Patents by Inventor Santy Sulaiman

Santy Sulaiman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Properties tailoring in silsesquioxanes
    Patent number: 8053514
    Abstract: Fluoride catalyzed rearrangement reactions of polymeric silsesquioxanes [RSiO1.5]n involve reacting at least one silsesquioxane material with a catalytic amount of an organic fluoride at a temperature ranging from about ?50° C. to about 120° C. thereby forming a reaction mixture for a period ranging from 60 minutes to 48 hours. To the reaction mixture, a quenching agent is added to remove fluoride from the reaction mixture. A silsesquioxane cage compound can be isolated from the reaction mixture using a precipitation or other extraction process.
    Type: Grant
    Filed: October 30, 2009
    Date of Patent: November 8, 2011
    Assignee: The Regents of the University of Michigan
    Inventors: Richard M. Laine, Santy Sulaiman
  • Properties Tailoring In Silsesquioxanes
    Publication number: 20100222503
    Abstract: Fluoride catalyzed rearrangement reactions of polymeric silsesquioxanes [RSiO1.5]n involve reacting at least one silsesquioxane material with a catalytic amount of an organic fluoride at a temperature ranging from about ?50° C. to about 120° C. thereby forming a reaction mixture for a period ranging from 60 minutes to 48 hours. To the reaction mixture, a quenching agent is added to remove fluoride from the reaction mixture. A silsesquioxane cage compound can be isolated from the reaction mixture using a precipitation or other extraction process.
    Type: Application
    Filed: October 30, 2009
    Publication date: September 2, 2010
    Inventors: Richard M. Laine, Santy Sulaiman
  • Flip chip system with organic/inorganic hybrid underfill composition
    Patent number: 7332822
    Abstract: A system for underfilling in a chip package includes an underfill mixture that ameliorates the CTE mismatch that typically exists between a packaged die and a resin-impregnated fiberglass mounting substrate. In one embodiment, the system includes an underfill mixture that comprises a principal underfill composition of a rigid octaaminophenyl silsesquioxane (OAPS) that is used as a curing agent for a tetrafunctional, low viscosity, and relatively rigid TGMX epoxy resin. An embodiment is also directed to the assembly of a flip chip package that uses the underfill mixture.
    Type: Grant
    Filed: October 4, 2005
    Date of Patent: February 19, 2008
    Assignee: Delphi Technologies, Inc.
    Inventors: Rafil Basheer, Richard M. Laine, Santy Sulaiman, Chad M. Brick, Christopher M. Desana
  • Flip chip system with organic/inorganic hybrid underfill composition
    Publication number: 20060103029
    Abstract: A system for underfilling in a chip package includes an underfill mixture that ameliorates the CTE mismatch that typically exists between a packaged die and a resin-impregnated fiberglass mounting substrate. In one embodiment, the system includes an underfill mixture that comprises a principal underfill composition of a rigid octaaminophenyl silsesquioxane (OAPS) that is used as a curing agent for a tetrafunctional, low viscosity, and relatively rigid TGMX epoxy resin. An embodiment is also directed to the assembly of a flip chip package that uses the underfill mixture.
    Type: Application
    Filed: October 4, 2005
    Publication date: May 18, 2006
    Inventors: Rafil Basheer, Richard Laine, Santy Sulaiman, Chad Brick, Christopher DeSana