associated with the void configuration information, and the via information associated with the PCB design information, and generates the void information based on comparing the set of rules, associated with the void configuration information, and the via information associated with the PCB design information. The void information includes a set of parameters associated with a set of voids to be included in the PCB design. The device performs an action based on generating the void information.
    Type: Application
    Filed: December 18, 2017
    Publication date: June 20, 2019
    Inventors: Venkata G. RAMANAN, John P. Nguyen, Santosh Kumar Pappu
  • Patent number: 10231325
    Abstract: In some examples, an electronic device includes a printed circuit board (PCB) device that includes a first trace electrically connected to a first pad of a first trace via on a first layer and a second trace electrically connected to a second pad of a second trace via on a second layer. In some examples, the PCB device also includes four ground pads on the first layer and an antipad surrounding the two trace vias, where a first ground pad is positioned between the first trace and the second trace, where the first ground pad and the second ground pad are approximately symmetrically positioned about a perpendicular bisector of a line from the first pad to the second pad, and wherein the third ground pad and the fourth ground pad are approximately symmetrically positioned about the perpendicular bisector of the line from the first pad to the second pad.
    Type: Grant
    Filed: December 20, 2016
    Date of Patent: March 12, 2019
    Assignee: Juniper Networks, Inc.
    Inventors: David P. Chengson, Edward C. Chang, Ranjeeth Doppalapudi, Santosh Kumar Pappu