Patents by Inventor Santosh Pabba

Santosh Pabba has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • STRUCTURES FOR MICRO LED LASER RELEASE
    Publication number: 20230049007
    Abstract: Micro light-emitting diodes (LED) are distanced from a mirror layer that reflects light emitted by the LEDs to increase the light extraction efficiency of the LEDs. In some embodiments, micro LEDs are electrically coupled to the mirror layer by vias positioned at an end of the LED positioned proximate to the mirror layer. In other embodiments, a conductive layer is positioned adjacent to an electrode of multiple micro LEDs and a pillar contacts the conductive layer at a location where the conductive layer is not positioned adjacent to a micro LED electrode. Vias and pillars allow the mirror height to be increased relative to structures where micro LEDs extend into a mirror layer. Increasing the mirror height can reduce the amount of destructive interference at a release layer caused by reflections of LED-emitted light by the mirror layer when the release layer is ablated via laser irradiation.
    Type: Application
    Filed: August 13, 2021
    Publication date: February 16, 2023
    Applicant: Intel Corporation
    Inventors: Khaled Ahmed, Anna M. Prakash, Ronald C. Woodbeck, Santosh Pabba
  • Package for a semiconductor die, method for making a die packaging bare die tape and method for semiconductor die packaging
    Patent number: 10483177
    Abstract: A carrier medium for a semiconductor die includes a carrier tape with at least one pocket for the die to sit in and a selectively applied non-activated adhesive on the carrier tape.
    Type: Grant
    Filed: June 30, 2017
    Date of Patent: November 19, 2019
    Assignee: Intel Corporation
    Inventors: Bassam Ziadeh, John Lofgren, Santosh Pabba, Kevin Pounds, Alin Ila
  • Package for a semiconductor die, method for making a die packaging bare die tape and method for semiconductor die packaging
    Publication number: 20190006251
    Abstract: A carrier medium for a semiconductor die includes a carrier tape with at least one pocket for the die to sit in and a selectively applied non-activated adhesive on the carrier tape.
    Type: Application
    Filed: June 30, 2017
    Publication date: January 3, 2019
    Inventors: Bassam Ziadeh, John Lofgren, Santosh Pabba, Kevin Pounds, Alin Ila
  • Metallic nanostructures self-assembly, and testing methods
    Patent number: 8132611
    Abstract: The invention provides method for metallic nanonstructures self-assembly methods and materials testing. Preferred embodiment methods permit for the formation of individual nanostructures and arrays of nanostructures. The nanostructures formed can have a metal alloy crystal structure. Example structures include slender wires, rectangular bars, or plate-like structures. Tips can be shaped, single layer and multiple layer coatings can be formed, tips can be functionalized, molecules can be adhered, and many testing methods are enabled.
    Type: Grant
    Filed: June 2, 2008
    Date of Patent: March 13, 2012
    Assignee: University of Louisville Research Foundation, Inc.
    Inventors: Robert W. Cohn, Mehdi M. Yazdanpanah, Steven A. Harfenist, Frank P. Zamborini, Mahdi Hosseini, Santosh Pabba, Vladimir Dobrokhotov, Abdelilah Safir, Brigitte H. Fasciotto
  • Metallic nanostructures self-assembly, and testing methods
    Publication number: 20090082216
    Abstract: The invention provides method for metallic nanonstructures self-assembly methods and materials testing. Preferred embodiment methods permit for the formation of individual nanonstructures and arrays of nanostructrues. The nanostructures formed can have a metal alloy crystal structure. Example structures include slender wires, rectangular bars, or plate-like structures. Tips can be shaped, single layer and multiple layer coatings can be formed, tips can be functionalized, molecules can be adhered, and many testing methods are enabled.
    Type: Application
    Filed: June 2, 2008
    Publication date: March 26, 2009
    Inventors: Robert W. Cohn, Mehdi M. Yazdanpanah, Steven A. Harfenist, Franz P. Zamborini, Mahdi Hosseini, Santosh Pabba, Vladimir Dobrokhotov, Abdelilah Safir, B.H. Fasciotto